公开(公告)号：US20250051570A1

公开(公告)日：2025-02-13

申请号：US18720286

申请日：2022-12-13

Applicant: MOMENTIVE PERFORMANCE MATERIALS JAPAN LLC

Inventor： Kikuo MOCHIZUKI

IPC: C08L83/04 ,  C08G77/00 ,  C08G77/08 ,  C08G77/20

Abstract: A UV-curable silicone composition includes a polyorganosiloxane (A) containing at least one alkenyl group in the molecule and having an alkenyl group content of 0.3 mmol/g or less on average; a polyorganohydrogensiloxane (B) having at least three silicon-bonded hydrogen atoms in the molecule; and a UV-active platinum catalyst (C).

公开(公告)号：US20250002719A1

公开(公告)日：2025-01-02

申请号：US18687566

申请日：2022-08-22

Applicant: DOW TORAY CO., LTD.

Inventor： Ryosuke YAMAZAKI ,  Hidenori MATSUSHIMA ,  Koichi OZAKI ,  Toru IMAIZUMI

IPC: C08L83/04 ,  C08G77/00 ,  C08G77/08 ,  C08G77/44 ,  C08J3/12 ,  C08J5/18 ,  C08K5/05 ,  C08K5/5419 ,  C08K5/544 ,  C08K9/06 ,  H01L21/56 ,  H01L23/29 ,  H01L23/31

Abstract: Provided is a curable silicone composition having excellent handleability, and curing properties during sealing due to good hot-melt properties and low melt viscosity, in addition to having excellent cured product mechanical strength and substrate bonding strength, making the composition suitable as a sealant for semiconductor devices. The curable silicone composition comprises: (A) a hot-melt organopolysiloxane resin containing M and T units in certain ratios and having alkenyl groups; (B) an organosiloxane compound containing a specific siloxane unit and containing 10 mass % or more of an alkenyl group; (C) an organohydrogensiloxane compound; (D) a hydrosilylation catalyst; and (E) a functional inorganic filler in an amount of 400 to 3,000 parts by mass per 100 parts by mass of the total of components (A) to (D). The composition is solid at 25° C. and has hot-melt properties at a temperature of 200° C. or lower.

公开(公告)号：US20250001388A1

公开(公告)日：2025-01-02

申请号：US18827839

申请日：2024-09-08

Applicant: Qingdao University of Science and Technology

Inventor： Zhibo Li ,  Yuetao Liu ,  Na Zhao

IPC: B01J19/20 ,  B01J19/00 ,  B01J19/06 ,  C08G77/08

Abstract: This disclosure belongs to the field of organic silicon polymer material preparation, particularly relating to a continuous production device for organophosphorus nitrile-catalyzed high-molecular-weight polysiloxane. It includes a reaction device with a horizontal configuration and dual-axis stirring, where the diameters of the dual axes decrease gradually from the feed port to the discharge outlet, and the corresponding nominal diameters of the paddles increase gradually from the feed port to the discharge outlet. The stirring shaft and paddles are hollow and can be externally heated or cooled. The dual-axis engagement provides mass transfer, heat transfer, and axial propelling force. This reaction device exhibits excellent mass transfer and heat transfer effects, resulting in uniform products with narrow molecular weight distribution and low volatile content. It is particularly suitable for the continuous production of high-viscosity, high-molecular-weight polysiloxanes catalyzed by organophosphorus nitrile. This production device can be adapted to various traditional chemical reaction equipment.

公开(公告)号：US12173155B2

公开(公告)日：2024-12-24

申请号：US17284666

申请日：2019-08-28

Applicant: SHIN-ETSU CHEMICAL CO., LTD.

Inventor： Natsumi Inoue ,  Tetsuro Yamada ,  Kenji Yamamoto ,  Tsuneo Kimura ,  Munenao Hirokami

IPC: C08L83/04 ,  C08G77/08 ,  C08G77/12 ,  C08G77/14 ,  C08G77/20 ,  C08K5/5435 ,  C08L29/04

Abstract: An addition reaction-curable silicone emulsion composition containing a water-soluble silane coupling agent (I) and an organopolysiloxane (II) having at least two alkenyl groups in one molecule thereof, where the water-soluble silane coupling agent (I) has at least one group selected from among a succinic anhydride group, a quaternary ammonium group, and a ureido group, and 1 part by mass or more of the water-soluble silane coupling agent (I) is contained relative to 100 parts by mass of the organopolysiloxane (II). This provides: a silicone emulsion composition that gives a cured film adhering well to plastic film substrates regardless of the type, while having suitable release properties regarding adhesives; and a delamination film made by forming a cured film of the silicone emulsion composition.

公开(公告)号：US20240400779A1

公开(公告)日：2024-12-05

申请号：US18580565

申请日：2022-07-18

Applicant: DOW GLOBAL TECHNOLOGIES LLC ,  DOW SILICONES CORPORATION

Inventor： Shuqi LAI ,  Jody J. HENNING ,  Yanhu WEI ,  Kshitish A. PATANKAR ,  Mark F. SONNENSCHEIN

IPC: C08J9/00 ,  C08G77/08 ,  C08G77/14 ,  C08G101/00 ,  C08J9/14 ,  C08J9/30

Abstract: Silicone foam compositions for forming foamed silicone elastomers are described herein, together with the respective foamed silicone elastomers formed therefrom and to methods of making such compositions and foamed silicone elastomers. The silicone rubber foam composition comprising: (a) one or more organopolysiloxane polymers having an average of at least two epoxide groups per molecule; (b) a Lewis acid catalyst, (c) one or more surfactants and optionally (d) a physical blowing agent. The foamed silicone elastomers are prepared by either mechanically foaming components (a), (b) and (c); or by introducing a physical blowing agent (d); and causing foaming by physical blowing.

公开(公告)号：US20240376271A1

公开(公告)日：2024-11-14

申请号：US18655828

申请日：2024-05-06

Applicant: BATTELLE SAVANNAH RIVER ALLIANCE, LLC

Inventor： TYLER C. GUIN ,  GEORGE K. LARSEN ,  NATHANIEL Z. HARDIN

IPC: C08G77/00 ,  C08G77/08 ,  C08G77/20

Abstract: A silicone elastomer is disclosed. The silicon elastomer includes a phenyl content of at least about 60 mol. %, a phenyl to methyl ratio of greater than about 80 mol. %, and exhibits a Shore D hardness of between about 15 and about 70. Methods for forming the silicone elastomer are also provided.

公开(公告)号：US20240368402A1

公开(公告)日：2024-11-07

申请号：US18772884

申请日：2024-07-15

Applicant: DOW SILICONES CORPORATION ,  DOW TORAY CO., LTD.

Inventor： Patrick BEYER ,  Michael BACKER ,  Tomoko TASAKI

IPC: C08L83/04 ,  B29C64/106 ,  B33Y10/00 ,  B33Y70/00 ,  C08G77/08 ,  C08G77/12 ,  C08G77/20 ,  C09D183/04

Abstract: The present disclosure relates to hydrosilylation curable silicone rubber compositions having polyorganosiloxane cross-linkers containing at least two or at least three terminal silicon bonded hydrogen groups and one or more hydrosilylation cure inhibitor compounds selected from multiacrylates having at least three acrylate groups per molecule. Cured products resulting from the cure of such compositions and which may include elastomeric products are also disclosed.

公开(公告)号：US12129379B2

公开(公告)日：2024-10-29

申请号：US17418394

申请日：2019-12-27

Applicant: Dow Toray Co., Ltd.

Inventor： Michitaka Suto ,  Tadashi Okawa ,  Satoshi Onodera ,  Hidefumi Tanaka ,  Haruhiko Furukawa

IPC: C08L83/08 ,  C08G77/08 ,  C08G77/12 ,  C08G77/20 ,  C08G77/24 ,  C08G77/46 ,  C09J7/40

CPC classification number: C08L83/08 ,  C08G77/08 ,  C08G77/12 ,  C08G77/20 ,  C08G77/24 ,  C08G77/46 ,  C09J7/401 ,  C08L2201/10 ,  C08L2203/16 ,  C08L2205/025 ,  C08L2205/03 ,  C09J2301/162 ,  C09J2483/005

Abstract: Provided is a curable silicone composition for a release agent which can form a release film having a silicone adhesive with a low release force even when thin and which does not reduce the adhesive strength of the silicone adhesive to other substrates upon releasing the release film. A release film and laminate are also provided. The curable silicone composition comprises: (A) a fluorine-containing organopolysiloxane mixture obtained by mixing the following components (A1) and (A2) at a mass ratio of 1/99 to 45/55: (A1) a fluoro(poly)ether modified organopolysiloxane having at least two alkenyl groups per molecule along with a fluoro(poly)ether-containing organic group; (A2) a fluoroalkyl group-containing organopolysiloxane having at least two alkenyl groups per molecule along with a fluoroalkyl group having 1 to 12 carbon atoms; (B) an organopolysiloxane having at least three silicon atom-bonded hydrogen atoms per molecule; (C) a hydrosilylation reaction catalyst; and (D) an organic solvent.

公开(公告)号：US12122935B2

公开(公告)日：2024-10-22

申请号：US17420149

申请日：2019-12-06

Applicant: Dow Toray Co., Ltd. ,  Dow Silicones Corporation

Inventor： Hiroshi Fukui ,  Takeaki Tsuda ,  Hua Ren

IPC: C09D183/08 ,  C08G77/08 ,  C08G77/12 ,  C08G77/20 ,  C08G77/24 ,  C08J5/18 ,  C08K5/01 ,  C08K5/03 ,  C08K5/07 ,  C08K5/14 ,  C08K5/5419 ,  C08L83/04

CPC classification number: C09D183/08 ,  C08G77/08 ,  C08G77/12 ,  C08G77/20 ,  C08G77/24 ,  C08J5/18 ,  C08K5/01 ,  C08K5/03 ,  C08K5/07 ,  C08K5/14 ,  C08K5/5419 ,  C08L83/04 ,  C08K2201/019 ,  C08L2203/16 ,  C08L2312/06 ,  C08L2312/08 ,  C09D183/08 ,  C08L83/00

Abstract: Provided is a curable organopolysiloxane composition for forming a film capable of uniform and thin film formation, and a method of manufacturing an organopolysiloxane cured film using the same. The curable organopolysiloxane composition for forming a film, comprises: a curing reactive organopolysiloxane, a curing agent, and one or more type of organic solvent selected from (D1) organic polar solvents, (D2) low molecular weight siloxane solvents, and (D3) halogen solvents, or a mixed solvent thereof. The viscosity of the entire composition measured at a shear rate of 0.1 (s−1) at 25° C. is 100,000 mPa·s or less, the viscosity of the entire composition measured at a shear rate of 10.0 (s−1) is within a range of 5 to 10,000 mPa·s, and a thixotropic ratio thereof is 25.0 or less.

公开(公告)号：US12110427B2

公开(公告)日：2024-10-08

申请号：US17299139

申请日：2020-03-13

Applicant: Dow Silicones Corporation

Inventor： Elizabeth Kelley ,  Timothy Mitchell ,  Jodi Mecca

IPC: C09J183/10 ,  C08G77/08 ,  C08G77/12 ,  C08G77/20 ,  C08G77/442 ,  C09J7/38 ,  C08G77/00

CPC classification number: C09J183/10 ,  C08G77/08 ,  C08G77/12 ,  C08G77/20 ,  C08G77/442 ,  C09J7/38 ,  C08G77/70 ,  C09J2301/302 ,  C09J2301/414 ,  C09J2483/00 ,  C09J183/10 ,  C08L83/00 ,  C08L83/00 ,  C08K5/05

Abstract: A polydiorganosiloxane having both a silicon bonded aliphatically unsaturated group and a silicon bonded poly(meth)acrylate polymer or copolymer is useful in a polyorganosiloxane hybrid pressure sensitive adhesive composition that cures to form a polyorganosiloxane hybrid pressure sensitive adhesive. The polyorganosiloxane hybrid pressure sensitive adhesive composition can be wet-cast or dry-cast on a substrate and cured to form a polyorganosiloxane hybrid pressure sensitive adhesive article. An adhesive article including the polyorganosiloxane hybrid pressure sensitive adhesive is also disclosed.