公开(公告)号：US08247516B2

公开(公告)日：2012-08-21

申请号：US12739343

申请日：2008-10-06

申请人： Akiko Nabeta ,  Masayuki Onishi ,  Yoshito Ushio

发明人： Akiko Nabeta ,  Masayuki Onishi ,  Yoshito Ushio

IPC分类号： C08L83/04

CPC分类号： C08L83/04 ,  C08G77/18 ,  C08K5/0091 ,  C08K5/5419 ,  C08L2666/52 ,  C08L2666/44

摘要： A room-temperature curable organopolysiloxane composition comprising: (A) a diorganopolysiloxane capped at both molecular terminals with trialkoxysilyl groups and having viscosity of 100 to 1,000,000 mPas at 25° C.; (B) a diorganodimethoxysilane or a partially hydrolyzed product thereof; (C) a diorganodialkoxysilane having silicon-bonded alkoxy group with two or more carbon atoms or a partially hydrolyzed product thereof; and (D) a titanium chelate catalyst, exhibits excellent storage stability and easiness of controlling curing speed as well as by strong adhesion to a substrate with which this composition is in contact during curing along with the possibility of interfacial peeling of the cured product from the aforementioned substrate.

摘要翻译： 一种室温可固化的有机基聚硅氧烷组合物，其包含：（A）在两个分子末端用三烷氧基甲硅烷基封端的二有机聚硅氧烷，并且在25℃下具有100至1,000,000mPas的粘度; （B）二有机二甲氧基硅烷或其部分水解产物; （C）具有硅键合的具有两个或更多个碳原子的烷氧基的二有机二烷氧基硅烷或其部分水解产物; 和（D）钛螯合催化剂，表现出优异的储存稳定性和控制固化速度的容易性，以及通过对固化期间该组合物接触的基材的强粘合性以及固化产物的界面剥离的可能性 上述基材。

公开(公告)号：US20110180938A1

公开(公告)日：2011-07-28

申请号：US13005741

申请日：2011-01-13

申请人： Kazuya HIRASAWA ,  Yuuji Ootani ,  Akiyoshi Asai ,  Hirokazu Imai ,  Hiroyoshi Kunieda ,  Harumi Kodama ,  Masayuki Onishi ,  Ryo Sakaguchi ,  Kazumi Nakayoshi

发明人： Kazuya HIRASAWA ,  Yuuji Ootani ,  Akiyoshi Asai ,  Hirokazu Imai ,  Hiroyoshi Kunieda ,  Harumi Kodama ,  Masayuki Onishi ,  Ryo Sakaguchi ,  Kazumi Nakayoshi

IPC分类号： H01L23/48 ,  H01L21/50

CPC分类号： H01L23/4334 ,  C08G77/04 ,  C08G77/20 ,  C08L83/04 ,  H01L23/296 ,  H01L23/3121 ,  H01L23/36 ,  H01L23/49531 ,  H01L24/13 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/0781 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/19107 ,  C08L83/00 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： In an electronic device, a silicone adhesive bonding first and second members is made from a composition comprising: (A) 100 parts by mass of an organopolysiloxane containing in one molecule at least two alkenyl groups and being free of silicon-bonded hydroxyl and alkoxy groups wherein the content of cyclic siloxanes having 4 to 20 siloxane units is at most 0.1 mass %; (B) an organopolysiloxane containing in one molecule at least two silicon-bonded hydrogen atoms and being free of an alkenyl group, and silicon-bonded hydroxyl and alkoxy groups; (C) at least 0.05 parts by mass of an adhesion promoter; (D) 100 to 2000 parts by mass of a thermally conductive filler; and (E) a hydrosilylation-reaction catalyst. (B) is contained such that the silicon-bonded hydrogen atoms is in the range of 0.5 to 10 mol per 1 mol of the alkenyl groups of (A), and the sum of (B) and (C) is 0.5 to 10 mass % of the sum of (A), (B) and (C).

摘要翻译： 在电子设备中，粘合第一和第二构件的硅氧烷粘合剂由以下组合物制成：（A）100质量份在一分子中含有至少两个烯基并且不含硅键合的羟基和烷氧基的有机聚硅氧烷 其中具有4〜20个硅氧烷单元的环状硅氧烷的含量为0.1质量％以下。 （B）在一个分子中含有至少两个与硅键合的氢原子并且不含烯基的有机聚硅氧烷和与硅键合的羟基和烷氧基; （C）至少0.05质量份粘合促进剂; （D）100〜2000质量份导热性填料; 和（E）氢化硅烷化反应催化剂。 包含（B），使得与（A）的链烯基相比，与硅键合的氢原子为0.5〜10摩尔的范围，（B）和（C）的和为0.5〜10质量％ （A），（B）和（C）的总和的百分比。

公开(公告)号：US07329706B2

公开(公告)日：2008-02-12

申请号：US10476998

申请日：2002-05-14

申请人： Hiroshi Fukui ,  Manabu Sutoh ,  Hiroji Enami ,  Masayuki Onishi ,  Tadashi Okawa ,  Satoshi Onodera

发明人： Hiroshi Fukui ,  Manabu Sutoh ,  Hiroji Enami ,  Masayuki Onishi ,  Tadashi Okawa ,  Satoshi Onodera

IPC分类号： C08L83/05

CPC分类号： C08L83/04 ,  C08G77/045 ,  C08G77/12 ,  C08G77/14 ,  C08G77/16 ,  C08G77/18 ,  C08G77/20 ,  C08K3/22 ,  C08K9/06 ,  C08L83/14 ,  C08L83/00

摘要： A heat-conductive silicone composition comprising at least (A) an organopolysiloxane, (B) a heat-conductive filler, and (C) a specific organosiloxane. The silicone composition is excellent in handleability, even when it contains a large amount of a heat-conductive filler for the purpose of attaining higher heat conductivity.

摘要翻译： 包含至少（A）有机聚硅氧烷，（B）导热填料和（C）特定有机硅氧烷的导热硅氧烷组合物。 硅氧烷组合物即使在含有大量导热性填料的情况下也具有优异的操作性，因此为了达到更高的导热性。

公开(公告)号：US20070009748A1

公开(公告)日：2007-01-11

申请号：US10570115

申请日：2004-08-27

申请人： Akiko Takanami ,  Yoshito Ushio ,  Osamu Mitani ,  Masayuki Onishi

发明人： Akiko Takanami ,  Yoshito Ushio ,  Osamu Mitani ,  Masayuki Onishi

IPC分类号： B32B27/00 ,  C09J183/04 ,  C08L83/04

CPC分类号： B32B25/20 ,  B32B25/08 ,  B32B2319/00 ,  B32B2405/00 ,  B32B2457/202 ,  C08G77/12 ,  C08G77/20 ,  C08G2170/40 ,  C08L83/00 ,  C09J7/10 ,  C09J7/38 ,  C09J183/04 ,  C09J2483/00 ,  G02F2202/28 ,  Y10T428/31663 ,  Y10T428/31786

摘要： Adhesive silicone elastomer sheet afforded by the cure of a hydrosilylation-curing silicone elastomer composition comprising: (A) an organopolysiloxane that contains at least one diorganosiloxane unit and that has at least two silicon-bonded alkenyl groups in each molecule, (B) an organopolysiloxane resin with the average unit formula: (R13SiO1/2)x(SiO4/2)1.0 in which R1 is substituted or unsubstituted monovalent hydrocarbon group and x is a number from 0.5 to 1.0, (C) an organopolysiloxane that contains at least two silicon-bonded hydrogen atoms in each molecule, and (D) a hydrosilylation catalyst. The adhesive silicone elastomer sheet is transparent, and whose surface exhibits a stable and permanent adhesiveness.

摘要翻译： 通过固化氢化硅烷化固化的硅氧烷弹性体组合物提供的粘合硅氧烷弹性体片，其包含：（A）含有至少一个二有机硅氧烷单元并且在每个分子中具有至少两个硅键合的烯基的有机聚硅氧烷，（B）有机聚硅氧烷 具有平均单元式的树脂：（R 1）3 SiO 2（SiO 2）x（SiO） 其中R 1为取代或未取代的一价烃基，x为0.5至1.0的数，（C）有机聚硅氧烷，其中R 1为 在每个分子中含有至少两个与硅键合的氢原子，和（D）氢化硅烷化催化剂。 粘合性硅氧烷弹性体片是透明的，其表面具有稳定且永久的粘合性。

公开(公告)号：US06268432B1

公开(公告)日：2001-07-31

申请号：US09409504

申请日：1999-09-30

申请人： Toshiki Nakata ,  Masayuki Onishi

发明人： Toshiki Nakata ,  Masayuki Onishi

IPC分类号： C08K509

CPC分类号： C08K5/10 ,  C08G77/16 ,  C08L83/04 ,  H05K3/284 ,  H05K3/285 ,  C08L2666/26

摘要： A filler/adhesive agent for display units containing a condensation reaction curable silicone composition including air oxidation-curable unsaturated compounds and for use as a filler or adhesive in display units whose construction is such that the cured product of said composition is exposed in the display section, which composition is capable of forming matte finished cured products with insignificant surface tact, is disclosed.

摘要翻译： 一种用于显示单元的填料/粘合剂，其含有包含空气可氧化固化的不饱和化合物的缩合反应可固化的有机硅组合物，并用作显示单元中的填料或粘合剂，其结构使得所述组合物的固化产物在显示部分中暴露 ，该组合物能够形成具有微不足道的表面触感的无光泽的成品固化产品。

公开(公告)号：US5625022A

公开(公告)日：1997-04-29

申请号：US619782

申请日：1996-03-21

申请人： Masayuki Onishi

发明人： Masayuki Onishi

IPC分类号： C08K5/54 ,  C08K5/057 ,  C08K5/5419 ,  C08K5/56 ,  C08L83/04 ,  C08L83/05 ,  C08L83/06 ,  C08L83/07 ,  H05K3/28 ,  C08G77/08

CPC分类号： C08L83/04 ,  C08G77/12 ,  C08G77/18 ,  C08G77/20 ,  C08G77/24 ,  H05K3/285

摘要： Curable organopolysiloxane composition that undergoes a uniform curb by both condensation and addition reactions without being subject to cure inhibition by cure inhibitors and thereby produces cured silicone that is strongly adherent to any of various substrates residing in contact with the composition during its cure. The curable organopolysiloxane composition is a mixture of organopolysiloxane with at least 2 silicon-bonded alkoxy groups in each molecule and organopolysiloxane with at least 2 silicon-bonded lower alkenyl groups in each molecule, an organopolysiloxane containing at least 2 silicon-bonded hydrogen atoms in each molecule, an alkoxysilane of the formula R.sup.1.sub.x Si(OR.sup.2).sub.(4-x) where R.sup.1 is a monovalent hydrocarbon group, R.sup.2 is alkyl or alkoxyalkyl, and x is 0, 1, or 2 or partial hydrolysis condensate thereof, an organozirconium compound or an organoaluminum compound, and a hydrosilylation reaction catalyst in a catalytic quantity.

摘要翻译： 可固化的有机基聚硅氧烷组合物通过缩合和加成反应经历均匀的路缘，而不受固化抑制剂的固化抑制，从而产生固化的硅氧烷，其固化在与组合物固化期间接触的各种基质中的任何基质上。 可固化的有机聚硅氧烷组合物是每个分子中具有至少2个与硅键合的烷氧基的有机聚硅氧烷和每个分子中具有至少2个硅键合的低级烯基的有机聚硅氧烷的混合物，每个分子中至少含有2个与硅键合的氢原子的有机聚硅氧烷 分子，式R1xSi（OR2）（4-x）的烷氧基​​硅烷，其中R1是一价烃基，R2是烷基或烷氧基烷基，x是0,1或2或其部分水解缩合物，有机锆化合物或 有机铝化合物和催化剂的氢化硅烷化反应催化剂。

公开(公告)号：US08957153B2

公开(公告)日：2015-02-17

申请号：US14009671

申请日：2012-03-28

申请人： Harumi Kodama ,  Masayuki Onishi

发明人： Harumi Kodama ,  Masayuki Onishi

IPC分类号： C08L83/04 ,  C08K3/36 ,  C08L83/14 ,  C08G77/18

CPC分类号： C08K3/36 ,  C08G77/18 ,  C08G77/50 ,  C08K5/5419 ,  C08K5/57 ,  C08L83/00 ,  C08L83/14 ,  C08L2666/52 ,  C08L2666/44

摘要： A room-temperature-curable silicone rubber composition comprises: (A) an organopolysiloxane having on silicon atoms in the molecular chain in one molecule at least two specific alkoxysilyl-containing groups; (B) an organopolysiloxane having on silicon atom in the molecular chain neither a hydroxyl group nor an alkoxy group; (C) an alkoxysilane or its partial hydrolysis and condensation product; (D) a condensation reaction catalyst; and optionally comprises (E) an adhesion promoter and/or (F) a reinforcing filler. The composition cures at room temperature due to contact with atmospheric moisture and exhibits an excellent adhesiveness to substrate in contact with the composition during the cure of the composition.

摘要翻译： 室温可固化的硅橡胶组合物包含：（A）在一分子中具有至少两个特定的含有烷氧基甲硅烷基的基团的分子链上的硅原子上的有机聚硅氧烷; （B）在分子链中的硅原子上既不具有羟基也不具有烷氧基的有机聚硅氧烷; （C）烷氧基硅烷或其部分水解和缩合产物; （D）缩合反应催化剂; 并且任选地包含（E）粘合促进剂和/或（F）增强填料。 组合物由于与大气湿气接触而在室温下固化，并且在组合物固化期间与组合物接触时对基材表现出优异的粘附性。

公开(公告)号：US20120292558A1

公开(公告)日：2012-11-22

申请号：US13574830

申请日：2011-01-20

申请人： Harumi Kodama ,  Masayuki Onishi ,  Ryo Sakaguchi ,  Kazumi Nakayoshi

发明人： Harumi Kodama ,  Masayuki Onishi ,  Ryo Sakaguchi ,  Kazumi Nakayoshi

IPC分类号： C09K5/00

CPC分类号： H01L23/296 ,  C08G77/20 ,  C08L83/04 ,  H01L2924/0002 ,  H01L2924/09701 ,  C08L83/00 ,  H01L2924/00

摘要： A thermally conductive silicone rubber composition comprises: (A) an organopolysiloxane that contains at least two silicon-bonded alkenyl groups in each molecule, that does not contain silicon-bonded hydroxyl and alkoxy groups, and that has a content of cyclic siloxanes having from 4 to 20 siloxane units of not more than 1,000 ppm in mass units; (B) an organopolysiloxane that contains at least two silicon-bonded hydrogen atoms in each molecule and that does not contain silicon-bonded alkenyl, hydroxyl group, and alkoxy groups; (C) an adhesion promoter; (D) a thermally conductive filler; and (E) a hydrosilylation reaction catalyst; wherein the total quantity of components (B) and (C) is from 0.5 to 10 mass % of the total quantity of components (A), (B), and (C). The composition is characterized by reduced oil fraction that bleeds out during the course of curing, and by reduced low-boiling fraction that volatilizes during the course of curing.

摘要翻译： 导热硅橡胶组合物包含：（A）在每个分子中含有至少两个硅键合的烯基的有机聚硅氧烷，其不含硅键合的羟基和烷氧基，并且具有含有4个 至20个以质量计不超过1000ppm的硅氧烷单元; （B）在每个分子中含有至少两个与硅键合的氢原子并且不含硅键合的烯基，羟基和烷氧基的有机聚硅氧烷; （C）粘合促进剂; （D）导热填料; 和（E）氢化硅烷化反应催化剂; 其中组分（B）和（C）的总量为组分（A），（B）和（C）总量的0.5至10质量％。 组合物的特征在于在固化过程中渗出的油馏分减少，以及在固化过程中挥发挥发的低沸点馏分的降低。

公开(公告)号：US20100236450A1

公开(公告)日：2010-09-23

申请号：US12739343

申请日：2008-10-06

申请人： Akiko Nabeta ,  Masayuki Onishi ,  Yoshito Ushio

发明人： Akiko Nabeta ,  Masayuki Onishi ,  Yoshito Ushio

IPC分类号： C09D183/04

CPC分类号： C08L83/04 ,  C08G77/18 ,  C08K5/0091 ,  C08K5/5419 ,  C08L2666/52 ,  C08L2666/44

摘要： A room-temperature curable organopolysiloxane composition comprising: (A) a diorganopolysiloxane capped at both molecular terminals with trialkoxysilyl groups and having viscosity of 100 to 1,000,000 mPas at 25° C.; (B) a diorganodimethoxysilane or a partially hydrolyzed product thereof; (C) a diorganodialkoxysilane having silicon-bonded alkoxy group with two or more carbon atoms or a partially hydrolyzed product thereof; and (D) a titanium chelate catalyst, exhibits excellent storage stability and easiness of controlling curing speed as well as by strong adhesion to a substrate with which this composition is in contact during curing along with the possibility of interfacial peeling of the cured product from the aforementioned substrate.

摘要翻译： 一种室温可固化的有机基聚硅氧烷组合物，其包含：（A）在两个分子末端用三烷氧基甲硅烷基封端的二有机聚硅氧烷，并且在25℃下具有100至1,000,000mPas的粘度; （B）二有机二甲氧基硅烷或其部分水解产物; （C）具有硅键合的具有两个或更多个碳原子的烷氧基的二有机二烷氧基硅烷或其部分水解产物; 和（D）钛螯合催化剂，表现出优异的储存稳定性和控制固化速度的容易性，以及通过对固化期间该组合物接触的基材的强粘合性以及固化产物的界面剥离的可能性 上述基材。

公开(公告)号：US07592070B2

公开(公告)日：2009-09-22

申请号：US10570115

申请日：2004-08-27

申请人： Akiko Takanami ,  Yoshito Ushio ,  Osamu Mitani ,  Masayuki Onishi

发明人： Akiko Takanami ,  Yoshito Ushio ,  Osamu Mitani ,  Masayuki Onishi

IPC分类号： B32B9/04

CPC分类号： B32B25/20 ,  B32B25/08 ,  B32B2319/00 ,  B32B2405/00 ,  B32B2457/202 ,  C08G77/12 ,  C08G77/20 ,  C08G2170/40 ,  C08L83/00 ,  C09J7/10 ,  C09J7/38 ,  C09J183/04 ,  C09J2483/00 ,  G02F2202/28 ,  Y10T428/31663 ,  Y10T428/31786

摘要： Adhesive silicone elastomer sheet afforded by the cure of a hydrosilylation-curing silicone elastomer composition comprising: (A) an organopolysiloxane that contains at least one diorganosiloxane unit and that has at least two silicon-bonded alkenyl groups in each molecule, (B) an organopolysiloxane resin with the average unit formula: (R13SiO1/2)x(SiO4/2)1.0 in which R1 is substituted or unsubstituted monovalent hydrocarbon group and x is a number from 0.5 to 1.0, (C) an organopolysiloxane that contains at least two silicon-bonded hydrogen atoms in each molecule, and (D) a hydrosilylation catalyst. The adhesive silicone elastomer sheet is transparent, and whose surface exhibits a stable and permanent adhesiveness.

摘要翻译： 通过固化氢化硅烷化固化的硅氧烷弹性体组合物提供的粘合硅氧烷弹性体片，其包含：（A）含有至少一个二有机硅氧烷单元并且在每个分子中具有至少两个硅键合的烯基的有机聚硅氧烷，（B）有机聚硅氧烷 树脂，其平均单元式为：（R 13 SiO 1/2）x（SiO 4/2）1.0，其中R 1为取代或未取代的单价烃基，x为0.5至1.0的数，（C）含有至少两个硅的有机聚硅氧烷 每个分子中的氢键相互键合，和（D）氢化硅烷化催化剂。 粘合性硅氧烷弹性体片是透明的，其表面具有稳定且永久的粘合性。