公开(公告)号：US20240052106A1

公开(公告)日：2024-02-15

申请号：US18268222

申请日：2021-12-14

Applicant: DOW TORAY CO., LTD.

Inventor： Ryosuke YAMAZAKI ,  Shinichi YAMAMOTO ,  Kouichi OZAKI ,  Toru IMAIZUMI

IPC: C08G77/12 ,  C08G77/08 ,  C08G77/20 ,  C08L83/04 ,  C08J3/28 ,  C09J183/04

CPC classification number: C08G77/12 ,  C08G77/08 ,  C08G77/20 ,  C08L83/04 ,  C08J3/28 ,  C09J183/04 ,  C08G2170/00 ,  C08G2190/00 ,  C08L2203/20 ,  C08L2205/025 ,  C08L2205/035 ,  C08L2312/06 ,  C08L2312/08

Abstract: Provided is a hot-melt curable silicone composition with excellent hot dispensing properties and storage stability, which can be cured by triggering an external energy stimulus, and which provides excellent adhesive and mechanical properties to the cured product, and applications thereof. A curable silicone composition, including in a specific mass % range, comprises: (A) a non-hot-melt solid organopolysiloxane resin mixture; (B) a linear organopolysiloxane that is liquid at 25° C. having the same curing reactive functional group; (C) an organohydrogen polysiloxane; and (D) a hydrosilylation reaction catalyst that is inert at room temperature but is activated by an external energy stimulus. The whole composition has hot-melt properties, and the melt viscosity (flow tester measurement) at 100° C. is 50 Pa·s or less. A cured product thereof, and use in semiconductor applications and the like, is also provided. The composition is particularly suitable for use as an adhesive or sealing agent in hot dispensing applications.

公开(公告)号：US20230137947A1

公开(公告)日：2023-05-04

申请号：US17788121

申请日：2020-12-28

Applicant: DOW TORAY CO., LTD.

Inventor： Ryosuke YAMAZAKI ,  Kouichi OZAKI ,  Toru IMAIZUMI

IPC: C08L83/04 ,  C08J5/18 ,  C09J183/04 ,  C09J7/10 ,  C09J7/35 ,  C09J7/40 ,  B32B25/20

Abstract: A curable hot-melt silicone composition that is less susceptible to curing inhibition and with excellent storage stability, and a sheet or film containing the same, is provided. The composition comprises: (A) a solid organopolysiloxane resin containing a specific ratio of (A1) an organopolysiloxane resin having a curing reactive functional group that contains a carbon-carbon double bond and containing 20 mol % or more of a Q unit, and (A2) an organopolysiloxane resin not having a curing reactive functional group that contains a carbon-carbon double bond and containing 20 mol % or more of a Q unit; (B) a chain organopolysiloxane having a curing reactive functional group that contains at least two carbon-carbon double bonds; (C) an organohydrogenpolysiloxane resin having a mass loss ratio relative to pre-exposure of 10% or less after exposure to 100° C. for 1 hour under atmospheric pressure; and (D) a hydrosilylation reaction catalyst. The composition generally has hot-melt properties.

公开(公告)号：US20250002719A1

公开(公告)日：2025-01-02

申请号：US18687566

申请日：2022-08-22

Applicant: DOW TORAY CO., LTD.

Inventor： Ryosuke YAMAZAKI ,  Hidenori MATSUSHIMA ,  Koichi OZAKI ,  Toru IMAIZUMI

IPC: C08L83/04 ,  C08G77/00 ,  C08G77/08 ,  C08G77/44 ,  C08J3/12 ,  C08J5/18 ,  C08K5/05 ,  C08K5/5419 ,  C08K5/544 ,  C08K9/06 ,  H01L21/56 ,  H01L23/29 ,  H01L23/31

Abstract: Provided is a curable silicone composition having excellent handleability, and curing properties during sealing due to good hot-melt properties and low melt viscosity, in addition to having excellent cured product mechanical strength and substrate bonding strength, making the composition suitable as a sealant for semiconductor devices. The curable silicone composition comprises: (A) a hot-melt organopolysiloxane resin containing M and T units in certain ratios and having alkenyl groups; (B) an organosiloxane compound containing a specific siloxane unit and containing 10 mass % or more of an alkenyl group; (C) an organohydrogensiloxane compound; (D) a hydrosilylation catalyst; and (E) a functional inorganic filler in an amount of 400 to 3,000 parts by mass per 100 parts by mass of the total of components (A) to (D). The composition is solid at 25° C. and has hot-melt properties at a temperature of 200° C. or lower.

公开(公告)号：US20240384100A1

公开(公告)日：2024-11-21

申请号：US18687565

申请日：2022-08-22

Applicant: DOW TORAY CO., LTD.

Inventor： Ryosuke YAMAZAKI ,  Masayuki HAYASHI ,  Hidenori MATSUSHIMA ,  Koichi OZAKI ,  Toru IMAIZUMI

IPC: C08L83/04 ,  B29C48/00 ,  B29C48/08 ,  B29C48/88 ,  B29K83/00 ,  B29K307/04 ,  B29K309/08 ,  B29L31/34 ,  C08G77/44 ,  C08K9/06 ,  H01L21/56 ,  H01L23/29

Abstract: Provided is a curable silicone composition or the like having excellent handleability and curing properties during sealing due to good hot-melt properties and excellent melting properties, in addition to having excellent cured product mechanical strength and substrate bonding strength, making the composition suitable as a sealant for semiconductor devices. The curable silicone composition comprises: (A) a hot-melt MDT-type organopolysiloxane resin having a specific siloxane unit ratio; (B) an organohydrogensiloxane compound; (C) a hydrosilylation catalyst; and (D) a functional inorganic filler in an amount of 400 to 3,000 parts by mass per 100 parts by mass of the total of components (A) to (C). The curable silicone composition is solid at 25° C. and has hot-melt properties at a temperature of 200° C. or lower.

公开(公告)号：US20220340756A1

公开(公告)日：2022-10-27

申请号：US17288503

申请日：2019-10-29

Applicant: DOW TORAY CO., LTD.

Inventor： Kazuhiro NISHIJIMA ,  Akihiro NAKAMURA ,  Haruhiko FURUKAWA ,  Makoto YOSHITAKE ,  Toru IMAIZUMI ,  Kouichi OZAKI

IPC: C08L83/04 ,  C09J7/38 ,  C09J183/04 ,  B32B17/10 ,  B32B7/12 ,  B32B37/12 ,  B32B38/00 ,  B32B38/06 ,  B29C55/00 ,  B29C55/02

Abstract: Provided is: a curing reactive silicone composition having sufficient toughness and pressure sensitive adhesive strength to temporarily secure various substrate even in an uncured state, having heat meltability and excellent moldability of a sheet or the like, and that can be quickly cured by high energy irradiation to achieve high adhesive strength; a method of manufacturing a sheet thereof a cured product thereof that can achieve high adhesive strength by crimping; and applications thereof. The curing reactive silicone composition comprises: (A) an MQ resin; (B) a chain organopolysiloxane having at least two groups containing an aliphatic unsaturated carbon-carbon bond, and a degree of siloxane polymerization within a range of 80 to 3000; (C) an organohydrogenpolysiloxane; and (D) a hydrosilylation reaction catalyst activated by a high energy beam. The amount of component (A) is more than 55 mass % and less than 90 mass % of the sum of components (A) to (C).

公开(公告)号：US20220169894A1

公开(公告)日：2022-06-02

申请号：US17442656

申请日：2020-03-18

Applicant: DOW TORAY CO., LTD.

Inventor： Ryosuke YAMAZAKI ,  Kouichi OZAKI ,  Toru IMAIZUMI ,  Masayuki HAYASHI

IPC: C09J7/35 ,  C08L83/04 ,  C09J183/04 ,  B29C45/00

Abstract: To provide Provided is a curable silicone composition and applications thereof. The curable silicone composition has hot-melt properties, excellent workability, and curing characteristics such as overmolding, and a cured product obtained therefrom does not become hard or brittle, even if left at a temperature of 150° C. or higher for a long time. A The curable silicone composition comprises: an organopolysiloxane resin component which is non-hot-meltable, comprises a siloxane unit represented by SiO4/2 making up at least 20 mol % or more of the total siloxane units, and has a mass loss of 2.0 mass % or less when exposed to 200° C. for 1 hour; a liquid straight-chain or branched chain organopolysiloxane; and a curing agent.

公开(公告)号：US20210189129A1

公开(公告)日：2021-06-24

申请号：US16756940

申请日：2018-10-15

Applicant: DOW TORAY CO., LTD.

Inventor： Ryosuke YAMAZAKI ,  Toru IMAIZUMI ,  Kouichi OZAKI

IPC: C08L83/04 ,  H01L51/00 ,  B29C45/00 ,  H01L33/56 ,  H01L33/60

Abstract: Provided is a curable granular silicone composition which has hot-melt properties, is excellent in terms of handleability and curability in overmolding and the like, and gives cured objects and the like highly inhibited from taking a color at high temperatures. The curable granular silicone composition comprises: (A) organopolysiloxane resin fine particles which do not have hot-melt properties and have a curing-reactive functional group containing a carbon-carbon double bond and in which siloxane units represented by RSiO3/2 (where R is a monovalent organic group) or SiO4/2 account for at least 20 mol % of all the siloxane units; (B) a liquid, linear or branched organopolysiloxane having, in the molecule, at least two curing-reactive functional groups containing a carbon-carbon double bond; (C) a hardener; and (D) a functional filler. The composition as a whole has hot-melt properties. Uses of the curable granular silicone composition are also disclosed.

公开(公告)号：US20250051571A1

公开(公告)日：2025-02-13

申请号：US18722510

申请日：2022-12-15

Applicant: DOW TORAY CO., LTD.

Inventor： Ryosuke YAMAZAKI ,  Shinichi YAMAMOTO ,  Kouichi OZAKI ,  Toru IMAIZUMI

IPC: C08L83/04 ,  C08G77/08 ,  C08G77/12 ,  C08G77/20 ,  C09J183/04

Abstract: Provided is a curable silicone composition that has excellent curing properties and flow properties when heated and melted, and that enables fine filling, as well as excellent storage stability and thick molding properties, and that forms a hard cured product with low surface tack when cured. A curable silicone composition having hot-melt properties as a whole, comprises: (A) a solid organopolysiloxane resin that contains (A1) an organopolysiloxane resin having a curing reactive functional group and containing 20 mol % or more of a Q unit, and (A2) an organopolysiloxane resin not having a curing reactive functional group and containing 20 mol % or more of a Q unit; (B) 10 to 100 parts by mass of a straight-chain or branched organopolysiloxane having a curing reactive functional group; (C) an organohydrogenpolysiloxane; and (D) particles containing a hydrosilylation reaction catalyst using a thermoplastic resin with a Tg in a range of 110 to 200° C.

公开(公告)号：US20250051523A1

公开(公告)日：2025-02-13

申请号：US18687568

申请日：2022-08-31

Applicant: DOW TORAY CO., LTD.

Inventor： Ryosuke YAMAZAKI ,  Hidenori MATSUSHIMA ,  Koichi OZAKI ,  Toru IMAIZUMI

IPC: C08G77/04 ,  B29C71/02 ,  C08G77/00 ,  C08G77/08 ,  C08J3/12 ,  C08J3/20 ,  C08J5/00 ,  C08K3/36

Abstract: Provided is a curable silicone composition that can contain a large amount of a functional inorganic filler, provides a cured product with excellent hot-melt, gap-filling, and homogeneity properties characterized by high fluidity at high temperatures, is suitable for transfer molding and other molding or sealing processes, generates little dust, and has excellent handling workability; a manufacturing method with excellent production efficiency and homogeneity; and the like. A granular curable silicone composition comprises: (A) an organopolysiloxane resin containing at least 20 mol % or more T units, (B) a curing agent, and (C) a functional inorganic filler. The amount of component (C) is 400 to 3000 parts by mass relative to 100 parts by mass of components (A) and (B). The composition is a solid at 25° C. and has a melt viscosity of 200 Pa·s or less, and the average particle size thereof is in the range of 0.1 to 10.0 mm.

公开(公告)号：US20230151215A1

公开(公告)日：2023-05-18

申请号：US17912847

申请日：2021-03-26

Applicant: DOW TORAY CO., LTD.

Inventor： Ryosuke YAMAZAKI ,  Shinichi YAMAMOTO ,  Kouichi OZAKI ,  Toru IMAIZUMI

IPC: C08L83/04 ,  C09J7/35 ,  C09J183/04

CPC classification number: C08L83/04 ,  C09J7/35 ,  C09J183/04 ,  H01L23/296

Abstract: Provided is a hot-melt curable silicone composition that forms a cured product that can be cured at a temperature of 100° C. or lower, has excellent storage stability, is relatively hard from curing, and has low surface tack, and a sheet or film formed from the same. The curable silicone composition comprises: (A) a solid organopolysiloxane resin that contains at a mass ratio of 0:100 to 90:10 (Al) an organopolysiloxane resin having a curing reactive functional group and containing 20 mol % or more of a Q unit (i.e., a SiO4/2 unit), and (A2) an organopolysiloxane resin not having a curing reactive functional group and containing 20 mol % or more of a Q unit; (B) 10 to 100 parts by mass of a straight-chain or branched branched chain organopolysiloxane having a curing reactive functional group and is liquid or has plasticity; (C) an organohydrogenpolysiloxane; and (D) a photoactivated hydrosilylation reaction catalyst.