公开(公告)号：US20170179070A1

公开(公告)日：2017-06-22

申请号：US14974823

申请日：2015-12-18

申请人： Donglai David Lu ,  Jimin Yao ,  Amrita Mallik ,  George S. Kostiew ,  Shawna M. Liff

发明人： Donglai David Lu ,  Jimin Yao ,  Amrita Mallik ,  George S. Kostiew ,  Shawna M. Liff

IPC分类号： H01L23/00

CPC分类号： H01L24/81 ,  H01L24/13 ,  H01L24/75 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/7501 ,  H01L2224/75101 ,  H01L2224/7525 ,  H01L2224/753 ,  H01L2224/75901 ,  H01L2224/7592 ,  H01L2224/75981 ,  H01L2224/81013 ,  H01L2224/81193 ,  H01L2224/81203 ,  H01L2224/81801 ,  H01L2924/00015 ,  H01L2924/01001 ,  H01L2924/01002 ,  H01L2924/01007 ,  H01L2924/0101 ,  H01L2924/01018 ,  H01L2924/01036 ,  H01L2924/01054 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2224/81011 ,  H01L2224/81024 ,  H01L2924/014

摘要： Described herein are devices and techniques for thermocompression bonding. A device can include a housing, a platform, and a plasma jet. The housing can define a chamber. The platform can be located within the chamber and can be proximate a thermocompression chip bonder. The plasma jet can be located proximate the platform. The plasma jet can be movable about the platform. The plasma jet can include a nozzle arranged to direct a plasma gas onto the platform. Also described are other embodiments for thermocompression bonding.

公开(公告)号：US09478518B2

公开(公告)日：2016-10-25

申请号：US13637781

申请日：2011-02-23

申请人： Viorel Dragoi ,  Markus Wimplinger

发明人： Viorel Dragoi ,  Markus Wimplinger

IPC分类号： H01L21/44 ,  H01L23/00 ,  H01L25/065 ,  H01L25/00

CPC分类号： H01L24/03 ,  H01L24/29 ,  H01L24/83 ,  H01L24/94 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/03015 ,  H01L2224/0311 ,  H01L2224/0355 ,  H01L2224/03848 ,  H01L2224/29 ,  H01L2224/29111 ,  H01L2224/29124 ,  H01L2224/29144 ,  H01L2224/29147 ,  H01L2224/29298 ,  H01L2224/83801 ,  H01L2224/8383 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/0101 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/0102 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01058 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/0133 ,  H01L2924/14 ,  H01L2924/01014 ,  H01L2924/00014 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/2929 ,  H01L2924/00

摘要： A process for the production of a permanent, electrically conductive connection between a first metal surface of a first substrate and a second metal surface of a second substrate, wherein a permanent, electrically conductive connection is produced, at least primarily, by substitution diffusion between metal ions and/or metal atoms of the two metal surfaces.

摘要翻译： 一种用于在第一基底的第一金属表面和第二基底的第二金属表面之间生产永久导电连接的方法，其中永久导电连接至少主要由金属之间的置换扩散 两个金属表面的离子和/或金属原子。

公开(公告)号：US20140224409A1

公开(公告)日：2014-08-14

申请号：US14163037

申请日：2014-01-24

申请人： International Rectifier Corporation

发明人： Henning M. Hauenstein

IPC分类号： B32B37/10 ,  H01L21/64

CPC分类号： B32B37/10 ,  B22F3/15 ,  B22F2003/153 ,  H01L21/64 ,  H01L23/3735 ,  H01L23/5385 ,  H01L24/75 ,  H01L24/83 ,  H01L24/97 ,  H01L2224/291 ,  H01L2224/29294 ,  H01L2224/29339 ,  H01L2224/32145 ,  H01L2224/32227 ,  H01L2224/32245 ,  H01L2224/7511 ,  H01L2224/753 ,  H01L2224/75304 ,  H01L2224/75314 ,  H01L2224/7598 ,  H01L2224/83055 ,  H01L2224/83075 ,  H01L2224/83085 ,  H01L2224/83091 ,  H01L2224/83203 ,  H01L2224/83208 ,  H01L2224/83209 ,  H01L2224/8384 ,  H01L2224/97 ,  H01L2924/01322 ,  H01L2924/10253 ,  H01L2924/1033 ,  H01L2924/1203 ,  H01L2924/1304 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13064 ,  H01L2924/13091 ,  H01L2924/15747 ,  H01L2924/15787 ,  H01L2924/3512 ,  H01L2924/00014 ,  H01L2924/05432 ,  H01L2924/05032 ,  H01L2924/05042 ,  H01L2924/01002 ,  H01L2924/0101 ,  H01L2924/01018 ,  H01L2924/01036 ,  H01L2924/01054 ,  H01L2924/01086 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/83 ,  H01L2924/01007

摘要： In an exemplary implementation, a system for producing an electrical module includes a pressure chamber configured to receive a first body, a second body, and a sinter material therebetween. The system further includes a pressure generator configured to apply non-mechanical pressure in the pressure chamber to form the electrical module by attaching the first body to the second body using the sinter material. The pressure chamber is configured to enclose the first body over the second body. Furthermore, the pressure chamber includes a bottom opening configured to receive at least the first body. The non-mechanical pressure can include gas pressure.

摘要翻译： 在示例性实施方案中，用于生产电气模块的系统包括压力室，其被配置为在其间容纳第一主体，第二主体和烧结材料。 该系统还包括压力发生器，该压力发生器被配置为在压力室中施加非机械压力，以通过使用烧结材料将第一主体附接到第二主体来形成电气模块。 压力室被配置为将第一主体封闭在第二主体上。 此外，压力室包括构造成容纳至少第一主体的底部开口。 非机械压力可以包括气体压力。

公开(公告)号：US08609472B2

公开(公告)日：2013-12-17

申请号：US13116063

申请日：2011-05-26

申请人： Tammy Cheng ,  Mark Dobrzelewski ,  Daniel Solomon ,  Christopher Windiate

发明人： Tammy Cheng ,  Mark Dobrzelewski ,  Daniel Solomon ,  Christopher Windiate

IPC分类号： H01L21/56 ,  H01L23/29

CPC分类号： H01L23/3128 ,  H01L21/565 ,  H01L23/3121 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L2224/0401 ,  H01L2224/06136 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29386 ,  H01L2224/32014 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/73204 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/83194 ,  H01L2224/8385 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/0101 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01054 ,  H01L2924/0106 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/05442 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A process for fabricating an electronic component includes a liquid injection molding method for overmolding a semiconductor device. The liquid injection molding method includes: i) placing the semiconductor device in an open mold, ii) closing the mold to form a mold cavity, iii) heating the mold cavity, iv) injection molding a curable liquid into the mold cavity to overmold the semiconductor device, v) opening the mold and removing the product of step iv), and optionally vi) post-curing the product of step v). The semiconductor device may have an integrated circuit attached to a substrate through a die attach adhesive.

摘要翻译： 一种用于制造电子部件的方法包括用于二次模制半导体器件的液体注射成型方法。 液体注射成型方法包括：i）将半导体器件放置在打开的模具中，ii）闭合模具以形成模具腔，iii）加热模腔，iv）将可固化液体注射到模具腔中以包覆模制 半导体器件，v）打开模具并除去步骤iv）的产物，并且任选地vi）后处理步骤v）的产物。 半导体器件可以具有通过管芯附接粘合剂附接到衬底的集成电路。

公开(公告)号：US08436354B2

公开(公告)日：2013-05-07

申请号：US13232011

申请日：2011-09-14

申请人： Tomoyuki Aoki ,  Takuya Tsurume

发明人： Tomoyuki Aoki ,  Takuya Tsurume

IPC分类号： H01L29/04 ,  H01L31/20 ,  H01L21/331 ,  H01L21/336

CPC分类号： H01Q7/00 ,  G02F1/133305 ,  G02F1/1362 ,  G02F2001/13613 ,  H01L24/97 ,  H01L2224/16225 ,  H01L2224/97 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/0101 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01041 ,  H01L2924/01042 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01051 ,  H01L2924/01056 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/0106 ,  H01L2924/01067 ,  H01L2924/01068 ,  H01L2924/01072 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01076 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07811 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/12044 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30107 ,  H01L2924/3025 ,  H01Q1/38 ,  H05K3/207 ,  H05K3/28 ,  H05K2203/016 ,  H05K2203/0531 ,  H01L2224/81 ,  H01L2924/00

摘要： It is an object of the present invention to provide a method for forming a layer having functionality including a conductive layer and a colored layer and a flexible substrate having a layer having functionality with a high yield. Further, it is an object of the present invention to provide a method for manufacturing a semiconductor device that is small-sized, thin, and lightweight. After coating a substrate having heat resistance with a silane coupling agent, a layer having functionality is formed. Then, after attaching an adhesive to the layer having functionality, the layer having functionality is peeled from the substrate. Further, after coating a substrate having heat resistance with a silane coupling agent, a layer having functionality is formed. Then, an adhesive is attached to the layer having functionality. Thereafter, the layer having functionality is peeled from the substrate, and a flexible substrate is attached to the layer having functionality.

公开(公告)号：US20130040451A1

公开(公告)日：2013-02-14

申请号：US13637781

申请日：2011-02-23

申请人： Viorel Dragoi ,  Markus Wimplinger

发明人： Viorel Dragoi ,  Markus Wimplinger

IPC分类号： H01L21/28

CPC分类号： H01L24/03 ,  H01L24/29 ,  H01L24/83 ,  H01L24/94 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/03015 ,  H01L2224/0311 ,  H01L2224/0355 ,  H01L2224/03848 ,  H01L2224/29 ,  H01L2224/29111 ,  H01L2224/29124 ,  H01L2224/29144 ,  H01L2224/29147 ,  H01L2224/29298 ,  H01L2224/83801 ,  H01L2224/8383 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/0101 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/0102 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01058 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/0133 ,  H01L2924/14 ,  H01L2924/01014 ,  H01L2924/00014 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/2929 ,  H01L2924/00

摘要： A process for the production of a permanent, electrically conductive connection between a first metal surface of a first substrate and a second metal surface of a second substrate, wherein a permanent, electrically conductive connection is produced, at least primarily, by substitution diffusion between metal ions and/or metal atoms of the two metal surfaces.

摘要翻译： 一种用于在第一基底的第一金属表面和第二基底的第二金属表面之间生产永久导电连接的方法，其中永久导电连接至少主要由金属之间的置换扩散 两个金属表面的离子和/或金属原子。

公开(公告)号：US08373249B2

公开(公告)日：2013-02-12

申请号：US13012599

申请日：2011-01-24

申请人： Sion C. Quinlan ,  Bryan Almond ,  Ken S. Hunt ,  Andrew M. Lever ,  Joe A. Ward

发明人： Sion C. Quinlan ,  Bryan Almond ,  Ken S. Hunt ,  Andrew M. Lever ,  Joe A. Ward

IPC分类号： H01L29/00 ,  H01L23/34

CPC分类号： H01L24/02 ,  H01L23/5223 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/0101 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/01075 ,  H01L2924/05042 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/351 ,  H01L2924/00

摘要： The present invention provides a method and apparatus for a programmable capacitor associated with an input/output pad in the semiconductor device. The apparatus includes a semiconductor die having an upper surface, a first capacitor deployed above the upper surface of the semiconductor die, a separation layer deployed above the first capacitor, and a bond pad deployed above the separation layer such that at least a portion of the bond pad lies above the first capacitor.

公开(公告)号：US20120001181A1

公开(公告)日：2012-01-05

申请号：US13232011

申请日：2011-09-14

申请人： Tomoyuki AOKI ,  Takuya TSURUME

发明人： Tomoyuki AOKI ,  Takuya TSURUME

IPC分类号： H01L29/786

CPC分类号： H01Q7/00 ,  G02F1/133305 ,  G02F1/1362 ,  G02F2001/13613 ,  H01L24/97 ,  H01L2224/16225 ,  H01L2224/97 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/0101 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01041 ,  H01L2924/01042 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01051 ,  H01L2924/01056 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/0106 ,  H01L2924/01067 ,  H01L2924/01068 ,  H01L2924/01072 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01076 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07811 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/12044 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30107 ,  H01L2924/3025 ,  H01Q1/38 ,  H05K3/207 ,  H05K3/28 ,  H05K2203/016 ,  H05K2203/0531 ,  H01L2224/81 ,  H01L2924/00

摘要： It is an object of the present invention to provide a method for forming a layer having functionality including a conductive layer and a colored layer and a flexible substrate having a layer having functionality with a high yield. Further, it is an object of the present invention to provide a method for manufacturing a semiconductor device that is small-sized, thin, and lightweight. After coating a substrate having heat resistance with a silane coupling agent, a layer having functionality is formed. Then, after attaching an adhesive to the layer having functionality, the layer having functionality is peeled from the substrate. Further, after coating a substrate having heat resistance with a silane coupling agent, a layer having functionality is formed. Then, an adhesive is attached to the layer having functionality. Thereafter, the layer having functionality is peeled from the substrate, and a flexible substrate is attached to the layer having functionality.

摘要翻译： 本发明的目的是提供一种形成具有包括导电层和着色层的功能的层的方法和具有具有高产率功能的层的柔性基板。 此外，本发明的目的是提供一种小型，薄型和轻量化的半导体器件的制造方法。 用硅烷偶联剂涂布具有耐热性的基材后，形成具有官能团的层。 然后，在将粘合剂粘贴到具有官能团的层上之后，将具有官能团的层从基材上剥离。 此外，在用硅烷偶联剂涂布具有耐热性的基材之后，形成具有官能团的层。 然后，将粘合剂附着到具有功能性的层上。 此后，具有功能性的层从基板剥离，并且柔性基板附着到具有功能的层。

公开(公告)号：US08030178B2

公开(公告)日：2011-10-04

申请号：US12618956

申请日：2009-11-16

申请人： Tomoyuki Aoki ,  Takuya Tsurume

发明人： Tomoyuki Aoki ,  Takuya Tsurume

IPC分类号： H01L21/46 ,  H01L21/469 ,  H01L21/31 ,  H01L21/84 ,  H01L21/205 ,  H01L21/331 ,  H01L21/336

CPC分类号： H01Q7/00 ,  G02F1/133305 ,  G02F1/1362 ,  G02F2001/13613 ,  H01L24/97 ,  H01L2224/16225 ,  H01L2224/97 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/0101 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01041 ,  H01L2924/01042 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01051 ,  H01L2924/01056 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/0106 ,  H01L2924/01067 ,  H01L2924/01068 ,  H01L2924/01072 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01076 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07811 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/12044 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30107 ,  H01L2924/3025 ,  H01Q1/38 ,  H05K3/207 ,  H05K3/28 ,  H05K2203/016 ,  H05K2203/0531 ,  H01L2224/81 ,  H01L2924/00

摘要： It is an object of the present invention to provide a method for forming a layer having functionality including a conductive layer and a colored layer and a flexible substrate having a layer having functionality with a high yield. Further, it is an object of the present invention to provide a method for manufacturing a semiconductor device that is small-sized, thin, and lightweight. After coating a substrate having heat resistance with a silane coupling agent, a layer having functionality is formed. Then, after attaching an adhesive to the layer having functionality, the layer having functionality is peeled from the substrate. Further, after coating a substrate having heat resistance with a silane coupling agent, a layer having functionality is formed. Then, an adhesive is attached to the layer having functionality. Thereafter, the layer having functionality is peeled from the substrate, and a flexible substrate is attached to the layer having functionality.

摘要翻译： 本发明的目的是提供一种形成具有包括导电层和着色层的功能的层的方法和具有具有高产率功能的层的柔性基板。 此外，本发明的目的是提供一种小型，薄型和轻量化的半导体器件的制造方法。 用硅烷偶联剂涂布具有耐热性的基材后，形成具有官能团的层。 然后，在将粘合剂粘贴到具有官能团的层上之后，将具有官能团的层从基材上剥离。 此外，在用硅烷偶联剂涂布具有耐热性的基材之后，形成具有官能团的层。 然后，将粘合剂附着到具有功能性的层上。 此后，具有功能性的层从基板剥离，并且柔性基板附着到具有功能的层。

公开(公告)号：US08026550B2

公开(公告)日：2011-09-27

申请号：US12156219

申请日：2008-05-30

申请人： Sehat Sutardja

发明人： Sehat Sutardja

IPC分类号： H01L29/94

CPC分类号： H01L23/4824 ,  H01L23/367 ,  H01L23/5286 ,  H01L23/5386 ,  H01L23/642 ,  H01L24/02 ,  H01L24/15 ,  H01L24/16 ,  H01L24/37 ,  H01L24/40 ,  H01L25/0657 ,  H01L25/072 ,  H01L27/0207 ,  H01L27/092 ,  H01L2224/0401 ,  H01L2224/16 ,  H01L2224/16245 ,  H01L2224/37599 ,  H01L2224/83801 ,  H01L2224/84801 ,  H01L2224/8485 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/0101 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2224/37099

摘要： An integrated circuit includes N plane-like metal layers. A first plane-like metal layer includes M contact portions that communicate with respective ones of the N plane-like metal layers, where M is an integer greater than one, wherein the first plane-like metal layer and the N plane-like metal layers are located in separate planes. A first drain region has a generally rectangular shape. First, second, third and fourth source regions have a generally rectangular shape and that are arranged adjacent to sides of the first drain region. The first drain region and the first, second, third and fourth source regions communicate with at least two of the N plane-like metal layers. A first gate region is arranged between the first, second, third and fourth source regions and the first drain region. First, second, third and fourth substrate contact regions are arranged adjacent to corners of the first drain region.

摘要翻译： 集成电路包括N个平面状金属层。 第一平面状金属层包括与N个平面状金属层中的相应的N个平面状金属层连通的M个接触部分，其中M是大于1的整数，其中第一平面状金属层和N平面状金属层 位于单独的飞机上。 第一漏极区域具有大致矩形形状。 第一，第二，第三和第四源极区域具有大致矩形形状并且被布置成与第一漏极区域的侧面相邻。 第一漏极区域和第一，第二，第三和第四源极区域与N个平面状金属层中的至少两个连通。 第一栅极区域布置在第一，第二，第三和第四源极区域与第一漏极区域之间。 第一，第二，第三和第四衬底接触区域被布置成与第一漏极区域的角相邻。