公开(公告)号：US20090105441A1

公开(公告)日：2009-04-23

申请号：US11917193

申请日：2006-06-09

申请人： Yoshito Ushio ,  Osamu Mitani

发明人： Yoshito Ushio ,  Osamu Mitani

IPC分类号： C08G77/06

CPC分类号： C08L83/04 ,  C08L83/14 ,  C08L2666/14 ,  C08L83/00

摘要： A curable organopolysiloxane composition comprising: (A) an organopolysiloxane (a1) that contains in one molecule at least one silicon-bonded alkoxysilyl-containing group and an average of at least 0.5 alkenyl groups; or a mixture of said organopolysiloxane (a1) with an organopolysiloxane (a2) that contains in one molecule at least two alkenyl groups and that is free of the alkoxysilyl-containing groups; (B) an organopolysiloxane that contains in one molecule at least two silicon-bonded hydrogen atoms; (C) an organosilicon compound that contains in one molecule at least one silicon-bonded alkoxy group and that is free of the alkoxysilyl-containing groups; and (D) a hydrosilylation-reaction catalyst, has good adhesion to unclean aluminum die castings, PPS resins, etc., even when cured by heating at relatively low temperatures such as 100° C.

摘要翻译： 一种可固化的有机聚硅氧烷组合物，其包含：（A）在一个分子中含有至少一个含硅键合的含烷氧基甲硅烷基且平均至少含有0.5个烯基的有机聚硅氧烷（a1） 或所述有机聚硅氧烷（a1）与一分子中含有至少两个烯基并且不含烷氧基甲硅烷基的有机聚硅氧烷（a2）的混合物; （B）在一个分子中含有至少两个与硅键合的氢原子的有机聚硅氧烷; （C）在一分子中含有至少一个与硅键合的烷氧基并且不含烷氧基甲硅烷基的基团的有机硅化合物; 和（D）氢化硅烷化反应催化剂，即使在相对较低的温度如100℃下加热固化，也对不干净的铝压铸件，PPS树脂等具有良好的粘合性。

公开(公告)号：US20070009748A1

公开(公告)日：2007-01-11

申请号：US10570115

申请日：2004-08-27

申请人： Akiko Takanami ,  Yoshito Ushio ,  Osamu Mitani ,  Masayuki Onishi

发明人： Akiko Takanami ,  Yoshito Ushio ,  Osamu Mitani ,  Masayuki Onishi

IPC分类号： B32B27/00 ,  C09J183/04 ,  C08L83/04

CPC分类号： B32B25/20 ,  B32B25/08 ,  B32B2319/00 ,  B32B2405/00 ,  B32B2457/202 ,  C08G77/12 ,  C08G77/20 ,  C08G2170/40 ,  C08L83/00 ,  C09J7/10 ,  C09J7/38 ,  C09J183/04 ,  C09J2483/00 ,  G02F2202/28 ,  Y10T428/31663 ,  Y10T428/31786

摘要： Adhesive silicone elastomer sheet afforded by the cure of a hydrosilylation-curing silicone elastomer composition comprising: (A) an organopolysiloxane that contains at least one diorganosiloxane unit and that has at least two silicon-bonded alkenyl groups in each molecule, (B) an organopolysiloxane resin with the average unit formula: (R13SiO1/2)x(SiO4/2)1.0 in which R1 is substituted or unsubstituted monovalent hydrocarbon group and x is a number from 0.5 to 1.0, (C) an organopolysiloxane that contains at least two silicon-bonded hydrogen atoms in each molecule, and (D) a hydrosilylation catalyst. The adhesive silicone elastomer sheet is transparent, and whose surface exhibits a stable and permanent adhesiveness.

摘要翻译： 通过固化氢化硅烷化固化的硅氧烷弹性体组合物提供的粘合硅氧烷弹性体片，其包含：（A）含有至少一个二有机硅氧烷单元并且在每个分子中具有至少两个硅键合的烯基的有机聚硅氧烷，（B）有机聚硅氧烷 具有平均单元式的树脂：（R 1）3 SiO 2（SiO 2）x（SiO） 其中R 1为取代或未取代的一价烃基，x为0.5至1.0的数，（C）有机聚硅氧烷，其中R 1为 在每个分子中含有至少两个与硅键合的氢原子，和（D）氢化硅烷化催化剂。 粘合性硅氧烷弹性体片是透明的，其表面具有稳定且永久的粘合性。

公开(公告)号：US07781560B2

公开(公告)日：2010-08-24

申请号：US11917193

申请日：2006-06-09

申请人： Yoshito Ushio ,  Osamu Mitani

发明人： Yoshito Ushio ,  Osamu Mitani

IPC分类号： C08G77/04

CPC分类号： C08L83/04 ,  C08L83/14 ,  C08L2666/14 ,  C08L83/00

摘要： A curable organopolysiloxane composition comprising: (A) an organopolysiloxane (a1) that contains in one molecule at least one silicon-bonded alkoxysilyl-containing group and an average of at least 0.5 alkenyl groups; or a mixture of said organopolysiloxane (a1) with an organopolysiloxane (a2) that contains in one molecule at least two alkenyl groups and that is free of the alkoxysilyl-containing groups; (B) an organopolysiloxane that contains in one molecule at least two silicon-bonded hydrogen atoms; (C) an organosilicon compound that contains in one molecule at least one silicon-bonded alkoxy group and that is free of the alkoxysilyl-containing groups; and (D) a hydrosilylation-reaction catalyst, has good adhesion to unclean aluminum die castings, PPS resins, etc., even when cured by heating at relatively low temperatures such as 100° C.

摘要翻译： 一种可固化的有机聚硅氧烷组合物，其包含：（A）在一个分子中含有至少一个含硅键合的含烷氧基甲硅烷基且平均至少含有0.5个烯基的有机聚硅氧烷（a1） 或所述有机聚硅氧烷（a1）与一分子中含有至少两个烯基并且不含烷氧基甲硅烷基的有机聚硅氧烷（a2）的混合物; （B）在一个分子中含有至少两个与硅键合的氢原子的有机聚硅氧烷; （C）在一分子中含有至少一个与硅键合的烷氧基并且不含烷氧基甲硅烷基的基团的有机硅化合物; 和（D）氢化硅烷化反应催化剂，即使在相对较低的温度如100℃下加热固化，也对不干净的铝压铸件，PPS树脂等具有良好的粘合性。

公开(公告)号：US07592070B2

公开(公告)日：2009-09-22

申请号：US10570115

申请日：2004-08-27

申请人： Akiko Takanami ,  Yoshito Ushio ,  Osamu Mitani ,  Masayuki Onishi

发明人： Akiko Takanami ,  Yoshito Ushio ,  Osamu Mitani ,  Masayuki Onishi

IPC分类号： B32B9/04

CPC分类号： B32B25/20 ,  B32B25/08 ,  B32B2319/00 ,  B32B2405/00 ,  B32B2457/202 ,  C08G77/12 ,  C08G77/20 ,  C08G2170/40 ,  C08L83/00 ,  C09J7/10 ,  C09J7/38 ,  C09J183/04 ,  C09J2483/00 ,  G02F2202/28 ,  Y10T428/31663 ,  Y10T428/31786

摘要： Adhesive silicone elastomer sheet afforded by the cure of a hydrosilylation-curing silicone elastomer composition comprising: (A) an organopolysiloxane that contains at least one diorganosiloxane unit and that has at least two silicon-bonded alkenyl groups in each molecule, (B) an organopolysiloxane resin with the average unit formula: (R13SiO1/2)x(SiO4/2)1.0 in which R1 is substituted or unsubstituted monovalent hydrocarbon group and x is a number from 0.5 to 1.0, (C) an organopolysiloxane that contains at least two silicon-bonded hydrogen atoms in each molecule, and (D) a hydrosilylation catalyst. The adhesive silicone elastomer sheet is transparent, and whose surface exhibits a stable and permanent adhesiveness.

摘要翻译： 通过固化氢化硅烷化固化的硅氧烷弹性体组合物提供的粘合硅氧烷弹性体片，其包含：（A）含有至少一个二有机硅氧烷单元并且在每个分子中具有至少两个硅键合的烯基的有机聚硅氧烷，（B）有机聚硅氧烷 树脂，其平均单元式为：（R 13 SiO 1/2）x（SiO 4/2）1.0，其中R 1为取代或未取代的单价烃基，x为0.5至1.0的数，（C）含有至少两个硅的有机聚硅氧烷 每个分子中的氢键相互键合，和（D）氢化硅烷化催化剂。 粘合性硅氧烷弹性体片是透明的，其表面具有稳定且永久的粘合性。

公开(公告)号：US20050090574A1

公开(公告)日：2005-04-28

申请号：US10498396

申请日：2002-12-17

申请人： Osamu Mitani ,  Masayuki Onishi ,  Akiko Takanami

发明人： Osamu Mitani ,  Masayuki Onishi ,  Akiko Takanami

IPC分类号： C08L101/06 ,  C08C19/25 ,  C08F8/42 ,  C08F299/00 ,  C08G77/20 ,  C08K5/5425 ,  C08K5/549 ,  C08L9/00 ,  C08J3/28

CPC分类号： C08C19/25 ,  C08F8/42 ,  C08K5/549

摘要： A photocurable organic polymer composition can be quickly cured into a moisture-penetration-resistant solid body by irradiation with ultraviolet rays, electron beams, or the like, and imparts adhesiveness to a cured body after aging. The photocurable organic polymer composition includes: (D) a photoinitiator and either (I) a composition or (II) a reaction product; where (I) the composition includes (A) a liquid organic polymer having at least one hydroxy group per molecule; (B) a radiation curable alkoxysilane; and (C) a condensation-reaction catalyst; and (II) the reaction product comprises (F) a reaction product of components (A), (B), and (C).

摘要翻译： 可光固化的有机聚合物组合物可以通过紫外线，电子束等的照射快速固化成耐水分渗透的固体，并且在老化后赋予固化体的粘附性。 光固化性有机聚合物组合物包括：（D）光引发剂和（I）组合物或（II）反应产物; 其中（I）组合物包含（A）每分子具有至少一个羟基的液体有机聚合物; （B）可辐射固化的烷氧基硅烷; 和（C）缩合反应催化剂; 和（II）反应产物包含（F）组分（A），（B）和（C）的反应产物。

公开(公告)号：US6039831A

公开(公告)日：2000-03-21

申请号：US231949

申请日：1999-01-15

申请人： Katsutoshi Mine ,  Osamu Mitani ,  Kazumi Nakayoshi ,  Rikako Tazawa

发明人： Katsutoshi Mine ,  Osamu Mitani ,  Kazumi Nakayoshi ,  Rikako Tazawa

IPC分类号： C08J3/24 ,  C08K3/08 ,  C08L83/04 ,  C08L83/06 ,  C08L83/07 ,  C09J183/04 ,  C09J183/06 ,  C09J183/07 ,  B32B31/28

CPC分类号： C08L83/04 ,  C08L83/06 ,  C09J183/04 ,  C09J183/06 ,  C08G77/12 ,  C08G77/20 ,  H01L2224/48091 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/12044 ,  H01L2924/1301 ,  H01L2924/3025

摘要： A hydrosilylation curable electrically conductive silicone elastomer composition containing an acrylic functional group containing organopolysiloxane such that when the compositon is used to adhere a semiconductor chip to a substrate and the composition is then irradiated with a high energy beam, the exposed periphery of the composition cures to the extent that migration of low molecular weight silicone species from the compositon, both before and during the hydrosilyation reaction, is minimized.A method for manufacturing a semiconductor device having improved reliability in which, during adhesion of a semiconductor chip to the substrate, package, etc., by means of this composition, decreases in wire bondability to the semiconductor chip or lead frame and adhesion defects between the semiconductor chip, substrate, package, or lead frame and the sealing resin can be inhibited.A semiconductor device manufactured by this method which has improved reliability.

摘要翻译： 含有含有有机聚硅氧烷的丙烯酸官能团的氢化硅烷化固化型导电硅氧烷弹性体组合物，使得当将组合物用于将半导体芯片粘附到基底上，然后用高能量束照射组合物时，组合物的暴露外围固化成 在水解反应之前和期间，来自组合物的低分子量硅氧烷物质的迁移的程度最小化。 一种制造半导体器件的方法，其具有改进的可靠性，其中通过该组合物将半导体芯片粘合到基板，封装等时，与半导体芯片或引线框架的引线接合性降低，并且在 半导体芯片，基板，封装或引线框架和密封树脂可以被抑制。 通过该方法制造的具有提高的可靠性的半导体器件。

公开(公告)号：US5872170A

公开(公告)日：1999-02-16

申请号：US840475

申请日：1997-04-21

申请人： Katsutoshi Mine ,  Osamu Mitani ,  Kazumi Nakayoshi ,  Rikako Tazawa

发明人： Katsutoshi Mine ,  Osamu Mitani ,  Kazumi Nakayoshi ,  Rikako Tazawa

IPC分类号： C08K3/08 ,  C08F299/08 ,  C08K5/00 ,  C08L83/04 ,  C08L83/05 ,  C08L83/06 ,  C08L83/07 ,  C09J183/04 ,  C09J183/06 ,  C09J183/07 ,  H01L21/52

CPC分类号： C09J183/04 ,  C08L83/04 ,  C08L83/06 ,  C09J183/06 ,  C08G77/12 ,  C08G77/20 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/01078 ,  H01L2924/12044 ,  H01L2924/1301 ,  H01L2924/15747 ,  H01L2924/19105 ,  H01L2924/3025

摘要： A hydrosilylation curable electrically conductive silicone elastomer composition containing an acrylic functional group-containing organopolysiloxane such that when the composition is used to adhere a semiconductor chip to a substrate and the composition is then irradiated with a high energy beam, the exposed periphery of the composition cures to the extent that migration of low molecular weight silicone species from the composition, both before and during the hydrosilyation reaction, is minimized.A method for manufacturing a semiconductor device having improved reliability in which, during adhesion of a semiconductor chip to the substrate, package, etc., by means of this composition, decreases in wire bondability to the semiconductor chip or lead frame and adhesion defects between the semiconductor chip, substrate, package, or lead frame and the sealing resin can be inhibited.A semiconductor device manufactured by this method which has improved reliability.

摘要翻译： 含有含丙烯酸官能团的有机聚硅氧烷的氢化硅烷化固化型导电性硅氧烷弹性体组合物，使得当将组合物用于将半导体芯片粘附到基材上，然后用高能量束照射组合物时，组合物的暴露的周边固化 在低分子量硅氧烷物质从组合物的迁移之前和期间在水解反应中都被最小化的程度。 一种制造半导体器件的方法，其具有改进的可靠性，其中通过该组合物将半导体芯片粘合到基板，封装等时，与半导体芯片或引线框架的引线接合性降低，并且在 半导体芯片，基板，封装或引线框架和密封树脂可以被抑制。 通过该方法制造的具有提高的可靠性的半导体器件。

公开(公告)号：US20080319121A1

公开(公告)日：2008-12-25

申请号：US11571770

申请日：2005-06-17

申请人： Osamu Mitani ,  Masayuki Onishi ,  Harumi Kodama

发明人： Osamu Mitani ,  Masayuki Onishi ,  Harumi Kodama

IPC分类号： C08K3/36 ,  C08L83/06

CPC分类号： C08L83/04 ,  C08G77/18 ,  C08G77/70 ,  C08K5/0091 ,  C08L83/00 ,  C08L2666/44

摘要： A room-temperature curable organopolysiloxane composition comprising: (A) organopolysiloxane that contains in each molecule at least two trialkoxysilyl-containing groups that are bonded to silicon atoms of the molecular chain; (B) diorganodi-alkoxysilane or product of its partial hydrolyzation; (C) organopolysiloxane that contains at least one silicon-bonded phenyl group in each molecule and is free of alkoxy groups; and (D) a titanium chelate catalyst, adheres during curing to a substrate with a sufficient strength but allows separation of a cured body of the composition from the substrate at the interface even after a long period of time.

摘要翻译： 一种室温可固化的有机聚硅氧烷组合物，其包含：（A）在每个分子中含有至少两个与所述分子链的硅原子键合的含有三烷氧基甲硅烷基的基团的有机聚硅氧烷; （B）二有机二烷氧基硅烷或其部分水解产物; （C）在每个分子中含有至少一个与硅键合的苯基并且不含烷氧基的有机聚硅氧烷; 和（D）钛螯合催化剂，在固化期间以足够的强度固化到基材上，但是即使在长时间之后也允许组合物的固化体在界面处与界面处的界面分离。

公开(公告)号：US6040362A

公开(公告)日：2000-03-21

申请号：US099636

申请日：1998-06-18

申请人： Katsutoshi Mine ,  Osamu Mitani ,  Kazumi Nakayoshi ,  Rikako Tazawa

发明人： Katsutoshi Mine ,  Osamu Mitani ,  Kazumi Nakayoshi ,  Rikako Tazawa

IPC分类号： C08K3/08 ,  C08K9/02 ,  C08L83/04 ,  C08L101/12 ,  C08K9/00 ,  C08K3/10 ,  C08K3/22

CPC分类号： C08K9/02 ,  C08L83/04 ,  C08G77/12 ,  C08G77/20 ,  C08G77/70

摘要： The present invention provides a heat-conducting polymer composition in which a heat-conducting metal powder is contained in a polymer, said heat-conducting polymer composition being characterized by the fact that the aforementioned powder is a metal powder which has a metal oxide layer and/or a metal nitride layer on the surfaces of the powder particles. The heat-conducting polymer composition of the present invention is characterized by the fact that said composition has a superior storage stability and thermal conductivity, and also by the fact that said composition has electrical insulating properties.

摘要翻译： 本发明提供一种导热性聚合物组合物，其中在聚合物中含有导热金属粉末，所述导热聚合物组合物的特征在于上述粉末是具有金属氧化物层的金属粉末和 /或粉末颗粒表面上的金属氮化物层。 本发明的导热性聚合物组合物的特征在于所述组合物具有优异的储存稳定性和导热性，并且还具有所述组合物具有电绝缘性的事实。

公开(公告)号：US5804631A

公开(公告)日：1998-09-08

申请号：US688456

申请日：1996-07-30

申请人： Katsutoshi Mine ,  Osamu Mitani ,  Kazumi Nakayoshi ,  Rikako Tazawa

发明人： Katsutoshi Mine ,  Osamu Mitani ,  Kazumi Nakayoshi ,  Rikako Tazawa

IPC分类号： C08K3/08 ,  C08L83/04 ,  C09J183/04 ,  H01L21/58 ,  H01L23/495

CPC分类号： H01L24/29 ,  C08K3/08 ,  C08L83/04 ,  C09J183/04 ,  H01L23/49513 ,  H01L24/32 ,  H01L24/83 ,  C08G77/12 ,  C08G77/18 ,  C08G77/20 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/29191 ,  H01L2224/29298 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/8319 ,  H01L2224/83805 ,  H01L2224/8385 ,  H01L2224/85201 ,  H01L2224/85205 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2924/00011 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/0101 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01047 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/1301 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/3025

摘要： A curable organosiloxane composition useable as a silicone die attach adhesive, an electrically conductive silicone rubber composition each comprising a composition that cures through both addition and condensation reactions, that will not impair wire bondability to a semiconductor chip or lead frame after the semiconductor chip has been bonded to a substrate or package; and semiconductor devices in which the semiconductor chip is bonded to its substrate or package using the curable organosiloxane composition and in which the semiconductor device that evidences high reliability by virtue of the use of the curable organosiloxane composition.

摘要翻译： 可用作硅氧烷管芯粘合剂的可固化有机硅氧烷组合物，每个包含通过加成和缩合反应固化的组合物的导电硅橡胶组合物，其在半导体芯片已经被加热之后不会削弱与半导体芯片或引线框架的引线键合性 粘合到基底或包装上; 半导体器件，其中半导体芯片使用可固化的有机硅氧烷组合物结合到其衬底或封装上，并且其中通过使用可固化的有机硅氧烷组合物证明高可靠性的半导体器件。