公开(公告)号：US08258502B2

公开(公告)日：2012-09-04

申请号：US12223133

申请日：2007-02-01

申请人： Makoto Yoshitake ,  Masashi Murakami ,  Yoshitsugu Morita ,  Tomoko Kato ,  Hiroji Enami ,  Masayoshi Terada ,  Brian Harkness ,  Tammy Cheng ,  Michelle Cummings ,  Ann Norris ,  Malinda Howell

发明人： Makoto Yoshitake ,  Masashi Murakami ,  Yoshitsugu Morita ,  Tomoko Kato ,  Hiroji Enami ,  Masayoshi Terada ,  Brian Harkness ,  Tammy Cheng ,  Michelle Cummings ,  Ann Norris ,  Malinda Howell

IPC分类号： H01L35/24

CPC分类号： C08K5/5425 ,  C08G77/045 ,  C08G77/12 ,  C08G77/20 ,  C08G77/70 ,  C08G77/80 ,  C08K5/5435 ,  C08K5/56 ,  C08L83/00 ,  C08L83/04 ,  H01L33/56 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014 ,  H01L2924/00

摘要： A composition includes: (I) an alkenyl functional, phenyl-containing polyorganosiloxane, an Si—H functional phenyl-containing polyorganosiloxane, or a combination thereof; (II) a hydrogendiorganosiloxy terminated oligodiphenylsiloxane having specific molecular weight, an alkenyl-functional, diorganosiloxy-terminated oligodiphenylsiloxane having specific molecular weight, or a combination thereof; and (III) a hydrosilylation catalyst. A light emitting device is made by applying the composition onto a light source followed by curing. The composition provides a cured material with mechanical properties suited for use as an encapsulant for a light emitting device.

摘要翻译： 组合物包括：（I）含烯基官能的含苯基的聚有机硅氧烷，含Si-H官能的含苯基的聚有机硅氧烷或其组合; （II）具有特定分子量的羟基低聚蔗糖氧基封端的低聚二苯基硅氧烷，具有特定分子量的烯基官能的，二有机甲硅烷氧基封端的低聚二苯基硅氧烷或其组合; 和（III）氢化硅烷化催化剂。 通过将组合物施加到光源上然后固化来制造发光器件。 组合物提供具有适合用作发光器件的密封剂的机械特性的固化材料。

公开(公告)号：US07452956B2

公开(公告)日：2008-11-18

申请号：US10568515

申请日：2004-10-08

申请人： Tammy Cheng ,  Michael Ferritto ,  Glenn Gordon ,  John Bernard Horstman ,  Randall Schmidt ,  Gary Wieber ,  Gerald Lawrence Witucki

发明人： Tammy Cheng ,  Michael Ferritto ,  Glenn Gordon ,  John Bernard Horstman ,  Randall Schmidt ,  Gary Wieber ,  Gerald Lawrence Witucki

IPC分类号： C08G77/458

CPC分类号： C08G18/61 ,  C08G18/4009 ,  C08G18/4063 ,  C08G18/6216 ,  C08G18/792 ,  C08G77/14 ,  C08G77/16 ,  C08G2101/00 ,  C09D175/04

摘要： This invention relates to urethane compositions comprising: (A) 100 weight parts of at least one compound containing at least one isocyanate group; (B) 0.3-300 weight parts of a carbinol-functional silicone resin; (C) up to 250 weight parts of an organic polyol; and (D) up to 10 weight parts of a cure rate modifier. The urethane compositions of this invention are useful as a stand-alone coating or as ingredients in protective coatings, paint formulations, and powder coatings. The urethane compositions of this invention can also be formulated with a blowing agent and cell stabilizer to produce thermally stable foam formulations.

摘要翻译： 本发明涉及聚氨酯组合物，其包含：（A）100重量份至少一种含有至少一个异氰酸酯基团的化合物; （B）0.3-300重量份的甲醇官能的有机硅树脂; （C）多达250重量份的有机多元醇; 和（D）最多10重量份的固化速率改性剂。 本发明的聚氨酯组合物可用作独立涂料或作为保护涂料，涂料配方和粉末涂料中的成分。 本发明的聚氨酯组合物也可以用发泡剂和细胞稳定剂配制以产生热稳定的泡沫制剂。

公开(公告)号：US20080090332A1

公开(公告)日：2008-04-17

申请号：US10565916

申请日：2004-07-29

申请人： Tammy Cheng ,  Mark Dobrzelewski ,  Daniel Solomon ,  Christopher Windiate

发明人： Tammy Cheng ,  Mark Dobrzelewski ,  Daniel Solomon ,  Christopher Windiate

IPC分类号： H01L21/56

CPC分类号： H01L23/3128 ,  H01L21/565 ,  H01L23/3121 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L2224/0401 ,  H01L2224/06136 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29386 ,  H01L2224/32014 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/73204 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/83194 ,  H01L2224/8385 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/0101 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01054 ,  H01L2924/0106 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/05442 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A process for fabricating an electronic component includes a liquid injection molding method for overmolding a semiconductor device. The liquid injection molding method includes: i) placing the semiconductor device in an open mold, ii) closing the mold to form a mold cavity, iii) heating the mold cavity, iv) injection molding a curable liquid into the mold cavity to overmold the semiconductor device, v) opening the mold and removing the product of step iv), and optionally vi) post-curing the product of step v). The semiconductor device may have an integrated circuit attached to a substrate through a die attach adhesive.

摘要翻译： 一种用于制造电子部件的方法包括用于二次模制半导体器件的液体注射成型方法。 液体注射成型方法包括：i）将半导体器件放置在打开的模具中，ii）闭合模具以形成模具腔，iii）加热模腔，iv）将可固化液体注射到模具腔中以包覆模制 半导体器件，v）打开模具并除去步骤iv）的产物，并且任选地vi）后处理步骤v）的产物。 半导体器件可以具有通过管芯附接粘合剂附接到衬底的集成电路。

公开(公告)号：US20070093618A1

公开(公告)日：2007-04-26

申请号：US10568515

申请日：2004-10-08

申请人： Tammy Cheng ,  Michael Ferritto ,  Glenn Gordon ,  John Horstman ,  Randall Schmidt ,  Gary Wieber ,  Gerald Witucki

发明人： Tammy Cheng ,  Michael Ferritto ,  Glenn Gordon ,  John Horstman ,  Randall Schmidt ,  Gary Wieber ,  Gerald Witucki

IPC分类号： C08G77/04 ,  C08G18/00

CPC分类号： C08G18/61 ,  C08G18/4009 ,  C08G18/4063 ,  C08G18/6216 ,  C08G18/792 ,  C08G77/14 ,  C08G77/16 ,  C08G2101/00 ,  C09D175/04

摘要： This invention relates to urethane compositions comprising: (A) 100 weight pants of at least one compound containing at least one isocyanate group; (B) 0.3-300 weight parts of a carbinol-functional silicone resin; (C) up to 250 weight parts of an organic polyol; and (D) up to 10 weight parts of a cure rate modifier. The urethane compositions of this invention are useful as a stand-alone coating or as ingredients in protective coatings, paint formulations, and powder coatings. The urethane compositions of this invention can also be formulated with a blowing agent and cell stabilizer to produce thermally stable foam formulations.

摘要翻译： 本发明涉及聚氨酯组合物，其包含：（A）100重量份至少一种含有至少一个异氰酸酯基团的化合物; （B）0.3-300重量份的甲醇官能的有机硅树脂; （C）多达250重量份的有机多元醇; 和（D）最多10重量份的固化速率改性剂。 本发明的聚氨酯组合物可用作独立涂料或作为保护涂料，涂料配方和粉末涂料中的成分。 本发明的聚氨酯组合物也可以用发泡剂和细胞稳定剂配制以产生热稳定的泡沫制剂。

公开(公告)号：US20110221060A1

公开(公告)日：2011-09-15

申请号：US13116063

申请日：2011-05-26

申请人： Tammy Cheng ,  Mark Dobrzelewski ,  Daniel Solomon ,  Christopher Windiate

发明人： Tammy Cheng ,  Mark Dobrzelewski ,  Daniel Solomon ,  Christopher Windiate

IPC分类号： H01L23/498 ,  H01L21/50 ,  H01L21/56

CPC分类号： H01L23/3128 ,  H01L21/565 ,  H01L23/3121 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L2224/0401 ,  H01L2224/06136 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29386 ,  H01L2224/32014 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/73204 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/83194 ,  H01L2224/8385 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/0101 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01054 ,  H01L2924/0106 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/05442 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A process for fabricating an electronic component includes a liquid injection molding method for overmolding a semiconductor device. The liquid injection molding method includes: i) placing the semiconductor device in an open mold, ii) closing the mold to form a mold cavity, iii) heating the mold cavity, iv) injection molding a curable liquid into the mold cavity to overmold the semiconductor device, v) opening the mold and removing the product of step iv), and optionally vi) post-curing the product of step v). The semiconductor device may have an integrated circuit attached to a substrate through a die attach adhesive.

摘要翻译： 一种用于制造电子部件的方法包括用于二次模制半导体器件的液体注射成型方法。 液体注射成型方法包括：i）将半导体器件放置在打开的模具中，ii）闭合模具以形成模具腔，iii）加热模腔，iv）将可固化液体注射到模具腔中以包覆模制 半导体器件，v）打开模具并除去步骤iv）的产物，并且任选地vi）后处理步骤v）的产物。 半导体器件可以具有通过管芯附接粘合剂附接到衬底的集成电路。

公开(公告)号：US08017449B2

公开(公告)日：2011-09-13

申请号：US10565916

申请日：2004-07-29

申请人： Tammy Cheng ,  Mark Dobrzelewski ,  Daniel Solomon ,  Christopher Windiate

发明人： Tammy Cheng ,  Mark Dobrzelewski ,  Daniel Solomon ,  Christopher Windiate

IPC分类号： H01L21/56

CPC分类号： H01L23/3128 ,  H01L21/565 ,  H01L23/3121 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L2224/0401 ,  H01L2224/06136 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29386 ,  H01L2224/32014 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/73204 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/83194 ,  H01L2224/8385 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/0101 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01054 ,  H01L2924/0106 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/05442 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A process for fabricating an electronic component includes a liquid injection molding method for overmolding a semiconductor device. The liquid injection molding method includes: i) placing the semiconductor device in an open mold, ii) closing the mold to form a mold cavity, iii) heating the mold cavity, iv) injection molding a curable liquid into the mold cavity to overmold the semiconductor device, v) opening the mold and removing the product of step iv), and optionally vi) post-curing the product of step v). The semiconductor device may have an integrated circuit attached to a substrate through a die attach adhesive.

摘要翻译： 一种用于制造电子部件的方法包括用于二次模制半导体器件的液体注射成型方法。 液体注射成型方法包括：i）将半导体器件放置在打开的模具中，ii）闭合模具以形成模具腔，iii）加热模腔，iv）将可固化液体注射到模具腔中以包覆模制 半导体器件，v）打开模具并除去步骤iv）的产物，并且任选地vi）后处理步骤v）的产物。 半导体器件可以具有通过管芯附接粘合剂附接到衬底的集成电路。

公开(公告)号：US08609472B2

公开(公告)日：2013-12-17

申请号：US13116063

申请日：2011-05-26

申请人： Tammy Cheng ,  Mark Dobrzelewski ,  Daniel Solomon ,  Christopher Windiate

发明人： Tammy Cheng ,  Mark Dobrzelewski ,  Daniel Solomon ,  Christopher Windiate

IPC分类号： H01L21/56 ,  H01L23/29

CPC分类号： H01L23/3128 ,  H01L21/565 ,  H01L23/3121 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L2224/0401 ,  H01L2224/06136 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29386 ,  H01L2224/32014 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/73204 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/83194 ,  H01L2224/8385 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/0101 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01054 ,  H01L2924/0106 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/05442 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A process for fabricating an electronic component includes a liquid injection molding method for overmolding a semiconductor device. The liquid injection molding method includes: i) placing the semiconductor device in an open mold, ii) closing the mold to form a mold cavity, iii) heating the mold cavity, iv) injection molding a curable liquid into the mold cavity to overmold the semiconductor device, v) opening the mold and removing the product of step iv), and optionally vi) post-curing the product of step v). The semiconductor device may have an integrated circuit attached to a substrate through a die attach adhesive.

摘要翻译： 一种用于制造电子部件的方法包括用于二次模制半导体器件的液体注射成型方法。 液体注射成型方法包括：i）将半导体器件放置在打开的模具中，ii）闭合模具以形成模具腔，iii）加热模腔，iv）将可固化液体注射到模具腔中以包覆模制 半导体器件，v）打开模具并除去步骤iv）的产物，并且任选地vi）后处理步骤v）的产物。 半导体器件可以具有通过管芯附接粘合剂附接到衬底的集成电路。

公开(公告)号：US20100276721A1

公开(公告)日：2010-11-04

申请号：US12223133

申请日：2007-02-01

申请人： Makoto Yoshitake ,  Masashi Murakami ,  Yoshitsugu Morita ,  Tomoko Kato ,  Hiroji Enami ,  Masayoshi Terada ,  Brian Harkness ,  Tammy Cheng ,  Michelle Cummings ,  Ann Norris ,  Malinda Howell

发明人： Makoto Yoshitake ,  Masashi Murakami ,  Yoshitsugu Morita ,  Tomoko Kato ,  Hiroji Enami ,  Masayoshi Terada ,  Brian Harkness ,  Tammy Cheng ,  Michelle Cummings ,  Ann Norris ,  Malinda Howell

IPC分类号： H01L33/62 ,  C08L83/05

CPC分类号： C08K5/5425 ,  C08G77/045 ,  C08G77/12 ,  C08G77/20 ,  C08G77/70 ,  C08G77/80 ,  C08K5/5435 ,  C08K5/56 ,  C08L83/00 ,  C08L83/04 ,  H01L33/56 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014 ,  H01L2924/00

摘要： A composition includes: (I) an alkenyl functional, phenyl-containing polyorganosiloxane, an Si—H functional phenyl-containing polyorganosiloxane, or a combination thereof; (II) a hydrogendiorganosiloxy terminated oligodiphenylsiloxane having specific molecular weight, an alkenyl-functional, diorganosiloxy-terminated oligodiphenylsiloxane having specific molecular weight, or a combination thereof; and (III) a hydrosilylation catalyst. A light emitting device is made by applying the composition onto a light source followed by curing. The composition provides a cured material with mechanical properties suited for use as an encapsulant for a light emitting device.

摘要翻译： 组合物包括：（I）含烯基官能的含苯基的聚有机硅氧烷，含Si-H官能的含苯基的聚有机硅氧烷或其组合; （II）具有特定分子量的羟基低聚蔗糖氧基封端的低聚二苯基硅氧烷，具有特定分子量的烯基官能的，二有机甲硅烷氧基封端的低聚二苯基硅氧烷或其组合; 和（III）氢化硅烷化催化剂。 通过将组合物施加到光源上然后固化来制造发光器件。 组合物提供具有适合用作发光器件的密封剂的机械特性的固化材料。