公开(公告)号：US11218632B2

公开(公告)日：2022-01-04

申请号：US16671905

申请日：2019-11-01

申请人： QUALCOMM Incorporated

发明人： Shankar Gopalakrishna ,  Saju Cheeran Verghese Francis ,  Praveensingh Rajput

IPC分类号： H04N7/18 ,  H04N5/232 ,  H04N5/225

摘要： A mobile device includes a camera module that can alternate between a retracted state and an extended state. In the retracted state, the camera module is retracted into a recess in a housing of the mobile device. In the extended state, the camera module extends from the housing. While in the extended state, one or more cameras of the camera module capture images. A processor of the mobile device stitches the images into a panoramic image that optionally provides a 360 degree view. While in the extended state, the camera module may optionally rotate or fold.

公开(公告)号：US11672103B2

公开(公告)日：2023-06-06

申请号：US16811817

申请日：2020-03-06

申请人： QUALCOMM Incorporated

发明人： Shankar Gopalakrishna ,  Saju Cheeran Verghese Francis ,  Vivekananda Avvaru

IPC分类号： F28F7/00 ,  H05K7/20 ,  H05K5/02

CPC分类号： H05K7/20509 ,  H05K5/0217

摘要： An electronics enclosure can be a line replaceable unit for installation in a chassis having actively cooled cold plates. The electronics enclosure has a housing, heat spreaders, and moveable heat spreaders. The electronics enclosure can be positioned in the chassis with the moveable heat spreaders close to the housing and thereafter the moveable heat spreaders can be moved away from the housing to press against the cold plates. Heat from electronics within the electronics enclosure can pass from the housing, through the heat spreaders, through the moveable heat spreaders, and into the cold plates.