公开(公告)号：US11022379B2

公开(公告)日：2021-06-01

申请号：US16372292

申请日：2019-04-01

申请人： Thermal Corp.

发明人： David Sarraf ,  John Hartenstine ,  Jerome Toth ,  Scott Garner

IPC分类号： F28F7/00 ,  F28D15/04 ,  F28D15/02 ,  H01L23/427 ,  F28F1/00 ,  F28F1/24 ,  F28F21/08 ,  F28F21/02

摘要： Heat sinks having a mounting surface with a coefficient of thermal expansion matching that of silicon are disclosed. Heat pipes having layered composite or integral composite low coefficient of expansion heat sinks are disclosed that can be mounted directly to silicon semiconductor devices.

公开(公告)号：US10247486B2

公开(公告)日：2019-04-02

申请号：US15448949

申请日：2017-03-03

申请人： Thermal Corp.

发明人： David Sarraf ,  John Hartenstine ,  Jerome Toth ,  Scott Garner

IPC分类号： F28D15/02 ,  F28D15/04 ,  H01L23/427 ,  F28F1/00 ,  F28F1/24 ,  F28F21/08 ,  F28F21/02

摘要： Heat sinks having a mounting surface with a coefficient of thermal expansion matching that of silicon are disclosed. Heat pipes having layered composite or integral composite low coefficient of expansion heat sinks are disclosed that can be mounted directly to silicon semiconductor devices.