公开(公告)号：US20110039738A1

公开(公告)日：2011-02-17

申请号：US12865184

申请日：2009-01-22

Applicant: Kazumi Nakayoshi ,  Tomoko Kato

Inventor： Kazumi Nakayoshi ,  Tomoko Kato

IPC: C10M107/50 ,  C10M125/10 ,  C10M125/04 ,  C10M125/26

CPC classification number: C10M169/02 ,  C08G77/12 ,  C08G77/18 ,  C08G77/20 ,  C08G77/60 ,  C08L83/04 ,  C08L83/14 ,  C09K5/14 ,  C10M2201/0416 ,  C10M2201/056 ,  C10M2201/0616 ,  C10M2201/0626 ,  C10M2201/1056 ,  C10M2201/145 ,  C10M2227/04 ,  C10M2227/065 ,  C10M2229/0415 ,  C10M2229/0425 ,  C10M2229/0435 ,  C10M2229/0445 ,  C10M2229/0465 ,  C10M2229/0515 ,  C10N2220/022 ,  C10N2220/082 ,  C10N2220/084 ,  H01L23/3737 ,  H01L2924/0002 ,  H01L2924/09701 ,  C08L83/00 ,  C08L2666/54 ,  H01L2924/00

Abstract: A thermally conductive silicone grease composition comprising at least the following components: an organopolysiloxane (A) represented by the following general formula: [wherein R1 designates identical or different univalent hydrocarbon groups; X designates identical or different univalent hydrocarbon groups or alkoxysilyl-containing groups of the following general formula: —R2—SiR1a(OR3)(3-a) (wherein R1 designates the previously mentioned groups; R2 designates oxygen atoms or alkylene groups; R3 designates alkyl groups; and ‘a’ is an integer ranging from 0 to 2); and ‘m’ and ‘n’ are integers equal to or greater than 0, respectively]; a thermally conductive filler (B); and an organopolysiloxane (C) having silicon-bonded hydrogen atoms on both molecular terminals and in the molecular chains; is characterized by excellent resistance to heat and reduced oil bleeding.

Abstract translation: 至少包含以下组分的导热硅油组合物：由以下通式表示的有机聚硅氧烷（A）：其中R 1表示相同或不同的一价烃基; X表示相同或不同的具有以下通式的一价烃基或含烷氧基甲硅烷基的基团：-R2-SiR1a（OR3）（3-a）（其中R1表示前述基团; R2表示氧原子或亚烷基; R3表示 烷基;和'a'是0至2的整数）; 和'm'和'n'分别为等于或大于0的整数]; 导热填料（B）; 和在分子末端和分子链中具有硅键合氢原子的有机聚硅氧烷（C）; 其特征在于优异的耐热性和减少的油渗出。

公开(公告)号：US07537712B2

公开(公告)日：2009-05-26

申请号：US10509267

申请日：2003-03-03

Applicant: Ryoto Shima ,  Kazumi Nakayoshi ,  Hiroki Ishikawa

Inventor： Ryoto Shima ,  Kazumi Nakayoshi ,  Hiroki Ishikawa

IPC: H01B1/02

CPC classification number: H01B1/22 ,  C08G77/12 ,  C08G77/20 ,  C08L83/04 ,  C08L83/00

Abstract: An electrically conductive silicone rubber composition comprises, at least, (A) 100 parts by weight of an organopolysiloxane having at least two alkenyl groups per molecule, (B) an organopolysiloxane having at least two silicon-bonded hydrogen atoms per molecule (an amount sufficient to cure the present composition), (C) a platinum based catalyst (an amount sufficient to promote the cure of the present composition), (D) 50 parts by weight to 5,000 parts by weight of a metal based electrically conductive filler, and (E) 5 parts by weight to 500 parts by weight of spherical silicone rubber particles with a surface active agent content of not more than 0.3 wt %.

Abstract translation: 导电硅橡胶组合物至少包含（A）100重量份每分子具有至少两个烯基的有机聚硅氧烷，（B）每分子具有至少两个与硅键合的氢原子的有机聚硅氧烷（足够的量 固化本组合物），（C）铂类催化剂（足以促进本发明组合物固化的量），（D）50重量份至5,000重量份的金属基导电填料和（ E）5重量份至500重量份的表面活性剂含量不超过0.3重量％的球形硅橡胶颗粒。

公开(公告)号：US20050118845A1

公开(公告)日：2005-06-02

申请号：US10496558

申请日：2002-11-21

Applicant: Akihiko Kobayashi ,  Kazumi Nakayoshi ,  Ryoto Shima ,  Yoshito Ushio ,  Katsutoshi Mine

Inventor： Akihiko Kobayashi ,  Kazumi Nakayoshi ,  Ryoto Shima ,  Yoshito Ushio ,  Katsutoshi Mine

IPC: C09J7/00 ,  C09J9/02 ,  C09J121/00 ,  C09J183/04 ,  H01B5/16 ,  H01B13/00 ,  H01L21/48 ,  H01L21/60 ,  H01L23/498 ,  H01R11/01 ,  H05K3/32 ,  H01R4/58

CPC classification number: H01L24/83 ,  C09J7/10 ,  C09J9/02 ,  C09J2201/602 ,  C09J2483/00 ,  H01L21/486 ,  H01L23/49827 ,  H01L24/29 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29299 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/83101 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01058 ,  H01L2924/01061 ,  H01L2924/0107 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/12042 ,  H01L2924/351 ,  H05K3/321 ,  H05K2201/0133 ,  H05K2201/0314 ,  H05K2201/10378 ,  H05K2201/10674 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/05599

Abstract: An anisotropically electroconductive adhesive film is characterized by containing an electroconductive elastomer that traverses the thickness of the adhesive film and is insulated in the plane of the adhesive film comprising electrically insulating elastomer, and both the electroconductive elastomer and the electrically insulating elastomer have a modulus of elasticity at 150° C. that is no greater than 100 MPa. A method for producing the anisotropically electroconductive adhesive film is characterized by forming through holes across the thickness of the adhesive film comprising electrically insulating elastomer, thereafter filling the through holes with an electroconductive elastomer composition, and curing the electroconductive elastomer composition to form the electroconductive elastomer after filling the through holes. A semiconductor device characterized by the electrical connection of the terminals of a semiconductor chip to the interconnect pads of an interconnect substrate by the aforementioned anisotropically electroconductive adhesive film.

Abstract translation: 各向异性导电粘合剂膜的特征在于含有穿过粘合剂膜的厚度并在包含电绝缘弹性体的粘合剂膜的平面中绝缘的导电弹性体，并且导电弹性体和电绝缘弹性体都具有弹性模量 在150℃下不大于100MPa。 制造各向异性导电粘合膜的方法的特征在于，在包括电绝缘弹性体的粘合剂膜的厚度上形成通孔，然后用导电弹性体组合物填充通孔，并且固化导电弹性体组合物以形成导电弹性体 填充通孔。 一种半导体器件，其特征在于通过上述各向异性导电粘合剂膜将半导体芯片的端子与互连衬底的互连焊盘电连接。

公开(公告)号：US06518204B2

公开(公告)日：2003-02-11

申请号：US10094231

申请日：2002-03-07

Applicant: Kimio Yamakawa ,  Kazumi Nakayoshi ,  Hiroki Ishikawa ,  Ryoto Shima ,  Junji Nakanishi ,  Tomoko Kato ,  Minoru Isshiki ,  Katsutoshi Mine

Inventor： Kimio Yamakawa ,  Kazumi Nakayoshi ,  Hiroki Ishikawa ,  Ryoto Shima ,  Junji Nakanishi ,  Tomoko Kato ,  Minoru Isshiki ,  Katsutoshi Mine

IPC: H01L2131

CPC classification number: H01L23/3135 ,  C08F283/12 ,  H01L21/02126 ,  H01L21/02216 ,  H01L21/02282 ,  H01L21/3122 ,  H01L23/293 ,  H01L2224/48091 ,  H01L2924/1301 ,  H01L2924/19041 ,  C08F230/08 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A curable organopolysiloxane composition comprises: (A) an organopolysiloxane with two or more silicon-bonded hydrogen atoms contained in one molecule in an amount not exceeding 0.05 wt. %; (B) an organopolysiloxane with two or more alkenyl groups in one molecule {alkenyl groups of this components are to be in an amount of 0.01 to 1 mole per 1 mole of a silicon-bonded hydrogen atoms contained in said component (A)}; and (C) a hydrosilylation-reaction metal catalyst (with content of metal atoms within the range of 0.01 to 1,000 ppm in terms of weight units). A method of manufacturing a semiconductor device comprises: applying onto the surface of a semiconductor device and curing, the aforementioned curable organopolysiloxane composition.

公开(公告)号：US5173765A

公开(公告)日：1992-12-22

申请号：US619842

申请日：1990-11-29

Applicant: Kazumi Nakayoshi ,  Katsutoshi Mine

Inventor： Kazumi Nakayoshi ,  Katsutoshi Mine

IPC: C09J183/05 ,  C08L83/07 ,  C09J9/02 ,  C09J11/04 ,  C09J183/00 ,  C09J183/07 ,  H01B1/12 ,  H01L21/60 ,  H01L23/495 ,  H01R4/04

CPC classification number: H01L24/83 ,  H01L23/49513 ,  H01L24/29 ,  H01L24/32 ,  H01L2224/05624 ,  H01L2224/29 ,  H01L2224/2919 ,  H01L2224/29191 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48624 ,  H01L2224/48647 ,  H01L2224/48824 ,  H01L2224/48847 ,  H01L2224/73265 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2224/85201 ,  H01L2224/85205 ,  H01L2224/85447 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01055 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/09701 ,  H01L2924/181 ,  Y10T428/31663

Abstract: A conductive adhesive for bonding semiconductor pellets to tabs is made from a conductive addition reaction-curing silicone rubber composition which contains.ltoreq.500 ppm of low-molecular-weight siloxane which has a vapor pressure.gtoreq.10 mmHg at 200.degree. C. The conductive adhesive can contain a metal micropowder such as gold, silver, nickel or copper.

公开(公告)号：US5145931A

公开(公告)日：1992-09-08

申请号：US604843

申请日：1990-10-26

Applicant: Kazumi Nakayoshi ,  Katsutoshi Mine

Inventor： Kazumi Nakayoshi ,  Katsutoshi Mine

IPC: H01L21/52 ,  C08G77/34 ,  C08L83/07 ,  C09J183/00 ,  C09J183/04 ,  C09J183/05 ,  C09J183/07

CPC classification number: C08G77/34 ,  C09J183/04 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/15747

Abstract: An adhesive for bonding a semiconductor pellet to an attachment site where the adhesive is an addition reaction-curing silicone rubber composition which contain .ltoreq.500 ppm of low-molecular-weight siloxane which has a vapor pressure .gtoreq.10 mmHg at 200.degree. C.

公开(公告)号：US20120280169A1

公开(公告)日：2012-11-08

申请号：US13520144

申请日：2011-01-07

Applicant: Tomoko Kato ,  Kazumi Nakayoshi

Inventor： Tomoko Kato ,  Kazumi Nakayoshi

IPC: C09K5/00

CPC classification number: C10M169/02 ,  C10M169/00 ,  C10M169/06 ,  C10M2201/056 ,  C10M2201/0606 ,  C10M2201/0616 ,  C10M2201/0626 ,  C10M2201/105 ,  C10M2201/1056 ,  C10M2227/04 ,  C10M2227/065 ,  C10M2227/08 ,  C10M2227/09 ,  C10M2229/02 ,  C10M2229/041 ,  C10M2229/043 ,  C10M2229/046 ,  C10N2220/082 ,  C10N2230/08 ,  C10N2240/20 ,  C10N2250/10

Abstract: A thermally conductive silicone grease composition comprises: (A) an organopolysiloxane represented by the following general formula: wherein each R1 is independently selected from monovalent hydrocarbon groups, each X is independently selected from monovalent hydrocarbon groups or alkoxysilyl-containing groups of the following general formula: —R2—SiR1a(OR3)(3-a) wherein R1 is defined as above, R2 is an oxygen atom or an alkylene group, R3 is an alkyl group, a is an integer ranging from 0 to 2, m is an integer equal to or greater than 0, and n is an integer equal to or greater than 0; (B) a thermally conductive filler; and (C) an aluminum-based or titanium-based coupling agent. The composition exhibits excellent heat resistance and reduced oil bleeding.

Abstract translation: 导热硅脂组合物包含：（A）由以下通式表示的有机聚硅氧烷：其中每个R 1独立地选自一价烃基，每个X独立地选自下列通式中的一价烃基或含烷氧基甲硅烷基的基团 ：-R2-SiR1a（OR3）（3-a）其中R1如上定义，R2是氧原子或亚烷基，R3是烷基，a是0-2的整数，m是整数 等于或大于0，n是等于或大于0的整数; （B）导热填料; 和（C）铝基或钛基偶联剂。 该组合物显示出优异的耐热性和减少的油渗出。

公开(公告)号：US20100155653A1

公开(公告)日：2010-06-24

申请号：US12714174

申请日：2010-02-26

Applicant: Kazumi Nakayoshi ,  Hiroki Ishikawa ,  Ryoto Shima ,  Katsutoshi Mine

Inventor： Kazumi Nakayoshi ,  Hiroki Ishikawa ,  Ryoto Shima ,  Katsutoshi Mine

IPC: C09K5/00 ,  H01B1/22

CPC classification number: C08L83/04 ,  C08G77/12 ,  C08G77/20 ,  C08K9/04 ,  C09J183/04 ,  H05K3/321

Abstract: A silver-based powder is surface-treated with an oxidation inhibitor by means of a mechanochemical reaction. A method of preparation of the silver-based powder includes using an organic solution of the oxidation inhibitor as a lubricating agent, applying mechanical energy to the silver-based powder, and subjecting the silver-based powder to surface treatment with said oxidation inhibitor by means of a mechanochemical reaction.

Abstract translation: 通过机械化学反应用氧化抑制剂对银基粉末进行表面处理。 制备银基粉末的方法包括使用氧化抑制剂的有机溶液作为润滑剂，向银基粉末施加机械能，并用所述氧化抑制剂对银基粉末进行表面处理 的机械化学反应。

公开(公告)号：US07074849B2

公开(公告)日：2006-07-11

申请号：US10822888

申请日：2004-04-13

Applicant: Kazumi Nakayoshi ,  Katsutoshi Mine ,  Rikako Tazawa

Inventor： Kazumi Nakayoshi ,  Katsutoshi Mine ,  Rikako Tazawa

IPC: B05D3/02 ,  C08K9/06 ,  C08L83/05 ,  C08L83/06 ,  C08L83/07

CPC classification number: H01B1/22 ,  C08G77/045 ,  C08G77/12 ,  C08G77/14 ,  C08G77/16 ,  C08G77/18 ,  C08G77/20 ,  C08G77/70 ,  C08K3/08 ,  C08K9/06 ,  C08L83/04 ,  C08L83/00 ,  C08L2666/54

Abstract: The electrical properties, particularly contact resistance and volume resistivity, of materials prepared by curing organosiloxane compositions containing finely divided silver as the electroconductive filler are improved by treating the silver particles with an organosilicon compound prior to incorporating the particles into the organosiloxane composition.

公开(公告)号：US20060047043A1

公开(公告)日：2006-03-02

申请号：US10536669

申请日：2003-11-17

Applicant: Kazumi Nakayoshi ,  Hiroki Ishikawa ,  Ryoto Shima ,  Katsutoshi Mine

Inventor： Kazumi Nakayoshi ,  Hiroki Ishikawa ,  Ryoto Shima ,  Katsutoshi Mine

IPC: C08K3/22

CPC classification number: C08L83/04 ,  C08G77/12 ,  C08G77/20 ,  C08K9/04 ,  C09J183/04 ,  H05K3/321

Abstract: A silver-based powder is surface-treated with an oxidation inhibitor by means of a mechanochemical reaction. A method of preparation of the silver-based powder includes using an organic solution of the oxidation inhibitor as a lubricating agent, applying mechanical energy to the silver-based powder, and subjecting the silver-based powder to surface treatment with said oxidation inhibitor by means of a mechanochemical reaction.

Abstract translation: 通过机械化学反应用氧化抑制剂对银基粉末进行表面处理。 制备银基粉末的方法包括使用氧化抑制剂的有机溶液作为润滑剂，向银基粉末施加机械能，并用所述氧化抑制剂对银基粉末进行表面处理 的机械化学反应。