公开(公告)号：US12105567B2

公开(公告)日：2024-10-01

申请号：US17839756

申请日：2022-06-14

申请人： Inventec (Pudong) Technology Corporation ,  INVENTEC CORPORATION

发明人： Xuefeng Chen ,  Pin-Yi Xiang ,  Lisheng Wang ,  Yi-Dong Ji ,  Yanhua Shi ,  Yang Ying ,  Xiaowei Zhang

IPC分类号： F28F7/00 ,  G06F1/20

CPC分类号： G06F1/20

摘要： This disclosure relates to a liquid cooling assembly that includes a base, a cover, a first connector, and a second connector. The cover is disposed on the base. The cover and the base together form an accommodation space therebetween. The cover has an inlet and an outlet respectively located at two opposite sides of the cover in a direction parallel to a longitudinal direction of the cover. The first connector is disposed to the inlet of the cover. The second connector is disposed to the outlet of the cover.

公开(公告)号：US11974411B2

公开(公告)日：2024-04-30

申请号：US17418924

申请日：2020-01-17

申请人： Ke Chin Lee

发明人： Ke Chin Lee

IPC分类号： F28F7/00 ,  H05K7/20

CPC分类号： H05K7/20218

摘要： The present invention is related to a thin heat dissipation device and a method for manufacturing the same. The device of the present invention mainly comprises a hollow body having an enclosed chamber and a working fluid with which the enclosed chamber is filled. The enclosed chamber comprises a first fluid channel and a second fluid channel. The first and second fluid channels extend in the longitudinal direction of the hollow body, are juxtaposed in the width direction of the hollow body and communicated with each other, and an interface between the first fluid channel and the second fluid channel has a height of about 0.1 mm or less. As such, a novel capillary structure which is capable of greatly reducing the entire thickness, enhancing heat transfer efficiency and reducing cost and which is reliable and durable is provided.

公开(公告)号：US11825629B2

公开(公告)日：2023-11-21

申请号：US17475405

申请日：2021-09-15

申请人： Cooler Master Co., Ltd.

发明人： Ting-jui Chang

IPC分类号： F28F7/00 ,  H05K7/20 ,  H05K1/02

CPC分类号： H05K7/20272 ,  H05K1/0203 ,  H05K7/2039 ,  H05K2201/10159

摘要： A liquid cooling heat exchange apparatus for memory modules comprising a thermal conduction assembly, fastening assembly, and first and second working fluid splitters is provided. The thermal conduction assembly, mounted on the memory nodules via the fastening assembly, comprises a pair of flat flexible conduits, each having at least one fluid passageway communicating with the first and second working fluid splitters, and a pair of cooling spreaders. The pair of flat flexible conduits is in thermal contact with heat producing chips of the memory modules, thermally coupling the first and second working fluid splitters together for transferring heat from the heat producing chips. The pair of cooling spreaders is in thermal contact with the pair of flat flexible conduits for transferring heat from the heat producing chips to the thermal conduction assembly. Each of the at least one fluid passageway is expandable.

公开(公告)号：US20230304742A1

公开(公告)日：2023-09-28

申请号：US18021702

申请日：2021-09-29

申请人： ZEHNDER GROUP INTERNATIONAL AG

发明人： Christian HIRSCH

IPC分类号： F28D7/00 ,  F28F7/00

CPC分类号： F28D7/0025 ,  F28F7/00 ,  F28F2210/08

摘要： a plurality of first flow ducts and a plurality of second flow ducts adjacent to the plurality of first flow ducts for exchanging heat energy between first flows passing through the plurality of first flow ducts and second flows passing through the plurality of second flow ducts; • a parallel flow region where flow passages and directions of the first flows of the plurality of first flow ducts and adjacent flow passages and directions of the second flows of the plurality of second flow ducts are arranged in locally or tangentially parallel relationship with respect to each other at least in a portion of the parallel flow region and are fluidly separated by wall portions from each other; • wherein a cross section of the wall portions of the parallel flow region orthogonal to a local flow passage direction of the parallel flow region is a grid-like pattern.

公开(公告)号：US11765864B2

公开(公告)日：2023-09-19

申请号：US16995487

申请日：2020-08-17

申请人： OVH

发明人： Ali Chehade ,  Hadrien Bauduin ,  Henryk Klaba

IPC分类号： F28F7/00 ,  H05K7/20

CPC分类号： H05K7/20627 ,  H05K7/2079 ,  H05K7/20263 ,  H05K7/20554 ,  H05K7/20736 ,  H05K7/20781

摘要： A cooling arrangement for a rack hosting electronic equipment and at least one fan comprises first and second air-liquid heat exchangers. A first one is mounted to the rack so that heated air expelled from the rack by the fan flows therethrough. The second one is mounted to the first one so that air having flowed through the first heat exchanger flows through the second heat exchanger. Each heat exchanger comprises a frame, an inlet receiving liquid from a cold supply line, an outlet returning liquid to a hot return line, and a continuous internal conduit forming a plurality of interconnected parallel sections. The cooling arrangement is mounted to the rack so that the first and second frames are parallel and adjacent. One interconnected parallel section of the first heat exchanger nearest to its inlet is proximate one interconnected parallel section of the second heat exchanger nearest to its outlet.

公开(公告)号：US11672103B2

公开(公告)日：2023-06-06

申请号：US16811817

申请日：2020-03-06

申请人： QUALCOMM Incorporated

发明人： Shankar Gopalakrishna ,  Saju Cheeran Verghese Francis ,  Vivekananda Avvaru

IPC分类号： F28F7/00 ,  H05K7/20 ,  H05K5/02

CPC分类号： H05K7/20509 ,  H05K5/0217

摘要： An electronics enclosure can be a line replaceable unit for installation in a chassis having actively cooled cold plates. The electronics enclosure has a housing, heat spreaders, and moveable heat spreaders. The electronics enclosure can be positioned in the chassis with the moveable heat spreaders close to the housing and thereafter the moveable heat spreaders can be moved away from the housing to press against the cold plates. Heat from electronics within the electronics enclosure can pass from the housing, through the heat spreaders, through the moveable heat spreaders, and into the cold plates.

公开(公告)号：US11668497B2

公开(公告)日：2023-06-06

申请号：US17699789

申请日：2022-03-21

申请人： THE TRUSTEES OF COLUMBIA UNIVERSITY IN THE CITY OF NEW YORK

发明人： Nanfang Yu ,  Jyotirmoy Mandal ,  Adam Overvig ,  Norman Nan Shi ,  Meng Tian

IPC分类号： F28F7/00 ,  F25B23/00 ,  F24S70/225 ,  F24S70/30 ,  F24S70/60 ,  B32B27/18 ,  B32B27/28 ,  B32B33/00 ,  F24S10/40

CPC分类号： F25B23/003 ,  B32B27/18 ,  B32B27/283 ,  B32B33/00 ,  F24S70/225 ,  F24S70/30 ,  F24S70/60 ,  B32B2305/18 ,  B32B2305/30 ,  B32B2307/30 ,  B32B2307/416 ,  B32B2311/24 ,  B32B2333/12 ,  B32B2383/00 ,  B32B2386/00 ,  F24S10/40 ,  F28F2245/06 ,  Y02E10/44

摘要： Systems and methods for radiative cooling and heating are provided. For example, systems for radiative cooling can include a top layer including one or more polymers, where the top layer has high emissivity in at least a portion of the thermal spectrum and an electromagnetic extinction coefficient of approximately zero, absorptivity of approximately zero, and high transmittance in at least a portion of the solar spectrum, and further include a reflective layer including one or more metals, where the reflective layer has high reflectivity in at least a portion of the solar spectrum.

公开(公告)号：US11602076B2

公开(公告)日：2023-03-07

申请号：US16775395

申请日：2020-01-29

申请人： Cooler Master Co., Ltd.

发明人： Tung-Yang Shieh

IPC分类号： F28F7/00 ,  H05K7/20 ,  G06F1/20

摘要： The disclosure provides a liquid-cooling heat dissipation device. The liquid-cooling heat dissipation device is configured to be in thermal contact with an expansion card. The liquid-cooling heat dissipation device includes a base plate, a thermally-conductive component and a heat exchanger. The base plate is configured to be mounted on the expansion card. The thermally-conductive component is mounted on the base plate. The thermally-conductive component and the base plate together form a liquid chamber therebetween. The heat exchanger is mounted on the base plate and connected to the liquid chamber.

公开(公告)号：US11291139B2

公开(公告)日：2022-03-29

申请号：US17010440

申请日：2020-09-02

申请人： Carbice Corporation

发明人： Baratunde Cola ,  Leonardo Prinzi ,  Craig Green

IPC分类号： F28F7/00 ,  H05K7/20 ,  H01L23/373 ,  H01L23/42 ,  C01B32/16 ,  C23C14/06

摘要： Multilayered or multitiered structures formed by stacking of vertically aligned carbon nanotube (CNT) arrays and methods of making and using thereof are described herein. Such multilayered or multitiered structures can be used as thermal interface materials (TIMs).

公开(公告)号：US11022379B2

公开(公告)日：2021-06-01

申请号：US16372292

申请日：2019-04-01

申请人： Thermal Corp.

发明人： David Sarraf ,  John Hartenstine ,  Jerome Toth ,  Scott Garner

IPC分类号： F28F7/00 ,  F28D15/04 ,  F28D15/02 ,  H01L23/427 ,  F28F1/00 ,  F28F1/24 ,  F28F21/08 ,  F28F21/02

摘要： Heat sinks having a mounting surface with a coefficient of thermal expansion matching that of silicon are disclosed. Heat pipes having layered composite or integral composite low coefficient of expansion heat sinks are disclosed that can be mounted directly to silicon semiconductor devices.