公开(公告)号：US20120040180A1

公开(公告)日：2012-02-16

申请号：US13254077

申请日：2010-02-16

Applicant: Marc Husemann ,  Nils Utesch

Inventor： Marc Husemann ,  Nils Utesch

IPC: B32B3/00 ,  C09J183/04 ,  C09J183/05 ,  B32B7/12

CPC classification number: C09J183/04 ,  C08G77/12 ,  C08G77/20 ,  C08G77/70 ,  C08G2170/40 ,  C08L83/00 ,  Y10T428/265 ,  Y10T428/28

Abstract: The present invention relates to the use of an adhesive compound, in particular a pressure-sensitive adhesive compound, based on silylated polyurethanes for bonding optical components, in particular optical films, wherein the adhesive compound has a transmission according to ASTM D 1003 of greater than 86% and a haze according to ASTM D 1003 of less than 5%.

Abstract translation: 本发明涉及使用基于甲硅烷基化聚氨酯的粘合剂化合物，特别是压敏粘合剂化合物，用于粘合光学组件，特别是光学膜，其中粘合剂化合物具有根据ASTM D 1003的透射率大于 86％，根据ASTM D 1003的雾度小于5％。

公开(公告)号：US20110250460A1

公开(公告)日：2011-10-13

申请号：US13124618

申请日：2009-10-16

Applicant: Tomohide Banba ,  Tatsuya Suzuki ,  Hiroaki Fumoto ,  Yasushi Buzoujima

Inventor： Tomohide Banba ,  Tatsuya Suzuki ,  Hiroaki Fumoto ,  Yasushi Buzoujima

IPC: B32B7/12 ,  C09J183/05 ,  B32B17/10

CPC classification number: C08G65/336 ,  C08G77/12 ,  C08L71/02 ,  C09J171/02 ,  C09J183/04 ,  Y10T428/31612

Abstract: The invention provides a transparent adhesive sheet for a flat panel display, which does not permit delamination on the adhesion surface to the glass plate even if a stress such as distortion, bending and the like is applied to the display, and does not produce bubbles in the boundary with the glass plate. The transparent adhesive sheet for a flat panel display comprised of a cured product of a composition comprising (A) a polyoxyalkylene based polymer having at least one alkenyl group in one molecule, (B) a compound having an average of not less than 2 hydrosilyl groups in one molecule, and (C) a hydrosilylation catalyst.

Abstract translation: 本发明提供了一种用于平板显示器的透明粘合片，即使对显示器施加诸如变形，弯曲等的应力也不会在玻璃板的粘合表面上分层，并且不会在玻璃板上产生气泡 与玻璃板的边界。 用于平板显示器的透明粘合片由包含（A）在一分子中具有至少一个烯基的聚氧化烯系聚合物的组合物的固化物构成，（B）平均不少于2个氢甲硅烷基的化合物 在一个分子中，和（C）氢化硅烷化催化剂。

公开(公告)号：US20080289760A1

公开(公告)日：2008-11-27

申请号：US12124556

申请日：2008-05-21

Applicant: Hidenori Koshikawa ,  Mikio Shiono ,  Hiroyasu Hara ,  Takashi Aketa

Inventor： Hidenori Koshikawa ,  Mikio Shiono ,  Hiroyasu Hara ,  Takashi Aketa

IPC: C09J183/05 ,  C08L83/04 ,  C08L83/05

CPC classification number: C08G65/007 ,  C08G2650/48 ,  C08K5/0025 ,  C08L83/00 ,  C08L83/08 ,  C08L2666/34 ,  C09J171/02

Abstract: A heat-curable fluoropolyether adhesive composition comprising (A) a linear polyfluoro compound having at least two alkenyl groups and a perfluoropolyether structure, (B) a fluorinated organohydrogensiloxane having at least two SiH groups, (C) a platinum group metal catalyst, (D) an organosiloxane having at least one SiH group and at least one epoxy and/or trialkoxysilyl group, and (E) a compound having at least two allyloxycarbonyl groups can be cured to metal and plastic substrates by heating at a temperature from 20° C. to less than 100° C.

Abstract translation: 一种可热固化的氟聚醚粘合剂组合物，其包含（A）具有至少两个烯基和全氟聚醚结构的线性多氟化合物，（B）具有至少两个SiH基团的氟化有机氢硅氧烷，（C）铂族金属催化剂，（D ）具有至少一个SiH基团和至少一个环氧基和/或三烷氧基甲硅烷基的有机硅氧烷，和（E）具有至少两个烯丙氧基羰基的化合物可以通过在20℃的温度下加热固化到金属和塑料基材上。 至小于100℃

公开(公告)号：US20050042462A1

公开(公告)日：2005-02-24

申请号：US10895867

申请日：2004-07-21

Applicant: Armin Fehn ,  Philipp Mueller

Inventor： Armin Fehn ,  Philipp Mueller

IPC: B32B27/00 ,  B32B27/16 ,  C08L83/04 ,  C08L83/05 ,  C08L83/07 ,  C09D183/04 ,  C09D183/05 ,  C09D183/07 ,  C09J183/04 ,  C09J183/05 ,  C09J183/07 ,  B32B9/04

CPC classification number: C09D183/04 ,  C08G77/12 ,  C08G77/14 ,  C08G77/16 ,  C08G77/20 ,  C08G77/24 ,  C08G77/26 ,  C08G77/28 ,  C08G77/30 ,  C08G77/70 ,  C08L83/00 ,  C08L83/04 ,  C08L2666/28 ,  C09J183/04 ,  Y10T428/31663

Abstract: Self-adhesive addition-crosslinking silicone compositions, contain two adhesion promoters, a first, multinuclear aromatic compound containing at least one moiety of aliphatic unsaturation, and a low viscosity organopolysiloxane having at least one terminal, silicon-bonded hydrogen. The addition curable materials exhibit strong adhesion to substrates, even substrates which have exhibited problematic adhesion to silicone elastomers in the past.

Abstract translation: 自粘加成交联硅氧烷组合物含有两种粘合促进剂，含有至少一个脂族不饱和部分的第一种多核芳族化合物和具有至少一个末端硅键合氢的低粘度有机聚硅氧烷。 可加成固化的材料表现出对基材，即使是过去表现出对硅氧烷弹性体有粘着性的基材的强粘合性。

公开(公告)号：US5120810A

公开(公告)日：1992-06-09

申请号：US522013

申请日：1990-05-11

Applicant: Hironao Fujiki ,  Mikio Shiono ,  Toshiaki Takahashi

Inventor： Hironao Fujiki ,  Mikio Shiono ,  Toshiaki Takahashi

IPC: C08G77/14 ,  C08K3/10 ,  C08K5/5435 ,  C08K5/549 ,  C08L83/05 ,  C08L83/07 ,  C09D183/04 ,  C09D183/05 ,  C09D183/07 ,  C09J183/00 ,  C09J183/04 ,  C09J183/05 ,  C09J183/07

CPC classification number: C09J183/04

Abstract: This invention discloses an adhesive organopolysiloxane compositions which cure in the presence of addition reaction catalysts and adhere firmly to various materials when they harden comprising;(1) 100 parts by weight of an organopolysiloxane containing at least alkenyl groups bonded to silicon atoms in 1 molecule,(2) an organohydrogenpolysiloxane containing at least 3 hydrogen atoms bonded to silicon atoms in 1 molecule, in sufficient quantity to donate 0.5-10 hydrogen atoms bonded to silicon atoms to 1 alkenyl group in said 1st constituent,(3) 0.1-20 parts by weight of an organosilicone compound containing at least 1 hydrogen atom bonded to silicon atoms, at least 1 fluoroalkyl group or fluoroalkylether group bonded to silicon atoms via carbon atoms and at least 1 epoxy group and/or trialkoxysilyl group bonded to silicon atoms via carbon atoms in 1 molecule, and(4) platinum or a platinum compound in suitable quantity to act as a catalyst.

Abstract translation: 本发明公开了一种粘合剂有机聚硅氧烷组合物，其在加成反应催化剂存在下固化，并且在硬化时牢固地粘附到各种材料上， （1）100重量份在1分子中至少含有与硅原子键合的烯基的有机聚硅氧烷，（2）在1分子中含有至少3个与硅原子键合的氢原子的有机氢聚硅氧烷，以足够的量配合0.5-10 所述第一成分中与硅原子键合至1个烯基的氢原子，（3）0.1-20重量份含有至少1个与硅原子键合的氢原子的有机硅化合物，至少1个氟烷基或与硅键合的氟烷基 通过碳原子和至少1个环氧基和/或通过1分子中的碳原子键合到硅原子上的三烷氧基甲硅烷基，和（4）铂或铂化合物以合适的量作为催化剂。

公开(公告)号：US5082706A

公开(公告)日：1992-01-21

申请号：US276178

申请日：1988-11-23

Applicant: Thomas J. Tangney

Inventor： Thomas J. Tangney

IPC: C08L83/05 ,  C08L83/07 ,  C08L83/08 ,  C09D183/08 ,  C09J7/02 ,  C09J183/00 ,  C09J183/04 ,  C09J183/05 ,  C09J183/07

CPC classification number: C09D183/08 ,  C09J183/04 ,  C09J7/0207 ,  Y10T428/1429 ,  Y10T428/2839 ,  Y10T428/2852 ,  Y10T428/31663

Abstract: Addition-curable silicone pressure sensitive adhesives can be covered with an addition-cured fluorosilicone release coating to provide a releasable laminate. The release force of the laminate is low to moderate and the subsequent adhesion and tack of the adhesive is high and all three values are stable with time. The laminate can be prepared by contacting the release coating with cured adhesive or by curing the adhesive in contact with the release coating.

公开(公告)号：US12134718B2

公开(公告)日：2024-11-05

申请号：US17331851

申请日：2021-05-27

Applicant: DELTA ELECTRONICS (SHANGHAI) CO., LTD.

Inventor： Peiai You ,  Hao Sun ,  Zhen Zhou ,  Minli Jia

IPC: C09J183/05 ,  B32B27/20 ,  C09J11/04 ,  C09J11/08 ,  C09J183/04 ,  C09K5/14 ,  H01F27/22 ,  H01F27/32

Abstract: The present disclosure relates to a potting adhesive, including: a component A and a component B, the component A including a first liquid organic adhesive containing dimethyl siloxane, the component B including a second liquid organic adhesive containing methyl hydrogen siloxane and silicone oil, at least one of the component A and the component B further including ceramic particles which are spherical particles with a particle size of 0.1 mm to 3 mm. The present disclosure further relates to a heat dissipation device, including an adhesive potting groove, a transformer provided in the adhesive potting groove, and a filling medium which fills and is consolidated in a gap between the transformer and the adhesive potting groove.

公开(公告)号：US5981682A

公开(公告)日：1999-11-09

申请号：US878723

申请日：1997-06-19

Applicant: Masayuki Onishi

Inventor： Masayuki Onishi

IPC: C09J183/05 ,  C08L83/07 ,  C09J183/00 ,  C09J183/04 ,  C09J183/07 ,  G11B7/24 ,  G11B7/257 ,  G11B7/26 ,  C08G77/12 ,  C08G77/14

CPC classification number: G11B7/256 ,  C09J183/04 ,  G11B7/24 ,  G11B7/26 ,  G11B2007/24314 ,  G11B2007/24316 ,  G11B2007/2432 ,  G11B7/2533 ,  G11B7/2534 ,  G11B7/2585

Abstract: A silicone composition curable to a silicone bonding agent that is suitable for use in manufacturing an optical memory element comprises:(A) 100 parts by weight of an organopolysiloxane having an average of at least two silicon-bonded alkoxy groups per molecule and an average of at least two silicon-bonded alkenyl groups per molecule, wherein the alkoxy groups and the alkenyl groups are in the same molecule;(B) an organohydrogenpolysiloxane having an average of at least two silicon-bonded hydrogen atoms per molecule, wherein the molar ratio of silicon-bonded hydrogen atoms in component (B) to silicon-bonded alkenyl groups in component (A) is from 0.3:1 to 20:1;(C) 0.01 to 20 parts by weight of a metal condensation reaction catalyst wherein the metal of said metal condensation reaction catalyst is selected from the group consisting of titanium, zirconium and aluminum; and(D) a catalytic amount of a hydrosilylation reaction catalyst. The composition is cured by an addition reaction and a condensation reaction.

Abstract translation: 适用于制造光学记忆元件的硅酮粘合剂可固化的有机硅组合物包括：（A）100重量份有机聚硅氧烷，每分子平均具有至少两个与硅键合的烷氧基，平均为 每个分子中至少有两个硅键合的烯基，其中烷氧基和烯基在同一分子中; （B）每分子平均具有至少两个硅键合的氢原子的有机氢聚硅氧烷，其中组分（B）中与硅键合的氢原子与组分（A）中与硅键合的烯基的摩尔比为0.3： 1〜20：1; （C）0.01〜20重量份的金属缩合反应催化剂，其中所述金属缩合反应催化剂的金属选自钛，锆和铝; 和（D）催化量的氢化硅烷化反应催化剂。 通过加成反应和缩合反应使组合物固化。

公开(公告)号：US5360858A

公开(公告)日：1994-11-01

申请号：US158366

申请日：1993-11-29

Applicant: Hironao Fujiki ,  Kaoru Michimata ,  Atsushi Yaginuma ,  Nobuyuki Hasebe ,  Clara Y. Kim

Inventor： Hironao Fujiki ,  Kaoru Michimata ,  Atsushi Yaginuma ,  Nobuyuki Hasebe ,  Clara Y. Kim

IPC: C08G77/12 ,  C08K5/57 ,  C09J183/00 ,  C09J183/04 ,  C09J183/05 ,  C09J183/07 ,  C08G77/08 ,  C08K3/10

CPC classification number: C09J183/04 ,  C08K5/57

Abstract: To a silicone rubber adhesive composition comprising (A) a diorganopolysiloxane containing at least two alkenyl groups in a molecule, (B) a diorganohydrogenpolysiloxane having at least two hydrogen atoms directly attached to silicon atoms in a molecule and a viscosity of about 5 to about 5,000 cs at 25.degree.C., (C) an adhesion modifier compound containing in its molecule a group represented by (RO).sub.3 Si-- or H(RO).sub.2 Si-- wherein R is selected from the group consisting of methyl, ethyl, trifluoroethyl, hexafluoropropyl, and methoxyethyl groups, and (D) a platinum catalyst is added (E) an organic tin compound. The combined use of components (C) and (E) provides he synergistic effect that the resulting adhesive composition can firmly adhere to even polycarbonate and polyphenylene sulfide resins which are known as difficultly bondable resins.

Abstract translation: 对于包含（A）在分子中含有至少两个烯基的二有机聚硅氧烷的硅橡胶粘合剂组合物，（B）具有至少两个氢原子的二有机氢聚硅氧烷，其直接与分子中的硅原子连接，粘度约为5至约5,000 （C）在其分子中含有由（RO）3 Si 3或H（RO）2 -Si表示的基团的粘合改性剂化合物，其中R选自甲基，乙基，三氟乙基，六氟丙基 和甲氧基乙基，和（D）铂催化剂（E）有机锡化合物。 组合物（C）和（E）的组合使用提供了所得粘合剂组合物可以牢固地粘附到称为难粘合树脂的甚至聚碳酸酯和聚苯硫醚树脂的协同效应。

公开(公告)号：US5292586A

公开(公告)日：1994-03-08

申请号：US675232

申请日：1991-03-26

Applicant: Shaow B. Lin ,  Jeffrey H. Wengrovius

Inventor： Shaow B. Lin ,  Jeffrey H. Wengrovius

IPC: C09J183/00 ,  C09J183/04 ,  C09J183/07 ,  C09J7/02 ,  C09J183/05

CPC classification number: C09J183/04 ,  Y10T428/2852

Abstract: Solventless or low solvent-containing silicone pressure sensitive adhesive compositions having excellent adhesive strength and high tack are provided, comprising (A) a toluene-soluble resinous copolymer containing R.sub.3 SiO.sub.1/2 units and SiO.sub.4/2 units; (B) a vinyi-endblocked polydiorganosiloxane having a viscosity of 10 to 500 centipoise at 250.degree. C.; (C) a hydride-endblocked polydiorganosiloxane having a viscosity of 10 to 1,000 centipoise at 250.degree. C.; the ratio of silicon-bonded hydrogen atoms in (C) to olefinically unsaturated radicals in the total of (A) and (B), being in the range of from about 1.2:1 to about 15.0:1; and (D) a hydrosilation catalyst.

Abstract translation: 提供了具有优异的粘合强度和高粘性的无溶剂或低溶剂的硅氧烷压敏粘合剂组合物，其包含（A）含有R3SiO1 / 2单元和SiO4 / 2单元的甲苯可溶性树脂共聚物; （B）在250℃粘度为10-500厘泊的乙烯封端的聚二有机硅氧烷; （C）氢化物封端的聚二有机硅氧烷，其在250℃下的粘度为10至1,000厘泊。 在（A）和（B）的总量中，（C）中的与硅键合的氢原子与烯属不饱和基团的比例在约1.2:1至约15.0:1的范围内; 和（D）硅氢化催化剂。