公开(公告)号：US08247516B2

公开(公告)日：2012-08-21

申请号：US12739343

申请日：2008-10-06

申请人： Akiko Nabeta ,  Masayuki Onishi ,  Yoshito Ushio

发明人： Akiko Nabeta ,  Masayuki Onishi ,  Yoshito Ushio

IPC分类号： C08L83/04

CPC分类号： C08L83/04 ,  C08G77/18 ,  C08K5/0091 ,  C08K5/5419 ,  C08L2666/52 ,  C08L2666/44

摘要： A room-temperature curable organopolysiloxane composition comprising: (A) a diorganopolysiloxane capped at both molecular terminals with trialkoxysilyl groups and having viscosity of 100 to 1,000,000 mPas at 25° C.; (B) a diorganodimethoxysilane or a partially hydrolyzed product thereof; (C) a diorganodialkoxysilane having silicon-bonded alkoxy group with two or more carbon atoms or a partially hydrolyzed product thereof; and (D) a titanium chelate catalyst, exhibits excellent storage stability and easiness of controlling curing speed as well as by strong adhesion to a substrate with which this composition is in contact during curing along with the possibility of interfacial peeling of the cured product from the aforementioned substrate.

摘要翻译： 一种室温可固化的有机基聚硅氧烷组合物，其包含：（A）在两个分子末端用三烷氧基甲硅烷基封端的二有机聚硅氧烷，并且在25℃下具有100至1,000,000mPas的粘度; （B）二有机二甲氧基硅烷或其部分水解产物; （C）具有硅键合的具有两个或更多个碳原子的烷氧基的二有机二烷氧基硅烷或其部分水解产物; 和（D）钛螯合催化剂，表现出优异的储存稳定性和控制固化速度的容易性，以及通过对固化期间该组合物接触的基材的强粘合性以及固化产物的界面剥离的可能性 上述基材。

公开(公告)号：US20100236450A1

公开(公告)日：2010-09-23

申请号：US12739343

申请日：2008-10-06

申请人： Akiko Nabeta ,  Masayuki Onishi ,  Yoshito Ushio

发明人： Akiko Nabeta ,  Masayuki Onishi ,  Yoshito Ushio

IPC分类号： C09D183/04

CPC分类号： C08L83/04 ,  C08G77/18 ,  C08K5/0091 ,  C08K5/5419 ,  C08L2666/52 ,  C08L2666/44

摘要： A room-temperature curable organopolysiloxane composition comprising: (A) a diorganopolysiloxane capped at both molecular terminals with trialkoxysilyl groups and having viscosity of 100 to 1,000,000 mPas at 25° C.; (B) a diorganodimethoxysilane or a partially hydrolyzed product thereof; (C) a diorganodialkoxysilane having silicon-bonded alkoxy group with two or more carbon atoms or a partially hydrolyzed product thereof; and (D) a titanium chelate catalyst, exhibits excellent storage stability and easiness of controlling curing speed as well as by strong adhesion to a substrate with which this composition is in contact during curing along with the possibility of interfacial peeling of the cured product from the aforementioned substrate.

摘要翻译： 一种室温可固化的有机基聚硅氧烷组合物，其包含：（A）在两个分子末端用三烷氧基甲硅烷基封端的二有机聚硅氧烷，并且在25℃下具有100至1,000,000mPas的粘度; （B）二有机二甲氧基硅烷或其部分水解产物; （C）具有硅键合的具有两个或更多个碳原子的烷氧基的二有机二烷氧基硅烷或其部分水解产物; 和（D）钛螯合催化剂，表现出优异的储存稳定性和控制固化速度的容易性，以及通过对固化期间该组合物接触的基材的强粘合性以及固化产物的界面剥离的可能性 上述基材。

公开(公告)号：US20070009748A1

公开(公告)日：2007-01-11

申请号：US10570115

申请日：2004-08-27

申请人： Akiko Takanami ,  Yoshito Ushio ,  Osamu Mitani ,  Masayuki Onishi

发明人： Akiko Takanami ,  Yoshito Ushio ,  Osamu Mitani ,  Masayuki Onishi

IPC分类号： B32B27/00 ,  C09J183/04 ,  C08L83/04

CPC分类号： B32B25/20 ,  B32B25/08 ,  B32B2319/00 ,  B32B2405/00 ,  B32B2457/202 ,  C08G77/12 ,  C08G77/20 ,  C08G2170/40 ,  C08L83/00 ,  C09J7/10 ,  C09J7/38 ,  C09J183/04 ,  C09J2483/00 ,  G02F2202/28 ,  Y10T428/31663 ,  Y10T428/31786

摘要： Adhesive silicone elastomer sheet afforded by the cure of a hydrosilylation-curing silicone elastomer composition comprising: (A) an organopolysiloxane that contains at least one diorganosiloxane unit and that has at least two silicon-bonded alkenyl groups in each molecule, (B) an organopolysiloxane resin with the average unit formula: (R13SiO1/2)x(SiO4/2)1.0 in which R1 is substituted or unsubstituted monovalent hydrocarbon group and x is a number from 0.5 to 1.0, (C) an organopolysiloxane that contains at least two silicon-bonded hydrogen atoms in each molecule, and (D) a hydrosilylation catalyst. The adhesive silicone elastomer sheet is transparent, and whose surface exhibits a stable and permanent adhesiveness.

摘要翻译： 通过固化氢化硅烷化固化的硅氧烷弹性体组合物提供的粘合硅氧烷弹性体片，其包含：（A）含有至少一个二有机硅氧烷单元并且在每个分子中具有至少两个硅键合的烯基的有机聚硅氧烷，（B）有机聚硅氧烷 具有平均单元式的树脂：（R 1）3 SiO 2（SiO 2）x（SiO） 其中R 1为取代或未取代的一价烃基，x为0.5至1.0的数，（C）有机聚硅氧烷，其中R 1为 在每个分子中含有至少两个与硅键合的氢原子，和（D）氢化硅烷化催化剂。 粘合性硅氧烷弹性体片是透明的，其表面具有稳定且永久的粘合性。

公开(公告)号：US07592070B2

公开(公告)日：2009-09-22

申请号：US10570115

申请日：2004-08-27

申请人： Akiko Takanami ,  Yoshito Ushio ,  Osamu Mitani ,  Masayuki Onishi

发明人： Akiko Takanami ,  Yoshito Ushio ,  Osamu Mitani ,  Masayuki Onishi

IPC分类号： B32B9/04

CPC分类号： B32B25/20 ,  B32B25/08 ,  B32B2319/00 ,  B32B2405/00 ,  B32B2457/202 ,  C08G77/12 ,  C08G77/20 ,  C08G2170/40 ,  C08L83/00 ,  C09J7/10 ,  C09J7/38 ,  C09J183/04 ,  C09J2483/00 ,  G02F2202/28 ,  Y10T428/31663 ,  Y10T428/31786

摘要： Adhesive silicone elastomer sheet afforded by the cure of a hydrosilylation-curing silicone elastomer composition comprising: (A) an organopolysiloxane that contains at least one diorganosiloxane unit and that has at least two silicon-bonded alkenyl groups in each molecule, (B) an organopolysiloxane resin with the average unit formula: (R13SiO1/2)x(SiO4/2)1.0 in which R1 is substituted or unsubstituted monovalent hydrocarbon group and x is a number from 0.5 to 1.0, (C) an organopolysiloxane that contains at least two silicon-bonded hydrogen atoms in each molecule, and (D) a hydrosilylation catalyst. The adhesive silicone elastomer sheet is transparent, and whose surface exhibits a stable and permanent adhesiveness.

摘要翻译： 通过固化氢化硅烷化固化的硅氧烷弹性体组合物提供的粘合硅氧烷弹性体片，其包含：（A）含有至少一个二有机硅氧烷单元并且在每个分子中具有至少两个硅键合的烯基的有机聚硅氧烷，（B）有机聚硅氧烷 树脂，其平均单元式为：（R 13 SiO 1/2）x（SiO 4/2）1.0，其中R 1为取代或未取代的单价烃基，x为0.5至1.0的数，（C）含有至少两个硅的有机聚硅氧烷 每个分子中的氢键相互键合，和（D）氢化硅烷化催化剂。 粘合性硅氧烷弹性体片是透明的，其表面具有稳定且永久的粘合性。

公开(公告)号：US20050118845A1

公开(公告)日：2005-06-02

申请号：US10496558

申请日：2002-11-21

申请人： Akihiko Kobayashi ,  Kazumi Nakayoshi ,  Ryoto Shima ,  Yoshito Ushio ,  Katsutoshi Mine

发明人： Akihiko Kobayashi ,  Kazumi Nakayoshi ,  Ryoto Shima ,  Yoshito Ushio ,  Katsutoshi Mine

IPC分类号： C09J7/00 ,  C09J9/02 ,  C09J121/00 ,  C09J183/04 ,  H01B5/16 ,  H01B13/00 ,  H01L21/48 ,  H01L21/60 ,  H01L23/498 ,  H01R11/01 ,  H05K3/32 ,  H01R4/58

CPC分类号： H01L24/83 ,  C09J7/10 ,  C09J9/02 ,  C09J2201/602 ,  C09J2483/00 ,  H01L21/486 ,  H01L23/49827 ,  H01L24/29 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29299 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/83101 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01058 ,  H01L2924/01061 ,  H01L2924/0107 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/12042 ,  H01L2924/351 ,  H05K3/321 ,  H05K2201/0133 ,  H05K2201/0314 ,  H05K2201/10378 ,  H05K2201/10674 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/05599

摘要： An anisotropically electroconductive adhesive film is characterized by containing an electroconductive elastomer that traverses the thickness of the adhesive film and is insulated in the plane of the adhesive film comprising electrically insulating elastomer, and both the electroconductive elastomer and the electrically insulating elastomer have a modulus of elasticity at 150° C. that is no greater than 100 MPa. A method for producing the anisotropically electroconductive adhesive film is characterized by forming through holes across the thickness of the adhesive film comprising electrically insulating elastomer, thereafter filling the through holes with an electroconductive elastomer composition, and curing the electroconductive elastomer composition to form the electroconductive elastomer after filling the through holes. A semiconductor device characterized by the electrical connection of the terminals of a semiconductor chip to the interconnect pads of an interconnect substrate by the aforementioned anisotropically electroconductive adhesive film.

摘要翻译： 各向异性导电粘合剂膜的特征在于含有穿过粘合剂膜的厚度并在包含电绝缘弹性体的粘合剂膜的平面中绝缘的导电弹性体，并且导电弹性体和电绝缘弹性体都具有弹性模量 在150℃下不大于100MPa。 制造各向异性导电粘合膜的方法的特征在于，在包括电绝缘弹性体的粘合剂膜的厚度上形成通孔，然后用导电弹性体组合物填充通孔，并且固化导电弹性体组合物以形成导电弹性体 填充通孔。 一种半导体器件，其特征在于通过上述各向异性导电粘合剂膜将半导体芯片的端子与互连衬底的互连焊盘电连接。

公开(公告)号：US5210126A

公开(公告)日：1993-05-11

申请号：US676123

申请日：1991-03-27

申请人： Yoshito Ushio ,  Akito Nakamura

发明人： Yoshito Ushio ,  Akito Nakamura

IPC分类号： C08K3/04 ,  C08G77/32 ,  C08K3/10 ,  C08K3/36 ,  C08K5/14 ,  C08K5/5415 ,  C08K5/549 ,  C08L83/04 ,  C08L83/07

CPC分类号： C08K5/5415 ,  C08G77/32 ,  C08L83/04 ,  C08G77/045

摘要： A silicone rubber composition is prepared by mixing a diorganopolysiloxane which contains 0.1 to 5 weight % of low-molecular-weight organosiloxane with a vapor pressure at 200.degree. C. of at least 10 mm Hg, with at least 90 weight % of a low-molecular-weight organosiloxane with a boiling point not exceeding 250.degree. C. at 760 mm Hg and a curing agent with filler being optional. These silicone rubber compositions are useful for silicone rubber moldings which can be used to in applications involving electrical switch contacts resulting in electrical switch contact conduction free of defects.

公开(公告)号：US20090263936A1

公开(公告)日：2009-10-22

申请号：US12065135

申请日：2006-08-23

申请人： Toyohiko Fujisawa ,  Yoshito Ushio

发明人： Toyohiko Fujisawa ,  Yoshito Ushio

IPC分类号： H01L21/58

CPC分类号： H01L23/3114 ,  C08G77/12 ,  C08G77/18 ,  C08G77/20 ,  C08L83/00 ,  C08L83/04 ,  C09J183/04 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/83 ,  H01L2224/2919 ,  H01L2224/29191 ,  H01L2224/2929 ,  H01L2224/2939 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/73215 ,  H01L2224/8385 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/10329 ,  H01L2924/15788 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/0715 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/45015 ,  H01L2924/207

摘要： An insulating liquid die-bonding agent for bonding a semiconductor-chip-mounting member to an active surface of a semiconductor chip, said agent comprising: (A) a mixture of (a-1) an organopolysiloxane resin having alkenyl groups and (a-2) a linear-chain organopolysiloxane having in one molecule at least two alkenyl groups; (B) an organopolysiloxane having in one molecule at least two silicon-bonded hydrogen atoms; (C) an organic silicon compound having in one molecule at least one silicon-bonded alkoxy groups; (D) insulating spherical silicone rubber particles having an average diameter of 0.1 to 50 μm and having a type A durometer hardness according to JIS K 6253 equal to or below 80; and (E) a hydrosilylation-reaction catalyst, may not damage the active surface of the semiconductor chip, is well suited for screen printing, is resistant to the formation of voids on the interface between the semiconductor chip and the die-bonding agent, and does not lose its wire-bonding properties.

摘要翻译： 一种用于将半导体芯片安装部件接合到半导体芯片的有源表面的绝缘液体芯片接合剂，所述试剂包括：（A）（a-1）具有烯基的有机聚硅氧烷树脂和（a- 2）在一个分子中具有至少两个烯基的直链有机聚硅氧烷; （B）在一个分子中具有至少两个与硅键合的氢原子的有机聚硅氧烷; （C）在一个分子中具有至少一个与硅键合的烷氧基的有机硅化合物; （D）平均直径为0.1〜50μm的绝缘球形硅橡胶颗粒，根据JIS K 6253的A型硬度计硬度等于或小于80; 和（E）氢化硅烷化反应催化剂不会损坏半导体芯片的活性表面，非常适合于丝网印刷，耐半导体芯片和芯片结合剂之间的界面上形成空隙，以及 不会失去其引线接合性能。

公开(公告)号：US20090105441A1

公开(公告)日：2009-04-23

申请号：US11917193

申请日：2006-06-09

申请人： Yoshito Ushio ,  Osamu Mitani

发明人： Yoshito Ushio ,  Osamu Mitani

IPC分类号： C08G77/06

CPC分类号： C08L83/04 ,  C08L83/14 ,  C08L2666/14 ,  C08L83/00

摘要： A curable organopolysiloxane composition comprising: (A) an organopolysiloxane (a1) that contains in one molecule at least one silicon-bonded alkoxysilyl-containing group and an average of at least 0.5 alkenyl groups; or a mixture of said organopolysiloxane (a1) with an organopolysiloxane (a2) that contains in one molecule at least two alkenyl groups and that is free of the alkoxysilyl-containing groups; (B) an organopolysiloxane that contains in one molecule at least two silicon-bonded hydrogen atoms; (C) an organosilicon compound that contains in one molecule at least one silicon-bonded alkoxy group and that is free of the alkoxysilyl-containing groups; and (D) a hydrosilylation-reaction catalyst, has good adhesion to unclean aluminum die castings, PPS resins, etc., even when cured by heating at relatively low temperatures such as 100° C.

摘要翻译： 一种可固化的有机聚硅氧烷组合物，其包含：（A）在一个分子中含有至少一个含硅键合的含烷氧基甲硅烷基且平均至少含有0.5个烯基的有机聚硅氧烷（a1） 或所述有机聚硅氧烷（a1）与一分子中含有至少两个烯基并且不含烷氧基甲硅烷基的有机聚硅氧烷（a2）的混合物; （B）在一个分子中含有至少两个与硅键合的氢原子的有机聚硅氧烷; （C）在一分子中含有至少一个与硅键合的烷氧基并且不含烷氧基甲硅烷基的基团的有机硅化合物; 和（D）氢化硅烷化反应催化剂，即使在相对较低的温度如100℃下加热固化，也对不干净的铝压铸件，PPS树脂等具有良好的粘合性。

公开(公告)号：US07781560B2

公开(公告)日：2010-08-24

申请号：US11917193

申请日：2006-06-09

申请人： Yoshito Ushio ,  Osamu Mitani

发明人： Yoshito Ushio ,  Osamu Mitani

IPC分类号： C08G77/04

CPC分类号： C08L83/04 ,  C08L83/14 ,  C08L2666/14 ,  C08L83/00

摘要： A curable organopolysiloxane composition comprising: (A) an organopolysiloxane (a1) that contains in one molecule at least one silicon-bonded alkoxysilyl-containing group and an average of at least 0.5 alkenyl groups; or a mixture of said organopolysiloxane (a1) with an organopolysiloxane (a2) that contains in one molecule at least two alkenyl groups and that is free of the alkoxysilyl-containing groups; (B) an organopolysiloxane that contains in one molecule at least two silicon-bonded hydrogen atoms; (C) an organosilicon compound that contains in one molecule at least one silicon-bonded alkoxy group and that is free of the alkoxysilyl-containing groups; and (D) a hydrosilylation-reaction catalyst, has good adhesion to unclean aluminum die castings, PPS resins, etc., even when cured by heating at relatively low temperatures such as 100° C.

摘要翻译： 一种可固化的有机聚硅氧烷组合物，其包含：（A）在一个分子中含有至少一个含硅键合的含烷氧基甲硅烷基且平均至少含有0.5个烯基的有机聚硅氧烷（a1） 或所述有机聚硅氧烷（a1）与一分子中含有至少两个烯基并且不含烷氧基甲硅烷基的有机聚硅氧烷（a2）的混合物; （B）在一个分子中含有至少两个与硅键合的氢原子的有机聚硅氧烷; （C）在一分子中含有至少一个与硅键合的烷氧基并且不含烷氧基甲硅烷基的基团的有机硅化合物; 和（D）氢化硅烷化反应催化剂，即使在相对较低的温度如100℃下加热固化，也对不干净的铝压铸件，PPS树脂等具有良好的粘合性。

公开(公告)号：US20090075009A1

公开(公告)日：2009-03-19

申请号：US11909770

申请日：2006-03-27

申请人： Toyohiko Fujisawa ,  Yoshito Ushio ,  Manabu Sutoh ,  Yoshinori Taniguchi ,  Koji Nakanishi

发明人： Toyohiko Fujisawa ,  Yoshito Ushio ,  Manabu Sutoh ,  Yoshinori Taniguchi ,  Koji Nakanishi

IPC分类号： C08F8/00 ,  B32B33/00

CPC分类号： C08L83/04 ,  C08G77/12 ,  C08G77/18 ,  C08G77/20 ,  C08G77/70 ,  C08G2170/20 ,  Y10T428/1476 ,  C08L83/00

摘要： A hot-melt silicone adhesive comprising: (A) an organopolysiloxane resin with a softening point in the range of 40 to 250° C.; (B) an organopolysiloxane that at 25° C. is liquid or in the state of a crude rubber, which contains in one molecule at least two alkenyl groups; (C) a composition selected from a mixture of (i) an organopolysiloxane that contains silicon-bonded hydrogen atoms and (ii) an organic silicon compound that contains a silicon-bonded alkoxy group; or (iii) an organopolysiloxane that contains silicon-bonded hydrogen atoms and a silicon-bonded alkoxy group; (D) a hydrosilylation catalyst; and (E) a hydrosilylation-reaction inhibitor, demonstrates good gap-filling ability during thermo-compressive bonding to adherends with high surface roughness, even at low pressures, and that provides strong adhesion to the adherend after cross-linking.

摘要翻译： 一种热熔性硅氧烷粘合剂，其包含：（A）软化点在40至250℃范围内的有机聚硅氧烷树脂; （B）在25℃下为液体或处于粗橡胶状态的有机聚硅氧烷，其在一个分子中含有至少两个烯基; （C）选自（i）含硅键合的氢原子的有机聚硅氧烷和（ii）含有硅键合的烷氧基的有机硅化合物的混合物的组合物; 或（iii）含硅键合氢原子和与硅键合的烷氧基的有机聚硅氧烷; （D）氢化硅烷化催化剂; 和（E）氢化硅烷化反应抑制剂，即使在低压下也具有高表面粗糙度的被粘物的热压粘合中的良好的间隙填充能力，并且在交联后对被粘物提供强粘附性。