公开(公告)号：US12215204B2

公开(公告)日：2025-02-04

申请号：US16955221

申请日：2018-12-19

Applicant: DOW TORAY CO., LTD.

Inventor： Mari Wakita ,  Hiroko Taniguchi ,  Takeshi Yoshizawa

IPC: C08J3/12 ,  A61K8/891 ,  A61Q1/12 ,  C08G77/08 ,  C08G77/12 ,  C08G77/38 ,  C08J7/04 ,  C08L83/06 ,  C09D183/06 ,  C09D183/14

Abstract: Provided is a silicone resin-coated silicone elastomer particle that is superior in dispersibility into organic resins, in stress relaxation performance, and the like, and that has low dust scattering when mixing and thus is superior in ease of handling. Also provided is an organic resin additive, an organic resin, a coating composition, or a coating agent composition, and applications such as in cosmetic compositions, including the particle. The silicone resin-coated silicone elastomer particle has a structure wherein at least two silicon atoms in a silicone elastomer particle are cross-linked through a silalkylene group with a carbon number between 4 and 20 where some or all of the surface thereof is coated with a silicone resin structured from siloxane units expressed by SiO4/2.

公开(公告)号：US20250010812A1

公开(公告)日：2025-01-09

申请号：US18709667

申请日：2022-11-10

Applicant: DOW SILICONES CORPORATION ,  DOW TORAY CO., LTD.

Inventor： Elizabeth M. SANTOS ,  Dongchan AHN ,  Thomas D. BEKEMEIER ,  Todd M. STARKE ,  Hiroshi AKITOMO ,  Tomoko TASAKI ,  Glenn GORDON

IPC: B60R21/235 ,  D06N3/00 ,  D06N3/12

Abstract: This disclosure relates to one-piece woven airbags coated with a cured product of hydrosilylation curable silicone rubber coating compositions and to a process for coating the one-piece woven airbags with the hydrosilylation curable silicone rubber coating compositions. The resulting one-piece woven airbags coated with a cured product of the hydrosilylation curable silicone rubber coating compositions are of a reduced mean dry coat weight while maintaining the properties of previous one-piece woven airbags coated with standard, thicker coatings.

公开(公告)号：US12173157B2

公开(公告)日：2024-12-24

申请号：US17418375

申请日：2019-12-27

Applicant: DOW TORAY CO., LTD.

Inventor： Ryosuke Yamazaki

IPC: C08L83/04 ,  C08G77/00 ,  C08G77/20 ,  C08G77/44 ,  C08J3/12 ,  C08K3/22 ,  C08K5/14 ,  C08K9/06

Abstract: Provided herein is a curable granular silicone composition which has hot-melt properties, is particularly superior in flexibility and toughness at high temperatures from room temperature to about 150° C. in cured products such as overmolding, and provides a cured product that does not easily warp or become damaged even when integrally molded with an aluminum lead frame or the like. A curable granular silicone composition comprising: (A) organopolysiloxane resin microparticles having a curing reactive functional group; (B) a functional inorganic filler; and (C) a curing agent. The composition provides, upon curing, a cured material having a storage modulus at 25° C. and 150° C. of less than 2,000 MPa and less than 100 MPa, respectively, and a peak value of tan δ represented by the storage modulus/loss modulus (G′/G″), is 0.40 or more.

公开(公告)号：US20240392165A1

公开(公告)日：2024-11-28

申请号：US18691859

申请日：2022-09-08

Applicant: DOW TORAY CO., LTD.

Inventor： Yuki YOKOUCHI ,  Tomohiro IIMURA ,  Michitaka SUTO

IPC: C09J7/35 ,  B32B7/12 ,  B32B37/12 ,  C09J5/06

Abstract: Provided is a curable organopolysiloxane composition that can be heat curable and photocurable, and that has sufficient tackiness, enabling design of a composition that can coat even when using a small amount of solvent, a cured product thereof, and use thereof. The curable organopolysiloxane composition comprises (A) a chain organopolysiloxane having an alkenyl group, (B) a specific MQ type organopolysiloxane resin, and (C) a radical polymerization initiator. As an optional component, the composition may further comprise (D) at least one type of radical reactive component selected from (D1) vinyl monomers, and (D2) (meth)acrylic group-containing organopolysiloxane compounds. The sum of component (A), component (B), and component (D2) with respect to the total solid mass of the composition is 50 mass % or higher.

公开(公告)号：US20240384138A1

公开(公告)日：2024-11-21

申请号：US18691861

申请日：2022-09-08

Applicant: DOW TORAY CO., LTD.

Inventor： Yuki YOKOUCHI ,  Tomohiro IIMURA

IPC: C09J7/38 ,  B32B7/12 ,  B32B27/08 ,  B32B27/36 ,  B32B37/12

Abstract: Provided is a curable organopolysiloxane composition that can be heat curable and photocurable, has excellent transparency, and forms a slightly adhesive layer, enabling design of a composition that is coatable even when using a small amount of solvent, a cured product thereof, and use thereof. The curable organopolysiloxane composition comprises (A) a chain organopolysiloxane having an alkenyl group, (B) at least one type of radical reactive component selected from (B1) vinyl monomers, and (B2) (meth)acrylic group-containing organopolysiloxane compounds, and (C) a radical polymerization initiator. The sum of component (A) and component (B2) with respect to the total solid mass of the composition is 50 mass % or higher.

公开(公告)号：US20240384038A1

公开(公告)日：2024-11-21

申请号：US18566496

申请日：2022-05-31

Applicant: DOW TORAY CO., LTD.

Inventor： Son Thanh PHAN ,  Seiki TAMURA ,  Hiroyuki INAGAKI

IPC: C08G77/46 ,  C08L75/08 ,  C08L83/12

Abstract: Provided is a hydrosilylation reaction process, and the like for (AB)n-type polyether-modified silicone compositions having sufficient quality and foam conditioning properties even when a low-cost glycol ether compound is used as a raw material. A method of manufacturing a composition containing a polyether-polysiloxane block copolymer (A′) includes a step of mixing raw material components including at least (a1) double terminated alkenyl polyether, and (N+S) a specific monovalent sodium carboxylate solution, a step of removing a solvent component (S) from the system, and a step of subjecting the raw material components to a hydrosilylation reaction. The sum of component (a1), a component (a2), and a component (B′): =100:40 to 80, and the amount of Na+ in component (N) with regard to component (B′) is added is within a range of 3.8 to 43 wt. ppm. A foam-enhancing composition, and use thereof, is also provided.

公开(公告)号：US12129407B2

公开(公告)日：2024-10-29

申请号：US17413087

申请日：2019-12-05

Applicant: Dow Toray Co., Ltd. ,  Dow Silicones Corporation

Inventor： Jon Degroot, Jr. ,  Haruhiko Furukawa ,  Tomohiro Iimura ,  Eun Sil Jang ,  Eric E. Joffre

IPC: B32B41/00 ,  C09J7/29 ,  C09J7/38 ,  C09J183/06

CPC classification number: C09J183/06 ,  C09J7/29 ,  C09J7/38 ,  C09J2203/326 ,  C09J2301/302

Abstract: Provided is a silicone adhesive composition and an application thereof, that has a viscosity that enables coating even with a small amount of solvent content, has excellent curability due to hydrosilylation reaction, cures, has sufficient adhesive strength for practical use, and has excellent mechanical strength and elongation of the adhesive layer after curing, and can form a pressure-sensitive adhesive layer having sufficient adhesive strength for practical use. The adhesive composition comprises: (A) a chain-like organopolysiloxane having at least two aliphatic unsaturated carbon-carbon bond-containing groups only at the terminals of the molecular chain; (B) a straight-chain organohydrogenpolysiloxane having silicon-bonded hydrogen atoms only at both terminals of the molecular chain; (C) a resinous organopolysiloxane; and (D) an organopolysiloxane having at least one or more aliphatic unsaturated carbon-carbon bond-containing groups at locations other than the ends of the molecular chain, and having three or more aliphatic unsaturated carbon-carbon bond groups in the molecule.

公开(公告)号：US20240174815A1

公开(公告)日：2024-05-30

申请号：US18282948

申请日：2022-03-23

Applicant: DOW TORAY CO., LTD.

Inventor： Makoto YOSHITAKE

IPC: C08G77/20 ,  C08G77/00 ,  C08G77/12 ,  C08G77/16 ,  C08G77/18

CPC classification number: C08G77/20 ,  C08G77/12 ,  C08G77/16 ,  C08G77/18 ,  C08G77/70 ,  C08G77/80

Abstract: An organopolysiloxane composition is disclosed. The organopolysiloxane composition of includes at least (A) an organopolysiloxane expressed by an average unit formula, having a silicon-bonded hydroxyl group, (B) an organopolysiloxane expressed by an average unit formula, which is different from compound (A), and (C) a compound having at least two functional groups selected from ether bonds, ester bonds, and alkoxysilyl groups expressed by a formula, in one molecule. The amount of compound (A) is 2 to 70 mass % of the sum of component (A) and component (B). The amount of component (C) is an amount where the sum of functional groups in component (C) is 0.05 mols or more with regard to 1 mol of silicon-bonded hydroxyl groups in component (A). The composition has sufficient thixotropic properties, independent of inorganic powders such as fumed silica, precipitated silica, alumina, titanium oxide, and the like.

公开(公告)号：US20240052106A1

公开(公告)日：2024-02-15

申请号：US18268222

申请日：2021-12-14

Applicant: DOW TORAY CO., LTD.

Inventor： Ryosuke YAMAZAKI ,  Shinichi YAMAMOTO ,  Kouichi OZAKI ,  Toru IMAIZUMI

IPC: C08G77/12 ,  C08G77/08 ,  C08G77/20 ,  C08L83/04 ,  C08J3/28 ,  C09J183/04

CPC classification number: C08G77/12 ,  C08G77/08 ,  C08G77/20 ,  C08L83/04 ,  C08J3/28 ,  C09J183/04 ,  C08G2170/00 ,  C08G2190/00 ,  C08L2203/20 ,  C08L2205/025 ,  C08L2205/035 ,  C08L2312/06 ,  C08L2312/08

Abstract: Provided is a hot-melt curable silicone composition with excellent hot dispensing properties and storage stability, which can be cured by triggering an external energy stimulus, and which provides excellent adhesive and mechanical properties to the cured product, and applications thereof. A curable silicone composition, including in a specific mass % range, comprises: (A) a non-hot-melt solid organopolysiloxane resin mixture; (B) a linear organopolysiloxane that is liquid at 25° C. having the same curing reactive functional group; (C) an organohydrogen polysiloxane; and (D) a hydrosilylation reaction catalyst that is inert at room temperature but is activated by an external energy stimulus. The whole composition has hot-melt properties, and the melt viscosity (flow tester measurement) at 100° C. is 50 Pa·s or less. A cured product thereof, and use in semiconductor applications and the like, is also provided. The composition is particularly suitable for use as an adhesive or sealing agent in hot dispensing applications.

公开(公告)号：US20240002605A1

公开(公告)日：2024-01-04

申请号：US18013880

申请日：2021-06-21

Applicant: DOW TORAY CO., LTD.

Inventor： Shouko TANAKA ,  Nohno TODA ,  Manabu SUTOH

IPC: C08G77/20 ,  C08G77/12 ,  C08G77/08 ,  C08L83/04 ,  C08J3/24 ,  C08J3/28

CPC classification number: C08G77/20 ,  C08G77/12 ,  C08G77/08 ,  C08L83/04 ,  C08J3/247 ,  C08J3/28 ,  C08L2312/06 ,  C08L2203/20

Abstract: Provided is a curable organopolysiloxane composition having favorable curing properties, maintaining a favorable pot life even as a single component composition and showing sharp and rapid curing reactivity triggered by ultraviolet light or other high energy beam irradiation and heating, and in which curing defect problems are less likely to occur even in light shielded portions where irradiation with a high energy beam such or the like is difficult. The curable organopolysiloxane composition comprises: (A) an organopolysiloxane having a monovalent hydrocarbon group containing an aliphatic unsaturated bond, (B) an organohydrogenpolysiloxane, (C) a first hydrosilylation catalyst that exhibits activity by irradiating with a high energy beam, and (D) a second hydrosilylation catalyst microencapsulated by a thermoplastic resin with a softening point within a temperature range of 50 to 200° C. In general, a hydrosilylation reaction inhibitor is substantially not required. A method of forming an organopolysiloxane cured product is also provided.