发明授权
- 专利标题： Electrically conductive silicone elastomer compositions, methods for manufacturing semiconductor devices, and semiconductor devices
- 专利标题（中）： 导电硅橡胶组合物，半导体器件的制造方法和半导体器件
-
申请号： US840475申请日： 1997-04-21
-
公开(公告)号： US5872170A公开(公告)日： 1999-02-16
- 发明人: Katsutoshi Mine , Osamu Mitani , Kazumi Nakayoshi , Rikako Tazawa
- 申请人： Katsutoshi Mine , Osamu Mitani , Kazumi Nakayoshi , Rikako Tazawa
- 申请人地址： JPX Tokyo
- 专利权人： Down Corning Toray Silicone Co., Ltd.
- 当前专利权人： Down Corning Toray Silicone Co., Ltd.
- 当前专利权人地址： JPX Tokyo
- 优先权： JPX8-131435 19960426
- 主分类号： C08K3/08
- IPC分类号： C08K3/08 ; C08F299/08 ; C08K5/00 ; C08L83/04 ; C08L83/05 ; C08L83/06 ; C08L83/07 ; C09J183/04 ; C09J183/06 ; C09J183/07 ; H01L21/52
摘要：
A hydrosilylation curable electrically conductive silicone elastomer composition containing an acrylic functional group-containing organopolysiloxane such that when the composition is used to adhere a semiconductor chip to a substrate and the composition is then irradiated with a high energy beam, the exposed periphery of the composition cures to the extent that migration of low molecular weight silicone species from the composition, both before and during the hydrosilyation reaction, is minimized.A method for manufacturing a semiconductor device having improved reliability in which, during adhesion of a semiconductor chip to the substrate, package, etc., by means of this composition, decreases in wire bondability to the semiconductor chip or lead frame and adhesion defects between the semiconductor chip, substrate, package, or lead frame and the sealing resin can be inhibited.A semiconductor device manufactured by this method which has improved reliability.
公开/授权文献
- US5244728A Antistat layers having print retaining qualities 公开/授权日：1993-09-14
信息查询
