Abstract:
One aspect relates to a layered structure with a substrate, a first layer over the substrate, and a second layer over the first layer. The substrate and the second layer are an electrically conductive material and the first layer is an insulating material or the substrate and the second layer are insulating material and the first layer is electrically conductive material. At least one of the first and second layers includes an electrically conductive polymer.
Abstract:
A wire structure, which may be configured for a semiconductor device, is disclosed. The wire may include an elongate flexible core formed of a conductor material and a cladding layer covering an outer surface of the core. The cladding layer may be a conductor. In various aspects the cladding layer and core have different grain sizes. An average grain size of the core material may be several orders of magnitude greater than an average grain size of the cladding layer material. The cladding layer may be an alloy having a varying concentration of a minor component across its thickness. Methods of forming a wire structure are also disclosed.
Abstract:
Methods of measuring, adjusting and uniformalizing a sectional area ratio of a metal-covered electric wire, a method of cleaning an electric wire, a method of manufacturing a metal-covered electric wire, an apparatus for measuring a sectional area ratio of a metal-covered electric wire, and an apparatus for electropolishing a metal-covered electric wire.Electric resistance values of first and second materials are previously stored respectively so that a sectional area ratio of a metal-covered electric wire is calculated on the basis of the as-stored values and an actually measured electric resistance value of the metal-covered electric wire. Measurement and uniformalization of a sectional area ratio of a metal-covered electric wire and cleaning of an electric wire are carried out by dissolving surface layer parts of the electric wires by electropolishing.
Abstract:
Disclosed herein is a wire for an Nb.sub.3 X superconducting wire, which is improved in workability and soundness of a diffusion barrier layer without increasing the diffusion barrier layer in thickness. This wire for an Nb.sub.3 X superconducting wire comprises a wire which is prepared by superposing and winding up a first sheet consisting of pure Nb or an Nb alloy and a second sheet consisting of metal atoms X, reacting with Nb for forming a compound exhibiting superconductivity, or an X alloy, a stabilizing material layer which is provided to enclose the wire, and a diffusion barrier layer which is provided between an outer surface of the wire and an inner surface of the stabilizing material layer for preventing the metal atoms X from being diffused in the stabilizing material layer, and the diffusion barrier layer is made of a metal material having larger tensile strength than that of the first sheet. It is possible to obtain a high-performance Nb.sub.3 X superconducting wire having a high critical current density and a large residual resistance ratio of the stabilizing material, by heat treating this wire.
Abstract:
Disclosed herein is a method of preparing an oxide superconducting wire comprising the steps of coating a powder material for forming an oxide superconductor with a metal, performing deformation processing on the metal-coated powder material thereby obtaining a tape-type wire material, superposing a plurality of such tape-type wire materials, performing first heat treatment on the plurality of superposed tape-type wire materials while simultaneously diffusion-bonding the metallic coats to each other, then performing deformation processing on the plurality of superposed tape-type wire materials, and performing second heat treatment on the plurality of deformation-processed tape-type wire materials. Preferably the oxide superconductor to be obtained is a bismuth oxide superconductor having a 2223 composition in a composition of Bi-Sr-Ca-Cu or (Bi,Pb)-Sr-Ca-Cu, and the powder material consists of a superconducting phase, which is mainly composed of a 2212 phase, and non-superconducting phases.
Abstract:
In a method of preparing an oxide superconducting wire comprising the steps of filling up raw material powder for an oxide superconductor in a metal sheath and rolling the same in this state, frictional force on surfaces of rolls employed for rolling is increased in the rolling step in order to improve denseness of the raw material powder, thereby improving the critical current density of the oxide superconducting wire. In order to increase the frictional force, films having large frictional force are formed on the roll surfaces, a coating material is applied to the roll surfaces during rolling, or the roll surfaces are roughened, for example.
Abstract:
A process and apparatus for continuously transforming a flat metal strip into an elongated pipe, in which the strip is fed through a forming tool along a curved forming path wherein the longitudinal edge portions are progressively turned up into cross-sectionally arcuate portions leaving between a substantially cross-sectionally rectilinear section, the width of which progressively decreases during travel of the strip through the forming tool. The curved forming path in the tool is such that it has a radius of curvature R(z) in its longitudinal direction, the arcuate portions each having a radius r.sub.o and the decreasing width of said rectilinear section being 2x(z) (wherein z is the distance of travel through the tool). The radius of curvature R(z) is controlled in sole dependence on r.sub.o and the differential quotient x'(z). In the resulting elongated tube, relative differences in travel distance between arbitrary areas in a transverse cross-section of the strip forming the pipe are substantially completely eliminated without plastic deformation in the longitudinal direction.
Abstract:
Copper-clad steel wire is produced by forming a copper tube around the wire, and drawing down the copper tube and wire to reduce the cross-section of the wire by at least 30%. The wire is annealed, slowly cooled and the cross-section further reduced by at least 10%.
Abstract:
A CORE-FORMING WIRE, TO BE COVERED WITH METAL, IS CONTINUOUSLY DRAWN FIRST THROUGH A CIRCUMFERENTIAL MILLING DEVICE FOR SKIN REMOVAL AND THEN THROUGH AN AXIALLY OPERATING SHAVING AND PROTECTIVE DIE TO PROVIDE A VIRGIN SURFACE. FROM THE SHAVING DIE IT MOVES IN UNCONTAMINATED CONDITION INTO A BATH FOR APPLYING A METAL COVER OR SHEATH TO ITS SURFACE BY ELECTROPLATING, HOT-DIPPING, TINNING OR THE LIKE. THE CORE IS IN COVERED CONDITION AFTER LEAVING THE BATH AND AFTER SOLIDIFICATION OF THE SHEATHING MATERIAL IS PASSED THROUGH SUITABLE FINISHING MEANS. THE ELECTROPLATING, HOT-DIPPING OR TINNING OF CONTINUOUS LENGTHS OF CORE-FORMING METAL FOR FORMING A DIFFERENT METALLIC COATING OR SHEATH THEREON REQUIRES THAT THE CORE SURFACES BE VERY CLEAN. THIS IS PARTICULARLY TRUE IN THE CASE OF ALUMINUM WIRE REQUIRED TO BE ELECTROPLATED WITH COPPER, FOR ALUMINUM IS EXTREMELEY PRONE TO RAPID REOXIDATION IN AIR AFTER OXIDE REMOVAL. SUCH OXIDE ACTS AS A CONTAMINANT INTERFERING WITH APPLICATION OF A STAISFACTORY METAL COVERING. THUS THE INVENTION IS PARTICULARLY USEFUL FOR IMPROVEDLY ELECTROPLATING A COPPER SHEATH ON AN ALUMINUM CORE WIRE BUT IT IS ALSO USEFUL FOR OTHER COMBINATIONS OF CORE AND COVERING METALS EMPLOYING HOT-DIPPING, TINNING OR THE LIKE.
Abstract:
A small diameter magnetic film plated wire for memory devices is constructed utilizing an inner core selected from the group consisting of tungsten and molybdenum. In a preferred embodiment of the magnetic film plated wire, a tungsten core is successively overlaid with a gold strike layer, a rapidly deposited relatively thick copper conductive layer, a slowly deposited smooth copper layer, a gold layer and a circumferentially oriented magnetic nickel-iron film.