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    Friction-joining structure
    6.
    发明授权
    Friction-joining structure 有权
    摩擦接合结构

    公开(公告)号：US08492004B2

    公开(公告)日：2013-07-23

    申请号：US13313646

    申请日：2011-12-07

    申请人： Atsushi Watanabe ,  Atsushi Tomimoto

    发明人： Atsushi Watanabe ,  Atsushi Tomimoto

    IPC分类号： B32B15/00 ,  B32B15/04 ,  B32B15/18 ,  B32B7/02

    CPC分类号： F16B5/02 ,  F16B2/005 ,  F16B43/00 ,  Y10T428/12201 ,  Y10T428/12347 ,  Y10T428/12361 ,  Y10T428/12451 ,  Y10T428/12965 ,  Y10T428/24942 ,  Y10T428/24983

    摘要： The invention provides a friction joining structure comprising steel products, a friction joining steel plate inserted there between, and a fastening device, which are mutually friction joined by a compressive force derived from the fastening device. A portion of projected streaks on the friction joining steel plate is designed to have a Vickers hardness at least 3 times greater than the surface of the steel products, which allows the projected streaks to more easily enter the steel products thereby increasing the friction coefficient between the steel products. The friction joining structure is constituted by a slip resistance mechanism which can be easily validated from a theoretical or an experimental point of view and is also small in variance of the friction coefficient. Therefore, a friction coefficient used in design can be set at a high value with high accuracy to realize a rational design.

    摘要翻译： 本发明提供了一种摩擦接合结构，其包括钢制品，插入其间的摩擦接合钢板和紧固装置，其通过来自紧固装置的压缩力相互摩擦接合。 摩擦接合钢板上的一部分突出条纹被设计成维氏硬度比钢制品的表面至少大3倍，这允许突出的条纹更容易地进入钢产品，从而增加了摩擦接合钢板之间的摩擦系数 钢铁产品。 摩擦接合结构由滑动阻力机构构成，其可以从理论或实验的观点容易地进行验证，摩擦系数的变化也小。 因此，设计中使用的摩擦系数可以高精度地设定为高值，从而实现合理的设计。

    SURFACE-TREATED COPPER FOIL, METHOD FOR PRODUCING SAME, AND COPPER CLAD LAMINATED BOARD
    9.
    发明申请
    SURFACE-TREATED COPPER FOIL, METHOD FOR PRODUCING SAME, AND COPPER CLAD LAMINATED BOARD 有权
    表面处理铜箔，其生产方法和铜层压板

    公开(公告)号：US20130040162A1

    公开(公告)日：2013-02-14

    申请号：US13574478

    申请日：2011-01-21

    申请人： Satoshi Fujisawa ,  Takeo Uno ,  Koichi Hattori

    发明人： Satoshi Fujisawa ,  Takeo Uno ,  Koichi Hattori

    IPC分类号： B32B15/08 ,  B32B37/14 ,  B05D7/14 ,  B05D5/00 ,  B32B15/04 ,  B32B33/00

    CPC分类号： C25D5/34 ,  B32B15/01 ,  B32B15/08 ,  B32B2457/00 ,  C22C19/002 ,  C22C19/03 ,  C25D3/562 ,  C25D5/48 ,  H05K3/384 ,  H05K2201/0154 ,  Y10T156/10 ,  Y10T428/12438 ,  Y10T428/12451 ,  Y10T428/12472 ,  Y10T428/12535 ,  Y10T428/12556 ,  Y10T428/12792 ,  Y10T428/12882 ,  Y10T428/1291

    摘要： Provided is an industrially excellent surface-treated copper foil which satisfies requirements for adhesiveness to an insulating resin such as polyimide, heat-resistant adhesiveness, chemical resistance and soft etching properties. Also provided is a method for producing a surface-treated copper foil which achieves a high adhesion strength between an insulating resin and the copper foil, shows high chemical resistance in circuit formation and sustains good soft etching properties after forming vias by laser-processing. A base copper foil is subjected to a roughening treatment to give a surface roughness (Rz) of 1.1 μm or below. On the roughened surface, an Ni—Zn alloy layer is formed. The aforesaid roughening treatment is conducted in such a manner that the roughened surface comprises sharp-pointed convexes, which have a width of 0.3-0.8 μm, a height of 0.6-1.8 μm and an aspect ratio of 1.2-3.5, and the surface roughness (Rz) of said base copper foil is increased by 0.05-0.3 μm. The aforesaid Ni—Zn alloy layer has a Zn content of 6-30 wt % and a Zn deposition amount of 0.08 mg/dm2 or more.

    摘要翻译： 提供了一种工业上优异的表面处理铜箔，其满足对聚酰亚胺等绝缘树脂的粘合性，耐热粘合性，耐化学性和软蚀刻性能。 还提供了一种在绝缘树脂和铜箔之间实现高粘合强度的表面处理铜箔的制造方法，在电路形成中表现出高的耐化学性，并且在通过激光加工形成通孔之后保持良好的软蚀刻性能。 对基底铜箔进行粗糙化处理，得到表面粗糙度（Rz）为1.1μm以下。 在粗糙化表面上形成Ni-Zn合金层。 上述粗糙化处理是这样进行的：粗糙表面包括宽度为0.3-0.8μm，高度为0.6-1.8μm，纵横比为1.2-3.5的尖锐凸面，表面粗糙度 所述基底铜箔的（Rz）增加0.05-0.3μm。 上述Ni-Zn合金层的Zn含量为6-30重量％，Zn沉积量为0.08mg / dm 2以上。