公开(公告)号：US08258502B2

公开(公告)日：2012-09-04

申请号：US12223133

申请日：2007-02-01

申请人： Makoto Yoshitake ,  Masashi Murakami ,  Yoshitsugu Morita ,  Tomoko Kato ,  Hiroji Enami ,  Masayoshi Terada ,  Brian Harkness ,  Tammy Cheng ,  Michelle Cummings ,  Ann Norris ,  Malinda Howell

发明人： Makoto Yoshitake ,  Masashi Murakami ,  Yoshitsugu Morita ,  Tomoko Kato ,  Hiroji Enami ,  Masayoshi Terada ,  Brian Harkness ,  Tammy Cheng ,  Michelle Cummings ,  Ann Norris ,  Malinda Howell

IPC分类号： H01L35/24

CPC分类号： C08K5/5425 ,  C08G77/045 ,  C08G77/12 ,  C08G77/20 ,  C08G77/70 ,  C08G77/80 ,  C08K5/5435 ,  C08K5/56 ,  C08L83/00 ,  C08L83/04 ,  H01L33/56 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014 ,  H01L2924/00

摘要： A composition includes: (I) an alkenyl functional, phenyl-containing polyorganosiloxane, an Si—H functional phenyl-containing polyorganosiloxane, or a combination thereof; (II) a hydrogendiorganosiloxy terminated oligodiphenylsiloxane having specific molecular weight, an alkenyl-functional, diorganosiloxy-terminated oligodiphenylsiloxane having specific molecular weight, or a combination thereof; and (III) a hydrosilylation catalyst. A light emitting device is made by applying the composition onto a light source followed by curing. The composition provides a cured material with mechanical properties suited for use as an encapsulant for a light emitting device.

摘要翻译： 组合物包括：（I）含烯基官能的含苯基的聚有机硅氧烷，含Si-H官能的含苯基的聚有机硅氧烷或其组合; （II）具有特定分子量的羟基低聚蔗糖氧基封端的低聚二苯基硅氧烷，具有特定分子量的烯基官能的，二有机甲硅烷氧基封端的低聚二苯基硅氧烷或其组合; 和（III）氢化硅烷化催化剂。 通过将组合物施加到光源上然后固化来制造发光器件。 组合物提供具有适合用作发光器件的密封剂的机械特性的固化材料。

公开(公告)号：US08153202B2

公开(公告)日：2012-04-10

申请号：US13009982

申请日：2011-01-20

申请人： Yoshitsugu Morita ,  Tomoko Kato ,  Hiroji Enami

发明人： Yoshitsugu Morita ,  Tomoko Kato ,  Hiroji Enami

IPC分类号： B05D5/00 ,  B05D1/38 ,  B05D3/10

CPC分类号： C08J7/047 ,  C08J2383/04 ,  C08J2483/00 ,  C08K5/56 ,  C09D183/04 ,  Y10T428/31663 ,  C08L83/00

摘要： A method of manufacturing a layered silicone composite material comprising the steps of: applying a second addition-curable organopolysiloxane composition that contains a second adhesion promoter onto a first silicone layer that is formed by curing a first addition-curable organopolysiloxane composition containing a first adhesion promoter and where the first silicone layer has a hardness of less than JIS A 50; and forming a second silicone layer that has hardness of JIS A 50 or more by curing said second addition-curable organopolysiloxane composition.

摘要翻译： 一种制备层状硅氧烷复合材料的方法，包括以下步骤：将含有第二粘合促进剂的第二可加成固化的有机聚硅氧烷组合物施加到通过固化含有第一粘合促进剂的第一可加成固化的有机聚硅氧烷组合物形成的第一硅氧烷层上 并且其中第一硅氧烷层具有小于JIS A 50的硬度; 并通过固化所述第二可加成固化的有机基聚硅氧烷组合物形成硬度为JIS A 50或更高的第二硅氧烷层。

公开(公告)号：US08044162B2

公开(公告)日：2011-10-25

申请号：US12299929

申请日：2007-05-10

申请人： Yoshitsugu Morita ,  Tomoko Kato ,  Hiroshi Ueki ,  Osamu Tanaka

发明人： Yoshitsugu Morita ,  Tomoko Kato ,  Hiroshi Ueki ,  Osamu Tanaka

IPC分类号： H01L33/00 ,  C08G77/04

CPC分类号： C08K5/54 ,  C08L83/00 ,  C08L83/04 ,  C09J183/04 ,  H01L2224/48091 ,  H01L2924/00014

摘要： An adhesion-promoting agent represented by the following average formula: R1aSiO(4-a/2 (where R1 is a group selected from an optionally substituted alkyl group with 1 to 10 carbon atoms, an alkenyl group with 2 to 20 carbon atoms, an aryl group with 6 to 20 carbon atoms, an alkoxy group with 1 to 10 carbon atoms, or an epoxy-containing organic group; however, in one molecule, the content of the alkenyl groups should constitute at least 5 mole % of all groups designated by R1; the content of the aryl groups should constitute at least 5 mole % of all groups designated by R1; the content of the alkoxy groups should constitute at least 5 mole % of all groups designated by R1; the content of the epoxy-containing organic groups should constitute at least 5 mole % of all groups designated by R1; and “a” is a number that satisfies the following condition: 1.0≦a

摘要翻译： 由以下平均通式表示的增粘剂：R1aSiO（4-a / 2（其中R1为选自具有1-10个碳原子的任选取代的烷基，具有2至20个碳原子的链烯基， 具有6至20个碳原子的芳基，具有1至10个碳原子的烷氧基或含环氧基的有机基团;然而，在一个分子中，烯基的含量应构成指定的所有基团的至少5摩尔％ 由R 1表示;芳基的含量应构成由R1表示的所有基团的至少5摩尔％;烷氧基的含量应构成由R1表示的所有基团的至少5摩尔％;含环氧基的 有机基团应构成由R1指定的所有基团的至少5摩尔％;“a”是满足以下条件的数：1.0＆lt; nlE; a <4）是新型粘合促进剂和可固化的有机聚硅氧烷组合物， 含有上述附着力 - 促进剂对各种有机树脂基材具有优异的粘合性，并且适于形成具有高折射率和高透光率的固化体。

公开(公告)号：US08044153B2

公开(公告)日：2011-10-25

申请号：US12093053

申请日：2006-11-08

申请人： Shinichi Yamamoto ,  Tomoko Kato ,  Hiroji Enami ,  Yoshitsugu Morita

发明人： Shinichi Yamamoto ,  Tomoko Kato ,  Hiroji Enami ,  Yoshitsugu Morita

IPC分类号： C08G77/12 ,  C08G77/20 ,  C08L83/05 ,  C08L83/07

CPC分类号： C08L83/04 ,  C08G77/12 ,  C08G77/20 ,  C08L83/00 ,  C08K5/56

摘要： A curable silicone composition comprising at least the following components: (A) a diorganopolysiloxane having in one molecule at least two alkenyl groups; (B) at least two resin-like organopolysiloxanes that have different mass-average molecular weights as reduced into standard polystyrene measured gel permeation chromatography and that are composed of SiO4/2 units, R12R2SiO1/2 units, and R13SiO1/2 units, wherein R1 is an optionally substituted univalent hydrocarbon group that is free of aliphatic unsaturated bonds and R2 is an alkenyl group; (C) an organopolysiloxane that contains in one molecule at least two silicon-bonded hydrogen atoms; and (D) a hydrosilylation catalyst; possesses excellent flowability and filling ability and that can be prepared without extreme viscosity even if the composition contains resin-like organopolysiloxanes required to form a cured silicone body of appropriate strength and hardness.

摘要翻译： 至少包含以下组分的可固化的硅氧烷组合物：（A）在一个分子中具有至少两个烯基的二有机聚硅氧烷; （B）将至少两种具有不同质均分子量的树脂状有机聚硅氧烷降低成标准聚苯乙烯测量的凝胶渗透色谱法，并由SiO 4/2单元，R 12 R 2 SiO 1/2单元和R 13 SiO 1/2单元组成，其中R 1 是不含脂族不饱和键的任意取代的一价烃基，R 2是烯基; （C）在一个分子中含有至少两个与硅键合的氢原子的有机聚硅氧烷; 和（D）氢化硅烷化催化剂; 具有优异的流动性和填充能力，并且即使组合物含有形成具有适当强度和硬度的固化的硅氧烷体所需的树脂状有机聚硅氧烷，也可以制备而不具有极高的粘度。

公开(公告)号：US20110163460A1

公开(公告)日：2011-07-07

申请号：US13061627

申请日：2009-08-20

申请人： Tomoko Kato ,  Kazumi Nakayoshi

发明人： Tomoko Kato ,  Kazumi Nakayoshi

IPC分类号： H01L23/29 ,  C09K5/00

CPC分类号： C08L83/04 ,  C08G77/12 ,  C08G77/14 ,  C08G77/18 ,  C08G77/20 ,  C08K3/22 ,  H01L2224/48091 ,  C08L83/00 ,  H01L2924/00014

摘要： A thermally conductive silicone composition comprises (A) an organopolysiloxane having a viscosity equal to or greater than 100 mPa·s at 25° C.; (B) aluminum powder having an average size of particles ranging from 0.1 to 100 μm; (C) zinc oxide powder having an average size of particles ranging from 0.05 to 50 μm; (D) (i) an organopolysiloxane containing univalent hydrocarbon groups which have unsaturated aliphatic bonds, (ii) an organopolysiloxane containing hydrocarbon groups which are free of unsaturated aliphatic bonds, or a mixture of constituents (i) and (ii); and (E) a silane compound or a product of partial hydrolyzation and condensation of said silane compound. The composition has high conductivity and excellent handleability.

摘要翻译： 导热性硅氧烷组合物包含（A）在25℃下粘度等于或大于100mPa·s的有机聚硅氧烷; （B）平均粒径为0.1〜100μm的铝粉末; （C）平均粒径为0.05〜50μm的氧化锌粉末; （D）（i）含有具有不饱和脂肪键的一价烃基的有机聚硅氧烷，（ii）含有不饱和脂肪键的烃基的有机聚硅氧烷，或组分（i）和（ii）的混合物; 和（E）硅烷化合物或所述硅烷化合物的部分水解和缩合的产物。 该组合物具有高导电性和优异的可操作性。

公开(公告)号：US07763697B2

公开(公告)日：2010-07-27

申请号：US11832984

申请日：2007-08-02

申请人： Tomoko Kato ,  Minoru Isshiki

发明人： Tomoko Kato ,  Minoru Isshiki

IPC分类号： C08G77/08

CPC分类号： C08K5/56 ,  C08G77/045 ,  C08G77/12 ,  C08G77/20 ,  C08G77/70 ,  C08L83/04 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/8592 ,  H01L2924/1301 ,  H01L2924/181 ,  C08L83/00 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A curable organopolysiloxane composition capable of forming cured products of superior optical transmittance exhibiting little heat-induced yellowing over time. A semiconductor device having semiconductor elements encapsulated in a cured product of the composition. The composition includes (A) an organopolysiloxane having at least two silicon-bonded alkenyl groups per molecule and bearing silicon-bonded aryl groups, whose content relative to all silicon-bonded organic groups is not less than 40 mol %, (B) an organopolysiloxane having at least two silicon-bonded hydrogen atoms per molecule, and (C) an organosiloxane oligomer complex of platinum, where the oligomer has not more than eight silicon atoms per molecule and bears silicon-bonded alkenyl groups and silicon-bonded aryl groups.

摘要翻译： 一种可固化的有机基聚硅氧烷组合物，其能够形成具有优异光透射率的固化产物，其随着时间的推移几乎不发生热引起的黄变。 一种具有封装在该组合物的固化产物中的半导体元件的半导体器件。 该组合物包括（A）每分子具有至少两个硅键合的烯基并且具有硅键合的芳基的有机聚硅氧烷，其相对于所有与硅键合的有机基团的含量不小于40摩尔％，（B）有机聚硅氧烷 每分子具有至少两个硅键合的氢原子，和（C）铂的有机硅氧烷低聚物络合物，其中低聚物每分子具有不超过8个硅原子并具有硅键合的烯基和与硅键合的芳基。

公开(公告)号：US20090294796A1

公开(公告)日：2009-12-03

申请号：US12299929

申请日：2007-05-10

申请人： Yoshitsugu Morita ,  Tomoko Kato ,  Hiroshi Ueki ,  Osamu Tanaka

发明人： Yoshitsugu Morita ,  Tomoko Kato ,  Hiroshi Ueki ,  Osamu Tanaka

IPC分类号： H01L33/00 ,  C09K3/00 ,  C08G77/20

CPC分类号： C08K5/54 ,  C08L83/00 ,  C08L83/04 ,  C09J183/04 ,  H01L2224/48091 ,  H01L2924/00014

摘要： An adhesion-promoting agent represented by the following average formula: R1aSiO(4-a/2 (where R1 is a group selected from an optionally substituted alkyl group with 1 to 10 carbon atoms, an alkenyl group with 2 to 20 carbon atoms, an aryl group with 6 to 20 carbon atoms, an alkoxy group with 1 to 10 carbon atoms, or an epoxy-containing organic group; however, in one molecule, the content of the alkenyl groups should constitute at least 5 mole % of all groups designated by R1; the content of the aryl groups should constitute at least 5 mole % of all groups designated by R1; the content of the alkoxy groups should constitute at least 5 mole % of all groups designated by R1; the content of the epoxy-containing organic groups should constitute at least 5 mole % of all groups designated by R1; and “a” is a number that satisfies the following condition: 1.0≦a

摘要翻译： 由以下平均通式表示的增粘剂：R1aSiO（4-a / 2（其中R1为选自具有1-10个碳原子的任选取代的烷基，具有2至20个碳原子的链烯基， 具有6至20个碳原子的芳基，具有1至10个碳原子的烷氧基或含环氧基的有机基团;然而，在一个分子中，烯基的含量应构成指定的所有基团的至少5摩尔％ 由R 1表示;芳基的含量应构成由R1表示的所有基团的至少5摩尔％;烷氧基的含量应构成由R1表示的所有基团的至少5摩尔％;含环氧基的 有机基团应构成由R1指定的所有基团的至少5摩尔％;“a”是满足以下条件的数：1.0 <= a <4）是新型粘合促进剂和可固化的有机基聚硅氧烷组合物， 含有上述粘合促进剂 对各种有机树脂基材具有优异的粘合性，适合于形成具有高折射率和高透光率的固化体。

公开(公告)号：US20090234078A1

公开(公告)日：2009-09-17

申请号：US11908587

申请日：2006-03-15

申请人： Hiroshi Ueki ,  Minoru Isshiki ,  Yoshitsugu Morita ,  Tomoko Kato

发明人： Hiroshi Ueki ,  Minoru Isshiki ,  Yoshitsugu Morita ,  Tomoko Kato

IPC分类号： C08L83/06 ,  C07F7/06 ,  C08L63/00

CPC分类号： C07F7/0838

摘要： An organotrisiloxane represented by the following general formula (I), wherein R1 and R2 may be the same or different and designate optionally substituted univalent hydrocarbon groups that do not have aliphatically unsaturated bonds, with the proviso that at least one of R1 or R2 is an aryl group, and R3 designates an organic group that contains a phenolic hydroxyl group, is a novel compound that possesses good reactivity and excellent compatibility and dispersibility with respect to the curable resins, such as epoxy resin.

摘要翻译： 由以下通式（I）表示的有机三
氧硅烷，其中R 1和R 2可以相同或不同，并且表示不具有脂族不饱和键的任选取代的一价烃基，条件是R 1或R 2中的至少一个为 芳基，R3表示含有酚性羟基的有机基，是具有良好的反应性，相对于环氧树脂等固化性树脂的相容性和分散性优异的新型化合物。

公开(公告)号：US20090203837A1

公开(公告)日：2009-08-13

申请号：US11912643

申请日：2006-04-27

申请人： Yoshitsugu Morita ,  Minoru Isshiki ,  Tomoko Kato

发明人： Yoshitsugu Morita ,  Minoru Isshiki ,  Tomoko Kato

IPC分类号： C08L83/06 ,  C08G77/14

CPC分类号： C08G59/686 ,  C08G59/3254 ,  C08G59/4085 ,  C08L83/06 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/92125 ,  H01L2924/00011 ,  H01L2924/00014 ,  C08L83/00 ,  H01L2224/0401

摘要： A curable silicone composition comprising: (A) an organopolysiloxane that is represented by a specific average unit formula and that has at least two of the aforementioned epoxy-functional monovalent organic groups in each molecule; (B) a diorganosiloxane represented by the general formula: A-R5-(R42SiO)mR42Si—R5-A, wherein R4 is substituted or unsubstituted mono-valent hydrocarbon group that does not contain an aliphatically unsaturated bond, R5 is a divalent organic group, A is a siloxane residue with a specific average unit formula, and m is an integer with a value of at least 1; and (C) a curing agent for epoxy resin, exhibits excellent handling and curing characteristics and that cures to give a cured product that exhibits excellent flexibility and adhesiveness.

摘要翻译： 一种可固化有机硅组合物，其包含：（A）由特定平均单元式表示并且在每个分子中具有至少两个上述环氧官能单价有机基团的有机聚硅氧烷; （B）由以下通式表示的二有机硅氧烷：A-R5-（R42SiO）mR42Si-R5-A，其中R4是不含脂族不饱和键的取代或未取代的一价烃基，R5是二价有机基团 A是具有特定平均单元式的硅氧烷残基，m是至少为1的整数; 和（C）环氧树脂固化剂，具有优异的处理和固化特性，并且可以固化，得到表现出优异的柔软性和粘合性的固化产物。

公开(公告)号：US20070112147A1

公开(公告)日：2007-05-17

申请号：US10573505

申请日：2004-09-14

申请人： Yoshitsugu Morita ,  Masayoshi Terada ,  Hiroji Enami ,  Tomoko Kato

发明人： Yoshitsugu Morita ,  Masayoshi Terada ,  Hiroji Enami ,  Tomoko Kato

IPC分类号： C08L83/04 ,  H01L21/56 ,  B32B27/00

CPC分类号： C08L83/04 ,  C08G77/12 ,  C08G77/20 ,  C08G77/70 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/1301 ,  Y10T428/31663 ,  C08L83/00 ,  H01L2924/00014 ,  H01L2924/00

摘要： A curable organopolysiloxane composition comprising (A) a linear organopolysiloxane having at least two alkenyl groups and at least one aryl group per molecule, (B) a branched organopolysiloxane having at least one alkenyl group and at least one aryl group per molecule, and having siloxane units represented by the general formula: RsiO2/3, (C) a linear organopolysiloxane with both terminal ends of the molecular chain blocked by silicon bonded hydrogen atoms having at least one aryl group per molecule, and (D) a hydrosilation reaction catalyst, and a semiconductor device whose semiconductor elements are coated with the cured product of the above-described composition. The curable organopolysiloxane composition shows low viscosity, excellent filling properties, and excellent curability that cures to form a soft cured product of a large refractive index, high light transmittance, and high adhesion to substrates, as well as the semiconductor device shows superior reliability.

摘要翻译： 一种可固化的有机聚硅氧烷组合物，其包含（A）每分子具有至少两个烯基和至少一个芳基的直链有机聚硅氧烷，（B）每分子具有至少一个烯基和至少一个芳基的支链有机聚硅氧烷，并具有硅氧烷 由以下通式表示的单元：RsiO 2/3，（C）分子链的两个末端被每分子具有至少一个芳基的硅键合氢原子封闭的直链有机聚硅氧烷和（ D）硅氢化反应催化剂，以及其半导体元件涂覆有上述组合物的固化产物的半导体器件。 可固化的有机基聚硅氧烷组合物显示出低粘度，优异的填充性能和固化性，并且固化性优异，可以形成具有大折射率，高透光率和对基材的高粘附性的软化固化物，以及半导体器件显示出优异的可靠性。