Patent search cpc:"H01L2224/456" Page 10

91.

发明授权
Thermally enhanced electronic package 有权
Title translation: 热增强电子封装

公开(公告)号：US08564954B2

公开(公告)日：2013-10-22

申请号：US12948964

申请日：2010-11-18

Applicant: Tzu Hsin Huang , Yu Ting Yang , Hung Hsin Liu , An Hong Liu , Geng Shin Shen , Wei David Wang , Shih Fu Lee

Inventor： Tzu Hsin Huang , Yu Ting Yang , Hung Hsin Liu , An Hong Liu , Geng Shin Shen , Wei David Wang , Shih Fu Lee

IPC: H05K7/20 , F28F7/00

CPC classification number: H05K7/205 , B82B1/005 , B82Y10/00 , B82Y30/00 , H01L23/13 , H01L23/3128 , H01L23/49816 , H01L23/525 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/73 , H01L25/0657 , H01L2224/05001 , H01L2224/05008 , H01L2224/05022 , H01L2224/05569 , H01L2224/05572 , H01L2224/16145 , H01L2224/16225 , H01L2224/16227 , H01L2224/29101 , H01L2224/2919 , H01L2224/29393 , H01L2224/32145 , H01L2224/32225 , H01L2224/456 , H01L2224/48091 , H01L2224/48227 , H01L2224/4824 , H01L2224/48465 , H01L2224/48471 , H01L2224/73204 , H01L2224/73215 , H01L2224/73265 , H01L2224/8592 , H01L2224/92147 , H01L2224/92247 , H01L2225/0651 , H01L2225/06541 , H01L2225/06565 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01077 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/10253 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H05K5/0213 , Y10S977/932 , H01L2924/00014 , H01L2924/00 , H01L2924/00012 , H01L2224/05647 , H01L2224/05124 , H01L2224/05147

Abstract: A thermally enhanced electronic package comprises a driver chip, an insulator, a flexible carrier, and carbon nanocapsules. The flexible carrier includes a flexible substrate, a wiring layer formed on the substrate, and a resistant overlaying the wiring layer. The driver chip is connected to the wiring layer. The insulator is filled in the gap between the driver chip and the flexible carrier. The carbon nanocapsules are disposed on the driver chip, on the resistant, on the flexible carrier, or in the insulator to enhance heat dissipation of electronic packages.

Abstract translation: 热增强型电子封装包括驱动器芯片，绝缘体，柔性载体和碳纳米胶囊。柔性载体包括柔性基板，形成在基板上的布线层和覆盖布线层的电阻。驱动器芯片连接到布线层。绝缘体填充在驱动器芯片和柔性载体之间的间隙中。碳纳米胶囊设置在驱动芯片上，电阻上，柔性载体上或绝缘体中，以增强电子封装的散热。

92.

发明授权
Thermally enhanced electronic package utilizing carbon nanocapsules and method of manufacturing the same 有权
Title translation: 使用碳纳米胶囊的热增强电子封装及其制造方法

公开(公告)号：US08338935B2

公开(公告)日：2012-12-25

申请号：US13116278

申请日：2011-05-26

Applicant: An Hong Liu , David Wei Wang

Inventor： An Hong Liu , David Wei Wang

IPC: H01L23/22 , H01L21/00 , H05K7/00

CPC classification number: H05K7/205 , B82B1/005 , B82Y10/00 , B82Y30/00 , H01L23/13 , H01L23/3128 , H01L23/49816 , H01L23/525 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/73 , H01L25/0657 , H01L2224/05001 , H01L2224/05008 , H01L2224/05022 , H01L2224/05569 , H01L2224/05572 , H01L2224/16145 , H01L2224/16225 , H01L2224/16227 , H01L2224/29101 , H01L2224/2919 , H01L2224/29393 , H01L2224/32145 , H01L2224/32225 , H01L2224/456 , H01L2224/48091 , H01L2224/48227 , H01L2224/4824 , H01L2224/48465 , H01L2224/48471 , H01L2224/73204 , H01L2224/73215 , H01L2224/73265 , H01L2224/8592 , H01L2224/92147 , H01L2224/92247 , H01L2225/0651 , H01L2225/06541 , H01L2225/06565 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01077 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/10253 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H05K5/0213 , Y10S977/932 , H01L2924/00014 , H01L2924/00 , H01L2924/00012 , H01L2224/05647 , H01L2224/05124 , H01L2224/05147

Abstract: A thermally enhanced electronic package comprises a chip, a substrate, an adhesive, and an encapsulation. The adhesive or the encapsulation is mixed with carbon nanocapsules. The substrate includes an insulation layer and a wiring layer formed on the substrate. The adhesive covers the chip and the substrate. The chip is electrically connected to the wiring layer. The encapsulation covers the chip and the substrate.

Abstract translation: 热增强型电子封装包括芯片，衬底，粘合剂和封装。将粘合剂或包封与碳纳米胶囊混合。基板包括绝缘层和形成在基板上的布线层。粘合剂覆盖芯片和基板。芯片电连接到布线层。封装覆盖芯片和基板。

93.

发明授权
Semiconductor die package and method for making the same 有权
Title translation: 半导体管芯封装及其制造方法

公开(公告)号：US08183088B2

公开(公告)日：2012-05-22

申请号：US12823411

申请日：2010-06-25

Applicant: Oseob Jeon , Yoonhwa Choi , Boon Huan Gooi , Maria Cristina B. Estacio , Rajeev Joshi , Chung-Lin Wu , Venkat Iyer , Byoung-Ok Lee

Inventor： Oseob Jeon , Yoonhwa Choi , Boon Huan Gooi , Maria Cristina B. Estacio , Rajeev Joshi , Chung-Lin Wu , Venkat Iyer , Byoung-Ok Lee

IPC: H01L21/00

CPC classification number: H01L24/29 , H01L21/561 , H01L23/3121 , H01L23/4951 , H01L23/49558 , H01L23/49562 , H01L23/49575 , H01L23/49861 , H01L24/32 , H01L24/36 , H01L24/40 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/83 , H01L24/97 , H01L25/0655 , H01L2223/54406 , H01L2223/54486 , H01L2224/16 , H01L2224/291 , H01L2224/29111 , H01L2224/2919 , H01L2224/2929 , H01L2224/29299 , H01L2224/293 , H01L2224/32057 , H01L2224/32225 , H01L2224/40245 , H01L2224/45015 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/45169 , H01L2224/45565 , H01L2224/456 , H01L2224/45644 , H01L2224/45669 , H01L2224/48091 , H01L2224/48137 , H01L2224/48227 , H01L2224/48237 , H01L2224/48247 , H01L2224/48257 , H01L2224/48465 , H01L2224/49113 , H01L2224/4943 , H01L2224/73204 , H01L2224/73265 , H01L2224/83192 , H01L2224/83385 , H01L2224/83801 , H01L2224/8385 , H01L2224/85013 , H01L2224/97 , H01L2924/00013 , H01L2924/00014 , H01L2924/0132 , H01L2924/014 , H01L2924/07802 , H01L2924/12042 , H01L2924/1305 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/15747 , H01L2924/181 , H01L2924/1815 , H01L2924/19043 , H01L2924/30107 , H01L2224/85 , H01L2924/00 , H01L2924/0105 , H01L2924/01082 , H01L2924/00012 , H01L2224/13111 , H01L2924/0665 , H01L2224/29099 , H01L2224/29199 , H01L2224/37099

Abstract: Semiconductor die packages are disclosed. An exemplary semiconductor die package includes a premolded substrate. The premolded substrate can have a semiconductor die attached to it, and an encapsulating material may be disposed over the semiconductor die.

Abstract translation: 公开了半导体管芯封装。示例性半导体管芯封装包括预成型衬底。预成型基板可以具有附接到其上的半导体管芯，并且封装材料可以设置在半导体管芯上方。

94.

发明授权
Die package including substrate with molded device 有权
Title translation: 模具包装，包括具有模制装置的基材

公开(公告)号：US08106406B2

公开(公告)日：2012-01-31

申请号：US11971556

申请日：2008-01-09

Applicant: Yong Liu , Zhongfa Yuan

Inventor： Yong Liu , Zhongfa Yuan

IPC: H01L27/15 , H01L31/12 , H01L33/00

CPC classification number: H01L23/49861 , H01L23/49575 , H01L24/45 , H01L24/48 , H01L25/167 , H01L33/483 , H01L33/60 , H01L2224/05553 , H01L2224/45144 , H01L2224/45147 , H01L2224/45565 , H01L2224/456 , H01L2224/48091 , H01L2224/48247 , H01L2924/01046 , H01L2924/01079 , H01L2924/12041 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01L2924/3011 , H01L2924/00014 , H01L2924/01108 , H01L2924/00 , H01L2924/00012

Abstract: A package is disclosed. The package includes a premolded substrate having a leadframe structure, a first device attached to the leadframe structure, and a molding material covering at least part of the leadframe structure and the first device. It also includes a second device attached to the premolded substrate.

Abstract translation: 公开了一个包装。该封装包括具有引线框结构的预成型基板，附接到引线框架结构的第一器件和覆盖引线框结构和第一器件的至少一部分的成型材料。它还包括连接到预成型基板的第二装置。

95.

发明授权
Semiconductor device bonding wire and wire bonding method 有权
Title translation: 半导体器件接合线和引线接合方法

公开(公告)号：US08102061B2

公开(公告)日：2012-01-24

申请号：US12670253

申请日：2008-07-24

Applicant: Tomohiro Uno , Keiichi Kimura , Shinichi Terashima , Takashi Yamada , Akihito Nishibayashi

Inventor： Tomohiro Uno , Keiichi Kimura , Shinichi Terashima , Takashi Yamada , Akihito Nishibayashi

IPC: H01L29/40 , H01L21/44

CPC classification number: H01L24/85 , H01L24/05 , H01L24/43 , H01L24/45 , H01L24/48 , H01L2224/04042 , H01L2224/05624 , H01L2224/4312 , H01L2224/4321 , H01L2224/43825 , H01L2224/43847 , H01L2224/43848 , H01L2224/43986 , H01L2224/45015 , H01L2224/45144 , H01L2224/45147 , H01L2224/45565 , H01L2224/45572 , H01L2224/456 , H01L2224/45639 , H01L2224/45644 , H01L2224/45655 , H01L2224/45664 , H01L2224/45669 , H01L2224/45671 , H01L2224/45673 , H01L2224/4568 , H01L2224/45684 , H01L2224/48011 , H01L2224/48227 , H01L2224/48247 , H01L2224/4845 , H01L2224/48463 , H01L2224/48472 , H01L2224/48624 , H01L2224/48639 , H01L2224/48644 , H01L2224/48664 , H01L2224/48724 , H01L2224/48824 , H01L2224/48839 , H01L2224/48844 , H01L2224/48864 , H01L2224/78251 , H01L2224/78301 , H01L2224/85045 , H01L2224/85048 , H01L2224/85065 , H01L2224/85075 , H01L2224/85203 , H01L2224/85205 , H01L2224/85207 , H01L2224/85439 , H01L2224/85444 , H01L2224/85464 , H01L2224/859 , H01L2924/00011 , H01L2924/00015 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01007 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01018 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/0104 , H01L2924/01042 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01058 , H01L2924/01074 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01083 , H01L2924/01105 , H01L2924/01204 , H01L2924/01327 , H01L2924/014 , H01L2924/10253 , H01L2924/12041 , H01L2924/15747 , H01L2924/20105 , H01L2924/20106 , H01L2924/20107 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2924/20756 , H01L2924/20757 , H01L2924/20758 , H01L2924/20759 , H01L2924/3025 , H01L2924/3861 , H01L2924/01001 , H01L2924/01203 , H01L2924/01034 , H01L2924/01081 , H01L2924/20645 , H01L2924/20652 , H01L2924/20653 , H01L2924/00014 , H01L2924/20108 , H01L2224/45657 , H01L2224/45666 , H01L2924/01008 , H01L2924/20109 , H01L2924/2011 , H01L2924/20111 , H01L2924/2076 , H01L2924/2065 , H01L2924/20651 , H01L2924/20654 , H01L2924/00 , H01L2224/45124 , H01L2924/013 , H01L2924/20751 , H01L2924/2075 , H01L2924/00013 , H01L2924/01049

Abstract: It is an object of the present invention to provide a copper-based bonding wire whose material cost is low, having excellent ball bondability, reliability in a heat cycle test or reflow test, and storage life, enabling an application to thinning of a wire used for fine pitch connection. The bonding wire includes a core material having copper as a main component and an outer layer which is provided on the core material and contains a metal M and copper, in which the metal M differs from the core material in one or both of components and composition. The outer layer is 0.021 to 0.12 μm in thickness.

Abstract translation: 本发明的目的是提供一种铜基接合线，其材料成本低，具有优异的球接合性，热循环试验或回流试验的可靠性以及储存寿命，使得能够使用的线材变薄用于细间距连接。接合线包括具有铜作为主要成分的芯材和设置在芯材上并且包含金属M和铜的外层，其中金属M与芯材料在组分和组成中的一种或两种中不同。外层的厚度为0.021〜0.12μm。

96.

发明申请
THERMALLY ENHANCED ELECTRONIC PACKAGE 有权
Title translation: 热增强型电子封装

公开(公告)号：US20110304991A1

公开(公告)日：2011-12-15

申请号：US12948964

申请日：2010-11-18

Applicant: TZU HSIN HUANG , YU TING YANG , HUNG HSIN LIU , AN HONG LIU , GENG SHIN SHEN , DAVID WEI WANG , SHIH FU LEE

Inventor： TZU HSIN HUANG , YU TING YANG , HUNG HSIN LIU , AN HONG LIU , GENG SHIN SHEN , DAVID WEI WANG , SHIH FU LEE

IPC: H05K7/20 , H05K1/00 , B82Y30/00

CPC classification number: H05K7/205 , B82B1/005 , B82Y10/00 , B82Y30/00 , H01L23/13 , H01L23/3128 , H01L23/49816 , H01L23/525 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/73 , H01L25/0657 , H01L2224/05001 , H01L2224/05008 , H01L2224/05022 , H01L2224/05569 , H01L2224/05572 , H01L2224/16145 , H01L2224/16225 , H01L2224/16227 , H01L2224/29101 , H01L2224/2919 , H01L2224/29393 , H01L2224/32145 , H01L2224/32225 , H01L2224/456 , H01L2224/48091 , H01L2224/48227 , H01L2224/4824 , H01L2224/48465 , H01L2224/48471 , H01L2224/73204 , H01L2224/73215 , H01L2224/73265 , H01L2224/8592 , H01L2224/92147 , H01L2224/92247 , H01L2225/0651 , H01L2225/06541 , H01L2225/06565 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01077 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/10253 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H05K5/0213 , Y10S977/932 , H01L2924/00014 , H01L2924/00 , H01L2924/00012 , H01L2224/05647 , H01L2224/05124 , H01L2224/05147

Abstract: A thermally enhanced electronic package comprises a driver chip, an insulator, a flexible carrier, and carbon nanocapsules. The flexible carrier includes a flexible substrate, a wiring layer formed on the substrate, and a resistant overlaying the wiring layer. The driver chip is connected to the wiring layer. The insulator is filled in the gap between the driver chip and the flexible carrier. The carbon nanocapsules are disposed on the driver chip, on the resistant, on the flexible carrier, or in the insulator to enhance heat dissipation of electronic packages.

Abstract translation: 热增强型电子封装包括驱动器芯片，绝缘体，柔性载体和碳纳米胶囊。柔性载体包括柔性基板，形成在基板上的布线层和覆盖布线层的电阻。驱动器芯片连接到布线层。绝缘体填充在驱动器芯片和柔性载体之间的间隙中。碳纳米胶囊设置在驱动芯片上，电阻上，柔性载体上或绝缘体中，以增强电子封装的散热。

97.

发明授权
Bonding wire for semiconductor device 有权
Title translation: 半导体器件用接合线

公开(公告)号：US07952028B2

公开(公告)日：2011-05-31

申请号：US12747434

申请日：2009-01-20

Applicant: Tomohiro Uno , Keiichi Kimura , Takashi Yamada

Inventor： Tomohiro Uno , Keiichi Kimura , Takashi Yamada

IPC: H01R4/62

CPC classification number: C22C5/02 , B21C37/047 , B23K35/0261 , B23K35/0272 , B23K35/24 , B23K35/30 , B23K35/3006 , B23K35/3013 , B23K35/302 , C22C9/00 , C22F1/08 , C22F1/14 , H01L24/43 , H01L24/45 , H01L24/48 , H01L24/85 , H01L2224/05624 , H01L2224/4312 , H01L2224/4321 , H01L2224/43825 , H01L2224/43848 , H01L2224/43986 , H01L2224/45014 , H01L2224/45015 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/45164 , H01L2224/45169 , H01L2224/45173 , H01L2224/45176 , H01L2224/45565 , H01L2224/45572 , H01L2224/456 , H01L2224/45639 , H01L2224/45644 , H01L2224/45664 , H01L2224/45669 , H01L2224/45673 , H01L2224/45676 , H01L2224/48011 , H01L2224/48227 , H01L2224/48247 , H01L2224/48471 , H01L2224/48479 , H01L2224/4848 , H01L2224/4849 , H01L2224/4851 , H01L2224/48511 , H01L2224/48624 , H01L2224/48639 , H01L2224/48644 , H01L2224/48839 , H01L2224/48844 , H01L2224/85045 , H01L2224/85065 , H01L2224/85075 , H01L2224/85186 , H01L2224/85203 , H01L2224/85207 , H01L2224/85439 , H01L2224/85444 , H01L2225/06562 , H01L2924/00015 , H01L2924/01005 , H01L2924/01006 , H01L2924/01007 , H01L2924/01014 , H01L2924/01015 , H01L2924/01018 , H01L2924/0102 , H01L2924/01022 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/0104 , H01L2924/01044 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01083 , H01L2924/01327 , H01L2924/10253 , H01L2924/12041 , H01L2924/14 , H01L2924/15311 , H01L2924/15747 , H01L2924/20752 , H01L2924/3025 , H01L2924/01004 , H01L2924/01203 , H01L2224/45655 , H01L2224/45657 , H01L2224/45671 , H01L2224/45666 , H01L2924/01204 , H01L2924/01202 , H01L2224/48465 , H01L2924/20751 , H01L2924/01001 , H01L2924/20655 , H01L2924/20652 , H01L2924/20653 , H01L2924/20654 , H01L2924/20656 , H01L2924/00 , H01L2224/48824 , H01L2924/00014 , H01L2924/013 , H01L2924/20753 , H01L2924/20755 , H01L2924/20756 , H01L2924/20757 , H01L2924/20758 , H01L2924/20759 , H01L2924/2076 , H01L2924/20105 , H01L2924/20106 , H01L2924/20107 , H01L2924/2075 , H01L2924/20754

Abstract: A high-performance bonding wire that is suitable for semiconductor mounting technology, such as stacked chip bonding, thinning, and fine pitch mounting, where wire lean (leaning) at an upright position of a ball and spring failure can be suppressed and loop linearity and loop height stability are excellent. This bonding wire for a semiconductor device includes a core material made of a conductive metal, and a skin layer formed on the core material and containing a metal different from the core material as a main component; wherein a relationship between an average size (a) of crystal grains in the skin layer on a wire surface along a wire circumferential direction and an average size (b) of crystal grains in the core material on a normal cross section, the normal cross section being a cross section normal to a wire axis, satisfies an inequality of a/b≦0.7.

Abstract translation: 适用于半球安装技术的高性能接合线，例如堆叠芯片接合，变薄和细间距安装，其中可以抑制在球和弹簧故障的直立位置处的钢丝倾斜（倾斜）并且循环线性和回路高度稳定性非常好。这种半导体器件用接合线包括由导电性金属构成的芯材以及形成在芯材上并含有以芯材为主要成分的金属的表层，其中，沿着线周向的线表面上的表层中的晶粒的平均尺寸（a）与正常截面上的芯材中的晶粒的平均尺寸（b）之间的关系，正交截面作为与线轴垂直的横截面，满足a / b＆nlE的不等式; 0.7。

98.

发明申请
SEMICONDUCTOR DIE PACKAGE INCLUDING LEADFRAME WITH DIE ATTACH PAD WITH FOLDED EDGE 审中-公开
Title translation: 半导体封装包括带有折叠边的DIE连接垫的导线

公开(公告)号：US20110008935A1

公开(公告)日：2011-01-13

申请号：US12888290

申请日：2010-09-22

Applicant: Ruben Madrid

Inventor： Ruben Madrid

IPC: H01L23/528 , H01L23/538

CPC classification number: H01L23/49562 , H01L23/4952 , H01L23/49565 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/97 , H01L2224/0603 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/4554 , H01L2224/456 , H01L2224/48095 , H01L2224/4813 , H01L2224/48247 , H01L2224/48472 , H01L2224/4903 , H01L2224/49051 , H01L2224/49113 , H01L2924/01005 , H01L2924/01013 , H01L2924/01014 , H01L2924/01024 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/1305 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/3025 , H01L2924/00014 , H01L2924/00 , H01L2924/00012

Abstract: A semiconductor die package is disclosed. The semiconductor die package comprises a leadframe structure with a die attach pad including a die attach surface, a folded edge structure and an opposite surface opposite to the die attach surface. A plurality of leads extending laterally away from the die attach pad. A semiconductor die comprising a first surface and a second surface is attached to the semiconductor die, and a molding material is around at least a portion of the leadframe structure and at least a portion of the semiconductor die. The opposite surface is exposed through the molding material and terminal ends of the leads do not extend past lateral edges of the molding material.

Abstract translation: 公开了一种半导体管芯封装。半导体管芯封装包括具有管芯附接焊盘的引线框结构，管芯附接焊盘包括管芯附接表面，折叠边缘结构和与管芯附接表面相对的相对表面。多个引线从芯片附接垫横向延伸。包括第一表面和第二表面的半导体管芯被附接到半导体管芯，并且模制材料围绕引线框架结构的至少一部分和半导体管芯的至少一部分。相反的表面通过模制材料暴露，引线的末端不会延伸穿过模制材料的侧边缘。