Thermal interface material assemblies, and related methods
    5.
    发明授权
    Thermal interface material assemblies, and related methods 有权
    热界面材料组件及相关方法

    公开(公告)号:US08647752B2

    公开(公告)日:2014-02-11

    申请号:US12816735

    申请日:2010-06-16

    IPC分类号: B32B1/00 B05D1/36

    摘要: A thermal interface material (TIM) assembly is provided for use in conducting heat away from heat generating components. The TIM assembly generally includes a substrate, a metal alloy coupled to at least one side surface of the substrate, and a coating material covering at least part of the substrate and at least part of the metal alloy. The substrate may include a metal foil, a heat dissipating unit, a heat generating component, etc. The metal alloy may include a low melting metal alloy coupled to the substrate to form multiple bumps along the substrate in a pattern. The pattern may be generic such that the TIM assembly may be used with multiple different heat generating components to effectively conduct heat away from the multiple different heat generating components, or it may correspond to particular locations on a heat generating component away from which heat is to be conducted.

    摘要翻译: 提供热界面材料(TIM)组件,用于将热量从发热部件传导出去。 TIM组件通常包括基底,耦合到基底的至少一个侧表面的金属合金以及覆盖至少部分基底和至少部分金属合金的涂层材料。 衬底可以包括金属箔,散热单元,发热组件等。金属合金可以包括耦合到衬底的低熔点金属合金,以沿着衬底形成多个凸起。 该图案可以是通用的,使得TIM组件可以与多个不同的发热部件一起使用以有效地将热量从多个不同的发热部件传导出去,或者它可以对应于发热部件上的特定位置,远离热量 进行。