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公开(公告)号：USD729961S1
公开(公告)日：2015-05-19
申请号：US29458934
申请日：2013-06-24
Applicant: Yung-Cheng Sung , Chung-Pan Wu , Tzyy-Jang Tseng
Designer： Yung-Cheng Sung , Chung-Pan Wu , Tzyy-Jang Tseng
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Patent Agency Ranking
公开(公告)号：US08529091B2
公开(公告)日：2013-09-10
申请号：US13495974
申请日：2012-06-13
Applicant: Yung-Cheng Sung , Chung-Pan Wu
Inventor： Yung-Cheng Sung , Chung-Pan Wu
IPC: F21S8/02
CPC classification number: F21V29/70 , F21S2/005 , F21S8/026 , F21V19/045 , F21V23/008 , F21V29/75 , F21V29/89 , F21W2131/40 , F21Y2105/10 , F21Y2113/00 , F21Y2115/10
Abstract: A T-bar lamp including a T-bar lamp housing and at least a light engine module is provided. The T-bar lamp housing has an opening. The light engine module is fixed in the T-BAR lamp housing, and the light engine module at least includes a chip on board (COB) type LED light source.
Abstract translation: 提供了包括T形灯壳体和至少一个光引擎模块的T形灯。 T型灯壳体具有开口。 光引擎模块固定在T-BAR灯壳体中，光引擎模块至少包括板上芯片（COB）型LED光源。
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3.发明授权Chip package structure and manufacturing method thereof for effectively lowering manufacturing costs and improving yield and reliability of the chip package structure 有权芯片封装结构及其制造方法，用于有效降低制造成本并提高芯片封装结构的产量和可靠性公开(公告)号：US08242594B2
公开(公告)日：2012-08-14
申请号：US12542154
申请日：2009-08-17
Applicant: Chung-Pan Wu
Inventor： Chung-Pan Wu
CPC classification number: H01L24/48 , H01L24/45 , H01L24/85 , H01L2224/05644 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/45572 , H01L2224/45573 , H01L2224/45644 , H01L2224/45647 , H01L2224/45655 , H01L2224/45664 , H01L2224/48091 , H01L2224/48227 , H01L2224/48464 , H01L2224/48475 , H01L2224/48599 , H01L2224/48699 , H01L2224/48992 , H01L2224/48997 , H01L2224/85051 , H01L2224/85205 , H01L2224/85444 , H01L2224/85447 , H01L2224/85455 , H01L2224/8585 , H01L2224/8592 , H01L2924/00015 , H01L2924/01013 , H01L2924/01019 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/0105 , H01L2924/01074 , H01L2924/01079 , H01L2924/01322 , H01L2924/181 , H01L2924/00014 , H01L2224/78 , H01L2924/00 , H01L2924/00012
Abstract: A chip package structure includes a circuit substrate, a chip, at least one bonding wire, and an adhesive layer. The circuit substrate has a bonding surface and at least one pad disposed on the bonding surface. The chip is disposed on the bonding surface of the circuit substrate and has an active surface away from the circuit substrate and at least one contact pad disposed on the active surface. The bonding wire is connected between the contact pad and the pad, such that the chip is electrically connected to the circuit substrate through the bonding wire. The bonding wire includes a copper layer, a nickel layer covering the copper layer, and a gold layer covering the nickel layer. The adhesive layer is disposed between the pad and the bonding wire and between the contact pad and the bonding wire and respectively covers two terminals of the bonding wire.
Abstract translation: 芯片封装结构包括电路基板，芯片，至少一个接合线和粘合剂层。 电路基板具有接合表面和设置在接合表面上的至少一个焊盘。 芯片设置在电路基板的接合表面上，并且具有远离电路基板的有源表面和设置在有源表面上的至少一个接触焊盘。 接合线连接在接触焊盘和焊盘之间，使得芯片通过接合线电连接到电路基板。 接合线包括铜层，覆盖铜层的镍层和覆盖镍层的金层。 粘合层设置在焊盘和接合线之间以及接触焊盘和接合线之间，并分别覆盖接合线的两个端子。
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公开(公告)号：US20100264534A1
公开(公告)日：2010-10-21
申请号：US12542154
申请日：2009-08-17
Applicant: Chung-Pan Wu
Inventor： Chung-Pan Wu
IPC: H01L23/49 , H01L21/607
CPC classification number: H01L24/48 , H01L24/45 , H01L24/85 , H01L2224/05644 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/45572 , H01L2224/45573 , H01L2224/45644 , H01L2224/45647 , H01L2224/45655 , H01L2224/45664 , H01L2224/48091 , H01L2224/48227 , H01L2224/48464 , H01L2224/48475 , H01L2224/48599 , H01L2224/48699 , H01L2224/48992 , H01L2224/48997 , H01L2224/85051 , H01L2224/85205 , H01L2224/85444 , H01L2224/85447 , H01L2224/85455 , H01L2224/8585 , H01L2224/8592 , H01L2924/00015 , H01L2924/01013 , H01L2924/01019 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/0105 , H01L2924/01074 , H01L2924/01079 , H01L2924/01322 , H01L2924/181 , H01L2924/00014 , H01L2224/78 , H01L2924/00 , H01L2924/00012
Abstract: A chip package structure includes a circuit substrate, a chip, at least one bonding wire, and an adhesive layer. The circuit substrate has a bonding surface and at least one pad disposed on the bonding surface. The chip is disposed on the bonding surface of the circuit substrate and has an active surface away from the circuit substrate and at least one contact pad disposed on the active surface. The bonding wire is connected between the contact pad and the pad, such that the chip is electrically connected to the circuit substrate through the bonding wire. The bonding wire includes a copper layer, a nickel layer covering the copper layer, and a gold layer covering the nickel layer. The adhesive layer is disposed between the pad and the bonding wire and between the contact pad and the bonding wire and respectively covers two terminals of the bonding wire.
Abstract translation: 芯片封装结构包括电路基板，芯片，至少一个接合线和粘合剂层。 电路基板具有接合表面和设置在接合表面上的至少一个焊盘。 芯片设置在电路基板的接合表面上，并且具有远离电路基板的有源表面和设置在有源表面上的至少一个接触焊盘。 接合线连接在接触焊盘和焊盘之间，使得芯片通过接合线电连接到电路基板。 接合线包括铜层，覆盖铜层的镍层和覆盖镍层的金层。 粘合剂层设置在焊盘和接合线之间以及接触焊盘和接合线之间，并分别覆盖接合线的两个端子。
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公开(公告)号：US20140071656A1
公开(公告)日：2014-03-13
申请号：US13742350
申请日：2013-01-16
Applicant: Tzyy-Jang Tseng , Cheng-Yi Wang , Yung-Cheng Sung , Chung-Pan Wu
Inventor： Tzyy-Jang Tseng , Cheng-Yi Wang , Yung-Cheng Sung , Chung-Pan Wu
IPC: F21V21/00
CPC classification number: F21V21/00 , F21K9/232 , F21Y2107/20 , F21Y2107/30 , F21Y2107/40 , F21Y2115/10
Abstract: A light source module includes a base plate, a projection, and a plurality of light-emitting devices. The projection is disposed on the base plate. The light-emitting devices surround the projection and are disposed on the projection.
Abstract translation: 光源模块包括基板，突起和多个发光器件。 突起设置在基板上。 发光装置围绕突起并设置在突起上。
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公开(公告)号：US20130016513A1
公开(公告)日：2013-01-17
申请号：US13495974
申请日：2012-06-13
Applicant: Yung-Cheng Sung , Chung-Pan Wu
Inventor： Yung-Cheng Sung , Chung-Pan Wu
CPC classification number: F21V29/70 , F21S2/005 , F21S8/026 , F21V19/045 , F21V23/008 , F21V29/75 , F21V29/89 , F21W2131/40 , F21Y2105/10 , F21Y2113/00 , F21Y2115/10
Abstract: A T-bar lamp including a T-bar lamp housing and at least a light engine module is provided. The T-bar lamp housing has an opening. The light engine module is fixed in the T-BAR lamp housing, and the light engine module at least includes a chip on board (COB) type LED light source.
Abstract translation: 提供了包括T形灯壳体和至少一个光引擎模块的T形灯。 T型灯壳体具有开口。 光引擎模块固定在T-BAR灯壳体中，光引擎模块至少包括板上芯片（COB）型LED光源。
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