公开(公告)号：US4815309A

公开(公告)日：1989-03-28

申请号：US25607

申请日：1987-03-13

Applicant: Kazuo Sawada ,  Masanobu Nishio ,  Yoshihiro Nakai

Inventor： Kazuo Sawada ,  Masanobu Nishio ,  Yoshihiro Nakai

IPC: H01B13/00 ,  C23C30/00 ,  H01B1/02 ,  H01B5/02 ,  B21C1/00 ,  B21C23/24 ,  B21F19/00

CPC classification number: H01L24/43 ,  C23C30/00 ,  H01B1/023 ,  H01L24/49 ,  H01L24/745 ,  H01L2224/4312 ,  H01L2224/4321 ,  H01L2224/43826 ,  H01L2224/43827 ,  H01L2224/43848 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45565 ,  H01L2224/45624 ,  H01L2224/45644 ,  H01L2224/45647 ,  H01L2224/48 ,  H01L2224/49 ,  H01L2224/745 ,  H01L24/45 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01018 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0106 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01204 ,  H01L2924/01205 ,  H01L2924/14 ,  H01L2924/20753 ,  Y10S72/70

Abstract: A conductor has a core wire and a surface coated with the same kind of material as the core wire material. A copper wire (1) which forms the core wire has its surface cleaned by a preparatory processing mechanism (3) and then it is fed to a continuous sputtering unit (4). The continuous sputtering unit (4) coats the surface of the core wire (1) with copper by a coaxial magnetron sputtering method. Thereafter, this wire is drawn, by cold working, into a thin wire of predetermined size.

Abstract translation: 导体具有芯线，其表面涂覆有与芯线材相同种类的材料。 形成芯线的铜线（1）的表面由预备处理机构（3）清洗，然后送入连续的溅射单元（4）。 连续溅射机构（4）通过同轴磁控溅射法将芯线（1）的表面涂覆铜。 此后，该线通过冷加工被拉制成预定尺寸的细线。

公开(公告)号：US20180098437A1

公开(公告)日：2018-04-05

申请号：US15592694

申请日：2017-05-11

Applicant: The Charles Stark Draper Laboratory, Inc.

Inventor： Caprice Gray Haley ,  Amy DuweI ,  Anthony Kopa ,  Seth Davis ,  Andrew P. Magyar ,  Brian Smith ,  Mitchell W. Meinhold ,  Sara Barron ,  Gregory Romano ,  Richard Morrison ,  Hongmei Zhang

IPC: H05K3/34 ,  H01B13/016 ,  H05K1/11 ,  H05K3/32 ,  H01R43/02 ,  H01R9/05

CPC classification number: H05K3/34 ,  G06F17/5077 ,  H01B13/016 ,  H01L23/50 ,  H01L23/552 ,  H01L23/66 ,  H01L24/43 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/745 ,  H01L25/0655 ,  H01L2223/6611 ,  H01L2224/2919 ,  H01L2224/43001 ,  H01L2224/4312 ,  H01L2224/43125 ,  H01L2224/43831 ,  H01L2224/45015 ,  H01L2224/45111 ,  H01L2224/45124 ,  H01L2224/45138 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45155 ,  H01L2224/45472 ,  H01L2224/45572 ,  H01L2224/45611 ,  H01L2224/45639 ,  H01L2224/45644 ,  H01L2224/45647 ,  H01L2224/45655 ,  H01L2224/45666 ,  H01L2224/45669 ,  H01L2224/4569 ,  H01L2224/4579 ,  H01L2224/45811 ,  H01L2224/45839 ,  H01L2224/45844 ,  H01L2224/45847 ,  H01L2224/45855 ,  H01L2224/48091 ,  H01L2224/48111 ,  H01L2224/48137 ,  H01L2224/48253 ,  H01L2224/4911 ,  H01L2224/49113 ,  H01L2224/85205 ,  H01L2224/85207 ,  H01L2224/85214 ,  H01L2224/85237 ,  H01L2224/85238 ,  H01L2224/85801 ,  H01L2224/8582 ,  H01L2224/8584 ,  H01L2224/8585 ,  H01L2224/8592 ,  H01L2924/00014 ,  H01L2924/0781 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/19107 ,  H01L2924/3025 ,  H01P11/005 ,  H01R9/0512 ,  H01R9/0515 ,  H01R12/53 ,  H01R24/50 ,  H01R43/02 ,  H01R43/0256 ,  H02G1/1265 ,  H02G1/1297 ,  H05K1/115 ,  H05K3/222 ,  H05K3/328 ,  H05K2201/10287 ,  H01L2924/07025 ,  H01L2924/20751 ,  H01L2924/2076 ,  H01L2924/069 ,  H01L2924/0675 ,  H01L2924/01004 ,  H01L2224/43848

Abstract: A method for attaching a prefabricated miniature coaxial wire to a first electrical connection point, the prefabricated miniature coaxial wire having an electrically conductive core disposed within an electrical insulation layer disposed within an electrically conductive shield layer, includes attaching an exposed portion of the electrically conductive core at a distal end of the prefabricated miniature coaxial wire to the first electrical connection point, thereby establishing electrical conductivity between the electrically conductive core and the first electrical connection point, depositing a layer of electrically insulating material onto the exposed portion of the electrically conductive core such that the exposed portion of the electrically conductive core and the first electrical connection point is encased in the layer of electrically insulating material, and connecting the electrically conductive shield layer to a second electrical connection point using a connector formed from an electrically conductive material.

公开(公告)号：US09799624B1

公开(公告)日：2017-10-24

申请号：US15239809

申请日：2016-08-17

Applicant: NANYA TECHNOLOGY CORPORATION

Inventor： Po-Chun Lin

IPC: H01L23/48 ,  H01L23/00

CPC classification number: H01L24/45 ,  H01L24/05 ,  H01L24/85 ,  H01L2224/04042 ,  H01L2224/05624 ,  H01L2224/45647 ,  H01L2224/48463 ,  H01L2224/85045

Abstract: A wire bonding method includes steps of: forming a Free Air Ball (FAB) at an end of a metal wire; pressing the FAB onto a flat surface of a workpiece to deform the FAB; contacting the deformed FAB to a metal pad, wherein the metal pad is made of a first material and the metal wire is made of a second material, and a hardness of the first material is smaller than a hardness of the second material; and bonding the deformed FAB on the metal pad.

公开(公告)号：US09437517B2

公开(公告)日：2016-09-06

申请号：US14788853

申请日：2015-07-01

Applicant: Panasonic Corporation

Inventor： Takao Ochi

IPC: H01L23/367 ,  H01L23/00 ,  H01L23/31 ,  H01L23/433 ,  H01L21/56 ,  H01L23/29 ,  H01L23/495 ,  H01L25/065 ,  H01L23/13

CPC classification number: H01L23/367 ,  H01L21/56 ,  H01L21/561 ,  H01L21/565 ,  H01L23/13 ,  H01L23/29 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/3178 ,  H01L23/4334 ,  H01L23/49517 ,  H01L23/49568 ,  H01L24/06 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/92 ,  H01L24/97 ,  H01L25/0652 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/06135 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45014 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45644 ,  H01L2224/45647 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49107 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/1531 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L24/83 ,  H01L24/85 ,  H01L2924/00 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00014

Abstract: A semiconductor apparatus is provided. The semiconductor apparatus includes: a base having a main surface on which a terminal is disposed; a first semiconductor device retained on the main surface of the base and having a top surface on which an electrode is disposed and a bottom surface facing the main surface of the base; a connection member connecting the terminal and the electrode; an encapsulant disposed on the main surface of the base and covering the terminal, the first semiconductor device and the connection member; and a heat dissipating member disposed on the encapsulant and having a space that opens in a direction extending perpendicular to the main surface of the base. The encapsulant is disposed in the space and, in a side view of the base, a peak of the connection member is located inside the space.

Abstract translation: 提供一种半导体装置。 半导体装置包括：具有设置有端子的主表面的基座; 第一半导体器件，其保持在所述基底的主表面上并且具有其上设置有电极的顶表面和面向所述基底的主表面的底表面; 连接端子和电极的连接构件; 密封剂，其设置在所述基座的主表面上并覆盖所述端子，所述第一半导体器件和所述连接构件; 以及散热构件，其设置在所述密封剂上并且具有在垂直于所述基座的主表面延伸的方向上开口的空间。 密封剂设置在空间中，并且在基部的侧视图中，连接构件的峰位于空间内。

公开(公告)号：US09287480B2

公开(公告)日：2016-03-15

申请号：US14799597

申请日：2015-07-15

Applicant: NICHIA CORPORATION

Inventor： Ryohei Yamashita ,  Ryoichi Yoshimoto

IPC: H01L33/48 ,  H01L33/62 ,  H01L33/54

CPC classification number: H01L33/62 ,  H01L23/495 ,  H01L23/49517 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49562 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L33/483 ,  H01L33/486 ,  H01L33/52 ,  H01L33/54 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29301 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29364 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45169 ,  H01L2224/45173 ,  H01L2224/45184 ,  H01L2224/45565 ,  H01L2224/45624 ,  H01L2224/45639 ,  H01L2224/45644 ,  H01L2224/45647 ,  H01L2224/45655 ,  H01L2224/45657 ,  H01L2224/4566 ,  H01L2224/45673 ,  H01L2224/4568 ,  H01L2224/45684 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/0132 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/12035 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2933/0033 ,  H01L2933/0066 ,  H01L2924/00014 ,  H01L2924/0665 ,  H01L2924/0715 ,  H01L2924/07025 ,  H01L2924/095 ,  H01L2924/0105 ,  H01L2924/01083 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/20752

Abstract: A light emitting device mount includes a positive lead terminal, a negative lead terminal, and a resin portion. Each of the positive lead terminal and the negative lead terminal includes a first main surface, a second main surface opposite to the first main surface in a thickness direction of each of the positive lead terminal and the negative lead terminal, and an end surface which is provided between the first main surface and the second main surface and which includes a first recessed surface area and a second recessed surface area. The first recessed surface area extends from the first main surface. The second recessed surface area extends from the second main surface, includes a closest point closest to the first main surface, and includes an extension part that extends outward of the closest point and toward the second main surface.

Abstract translation: 发光装置支架包括正引线端子，负引线端子和树脂部分。 正极引线端子和负极引线端子中的每一个包括第一主表面，与正极引线端子和负极引线端子的厚度方向上的第一主表面相对的第二主表面，以及端部表面 设置在第一主表面和第二主表面之间，并且包括第一凹入表面区域和第二凹入表面区域。 第一凹入表面区域从第一主表面延伸。 所述第二凹面表面区域从所述第二主表面延伸，包括最靠近所述第一主表面的最近点，并且包括延伸部分，所述延伸部分从所述最近点向外延伸并朝向所述第二主表面。

公开(公告)号：US20150318458A1

公开(公告)日：2015-11-05

申请号：US14799597

申请日：2015-07-15

Applicant: NICHIA CORPORATION

Inventor： Ryohei YAMASHITA ,  Ryoichi YOSHIMOTO

IPC: H01L33/62 ,  H01L33/48 ,  H01L33/54

CPC classification number: H01L33/62 ,  H01L23/495 ,  H01L23/49517 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49562 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L33/483 ,  H01L33/486 ,  H01L33/52 ,  H01L33/54 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29301 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29364 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45169 ,  H01L2224/45173 ,  H01L2224/45184 ,  H01L2224/45565 ,  H01L2224/45624 ,  H01L2224/45639 ,  H01L2224/45644 ,  H01L2224/45647 ,  H01L2224/45655 ,  H01L2224/45657 ,  H01L2224/4566 ,  H01L2224/45673 ,  H01L2224/4568 ,  H01L2224/45684 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/0132 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/12035 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2933/0033 ,  H01L2933/0066 ,  H01L2924/00014 ,  H01L2924/0665 ,  H01L2924/0715 ,  H01L2924/07025 ,  H01L2924/095 ,  H01L2924/0105 ,  H01L2924/01083 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/20752

Abstract: A light emitting device mount includes a positive lead terminal, a negative lead terminal, and a resin portion. Each of the positive lead terminal and the negative lead terminal includes a first main surface, a second main surface opposite to the first main surface in a thickness direction of each of the positive lead terminal and the negative lead terminal, and an end surface which is provided between the first main surface and the second main surface and which includes a first recessed surface area and a second recessed surface area. The first recessed surface area extends from the first main surface. The second recessed surface area extends from the second main surface, includes a closest point closest to the first main surface, and includes an extension part that extends outward of the closest point and toward the second main surface.

Abstract translation: 发光装置支架包括正引线端子，负引线端子和树脂部分。 正极引线端子和负极引线端子中的每一个包括第一主表面，与正极引线端子和负极引线端子的厚度方向上的第一主表面相对的第二主表面，以及端部表面 设置在第一主表面和第二主表面之间，并且包括第一凹入表面区域和第二凹入表面区域。 第一凹入表面区域从第一主表面延伸。 所述第二凹面表面区域从所述第二主表面延伸，包括最靠近所述第一主表面的最近点，并且包括延伸部分，所述延伸部分从所述最近点向外延伸并朝向所述第二主表面。

公开(公告)号：US09117806B2

公开(公告)日：2015-08-25

申请号：US14211051

申请日：2014-03-14

Applicant: NICHIA CORPORATION

Inventor： Ryohei Yamashita ,  Ryoichi Yoshimoto

IPC: H01L33/48 ,  H01L23/495 ,  H01L33/62 ,  H01L23/00

CPC classification number: H01L33/62 ,  H01L23/495 ,  H01L23/49517 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49562 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L33/483 ,  H01L33/486 ,  H01L33/52 ,  H01L33/54 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29301 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29364 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45169 ,  H01L2224/45173 ,  H01L2224/45184 ,  H01L2224/45565 ,  H01L2224/45624 ,  H01L2224/45639 ,  H01L2224/45644 ,  H01L2224/45647 ,  H01L2224/45655 ,  H01L2224/45657 ,  H01L2224/4566 ,  H01L2224/45673 ,  H01L2224/4568 ,  H01L2224/45684 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/0132 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/12035 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2933/0033 ,  H01L2933/0066 ,  H01L2924/00014 ,  H01L2924/0665 ,  H01L2924/0715 ,  H01L2924/07025 ,  H01L2924/095 ,  H01L2924/0105 ,  H01L2924/01083 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/20752

Abstract: A mount includes a terminal, and a resin portion. The terminal includes a first surface, a second surface, and an end surface having first and second recessed areas that are extend from the first and second surfaces, respectively. The resin portion is integrally formed with the terminal, and at least partially covers the end surface so that the first and second surfaces are at least partially exposed. The resin portion forms a recessed part to accommodate the light emitting device. The second recessed area includes a closest point that is positioned closest to the first surface, and an extension part that extends outward of the closest point and toward the second surface side. The extension part is formed at least on opposing end surfaces of the pair of positive and negative lead terminal. The first recessed area is arranged on the exterior side relative to the closest point.

Abstract translation: 安装件包括端子和树脂部分。 端子包括第一表面，第二表面和端面，其具有分别从第一表面和第二表面延伸的第一和第二凹陷区域。 树脂部分与端子一体地形成，并且至少部分地覆盖端面，使得第一和第二表面至少部分地露出。 树脂部分形成凹部以容纳发光器件。 第二凹陷区域包括最接近第一表面的最近点，以及从最近点向外延伸并朝向第二表面侧的延伸部分。 延伸部分至少形成在一对正和负引线端子的相对的端面上。 第一凹陷区域相对于最靠近的点布置在外侧。

公开(公告)号：US20140157592A1

公开(公告)日：2014-06-12

申请号：US14181466

申请日：2014-02-14

Applicant: Tessera, Inc.

Inventor： Cyprian Uzoh ,  Craig Mitchell

IPC: H01B13/00

CPC classification number: H01B13/0036 ,  H01L24/43 ,  H01L24/45 ,  H01L2224/43 ,  H01L2224/43848 ,  H01L2224/45015 ,  H01L2224/45105 ,  H01L2224/45109 ,  H01L2224/45111 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45155 ,  H01L2224/45157 ,  H01L2224/4516 ,  H01L2224/45163 ,  H01L2224/4518 ,  H01L2224/45184 ,  H01L2224/45565 ,  H01L2224/45572 ,  H01L2224/45573 ,  H01L2224/45605 ,  H01L2224/45609 ,  H01L2224/45611 ,  H01L2224/45644 ,  H01L2224/45647 ,  H01L2224/45655 ,  H01L2224/45657 ,  H01L2224/4568 ,  H01L2224/45686 ,  H01L2224/45693 ,  H01L2224/45887 ,  H01L2224/45893 ,  H01L2224/48 ,  H01L2224/85207 ,  H01L2924/01015 ,  H01L2924/10253 ,  Y10T29/49117 ,  H01L2924/01074 ,  H01L2924/00014 ,  H01L2924/0132 ,  H01L2924/00 ,  H01L2924/013 ,  H01L2924/04642 ,  H01L2924/0503 ,  H01L2924/01005 ,  H01L2924/01006

Abstract: A wire structure, which may be configured for a semiconductor device, is disclosed. The wire may include an elongate flexible core formed of a conductor material and a cladding layer covering an outer surface of the core. The cladding layer may be a conductor. In various aspects the cladding layer and core have a different grain sizes. An average grain size of the core material may several orders of magnitude greater than an average grain size of the cladding layer material. The cladding layer may be an alloy having a varying concentration of a minor component across its thickness. Methods of forming a wire structure are also disclosed.

Abstract translation: 公开了一种可被配置用于半导体器件的导线结构。 线可以包括由导体材料形成的细长柔性芯和覆盖芯的外表面的覆层。 包层可以是导体。 在各个方面，包覆层和芯具有不同的晶粒尺寸。 芯材的平均晶粒尺寸可以比包覆层材料的平均晶粒尺寸大几个数量级。 包覆层可以是在其厚度上具有不同浓度的次要组分的合金。 还公开了形成线结构的方法。

公开(公告)号：US20130171470A1

公开(公告)日：2013-07-04

申请号：US13495800

申请日：2012-06-13

Applicant: Jun-Der LEE ,  Hsing-Hua TSAI ,  Tung-Han CHUANG

Inventor： Jun-Der LEE ,  Hsing-Hua TSAI ,  Tung-Han CHUANG

IPC: B32B15/01 ,  C22C5/06 ,  C22F1/14 ,  B32B15/02

CPC classification number: B32B15/018 ,  C22C5/06 ,  C22F1/14 ,  H01L24/43 ,  H01L24/45 ,  H01L2224/43 ,  H01L2224/43848 ,  H01L2224/43986 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45565 ,  H01L2224/45644 ,  H01L2224/45664 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01015 ,  H01L2924/01047 ,  H01L2924/12041 ,  Y10T428/12431 ,  Y10T428/12438 ,  Y10T428/12868 ,  Y10T428/12875 ,  Y10T428/12889 ,  Y10T428/12896 ,  H01L2924/01079 ,  H01L2924/01046 ,  H01L2924/2075 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/0132 ,  H01L2924/00015 ,  H01L2924/013 ,  H01L2924/00 ,  H01L2224/45669 ,  H01L2224/45647 ,  H01L2924/01204 ,  H01L2224/48 ,  H01L2924/00013 ,  H01L2224/4321 ,  H01L2924/01049 ,  H01L2924/01006 ,  H01L2924/01045 ,  H01L2924/01004 ,  H01L2924/01005

Abstract: An alloy wire made of a material selected from one of a group consisting of a silver-gold alloy, a silver-palladium alloy and a silver-gold-palladium alloy is provided. The alloy wire is with a polycrystalline structure of a face-centered cubic lattice and includes a plurality of grains. A central part of the alloy wire includes slender grains or equi-axial grains, and the other parts of the alloy wire consist of equi-axial grains. A quantity of the grains having annealing twins was 20 percent or more of the total quantity of the grains of the alloy wire.

Abstract translation: 提供由选自银 - 金合金，银 - 钯合金和银 - 钯 - 钯合金之一的材料制成的合金丝。 合金线具有面心立方晶格的多晶结构，并且包括多个晶粒。 合金线的中心部分包​​括细长晶粒或等轴晶粒，合金线的其他部分由等轴晶粒组成。 一定数量的具有退火双晶的晶粒是合金丝的晶粒总量的20％以上。

公开(公告)号：US08242594B2

公开(公告)日：2012-08-14

申请号：US12542154

申请日：2009-08-17

Applicant: Chung-Pan Wu

Inventor： Chung-Pan Wu

IPC: H01L23/34 ,  H01L23/48 ,  H01L21/44

CPC classification number: H01L24/48 ,  H01L24/45 ,  H01L24/85 ,  H01L2224/05644 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45572 ,  H01L2224/45573 ,  H01L2224/45644 ,  H01L2224/45647 ,  H01L2224/45655 ,  H01L2224/45664 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48464 ,  H01L2224/48475 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/48992 ,  H01L2224/48997 ,  H01L2224/85051 ,  H01L2224/85205 ,  H01L2224/85444 ,  H01L2224/85447 ,  H01L2224/85455 ,  H01L2224/8585 ,  H01L2224/8592 ,  H01L2924/00015 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A chip package structure includes a circuit substrate, a chip, at least one bonding wire, and an adhesive layer. The circuit substrate has a bonding surface and at least one pad disposed on the bonding surface. The chip is disposed on the bonding surface of the circuit substrate and has an active surface away from the circuit substrate and at least one contact pad disposed on the active surface. The bonding wire is connected between the contact pad and the pad, such that the chip is electrically connected to the circuit substrate through the bonding wire. The bonding wire includes a copper layer, a nickel layer covering the copper layer, and a gold layer covering the nickel layer. The adhesive layer is disposed between the pad and the bonding wire and between the contact pad and the bonding wire and respectively covers two terminals of the bonding wire.

Abstract translation: 芯片封装结构包括电路基板，芯片，至少一个接合线和粘合剂层。 电路基板具有接合表面和设置在接合表面上的至少一个焊盘。 芯片设置在电路基板的接合表面上，并且具有远离电路基板的有源表面和设置在有源表面上的至少一个接触焊盘。 接合线连接在接触焊盘和焊盘之间，使得芯片通过接合线电连接到电路基板。 接合线包括铜层，覆盖铜层的镍层和覆盖镍层的金层。 粘合层设置在焊盘和接合线之间以及接触焊盘和接合线之间，并分别覆盖接合线的两个端子。