公开(公告)号：US20100155653A1

公开(公告)日：2010-06-24

申请号：US12714174

申请日：2010-02-26

Applicant: Kazumi Nakayoshi ,  Hiroki Ishikawa ,  Ryoto Shima ,  Katsutoshi Mine

Inventor： Kazumi Nakayoshi ,  Hiroki Ishikawa ,  Ryoto Shima ,  Katsutoshi Mine

IPC: C09K5/00 ,  H01B1/22

CPC classification number: C08L83/04 ,  C08G77/12 ,  C08G77/20 ,  C08K9/04 ,  C09J183/04 ,  H05K3/321

Abstract: A silver-based powder is surface-treated with an oxidation inhibitor by means of a mechanochemical reaction. A method of preparation of the silver-based powder includes using an organic solution of the oxidation inhibitor as a lubricating agent, applying mechanical energy to the silver-based powder, and subjecting the silver-based powder to surface treatment with said oxidation inhibitor by means of a mechanochemical reaction.

Abstract translation: 通过机械化学反应用氧化抑制剂对银基粉末进行表面处理。 制备银基粉末的方法包括使用氧化抑制剂的有机溶液作为润滑剂，向银基粉末施加机械能，并用所述氧化抑制剂对银基粉末进行表面处理 的机械化学反应。

公开(公告)号：US07074849B2

公开(公告)日：2006-07-11

申请号：US10822888

申请日：2004-04-13

Applicant: Kazumi Nakayoshi ,  Katsutoshi Mine ,  Rikako Tazawa

Inventor： Kazumi Nakayoshi ,  Katsutoshi Mine ,  Rikako Tazawa

IPC: B05D3/02 ,  C08K9/06 ,  C08L83/05 ,  C08L83/06 ,  C08L83/07

CPC classification number: H01B1/22 ,  C08G77/045 ,  C08G77/12 ,  C08G77/14 ,  C08G77/16 ,  C08G77/18 ,  C08G77/20 ,  C08G77/70 ,  C08K3/08 ,  C08K9/06 ,  C08L83/04 ,  C08L83/00 ,  C08L2666/54

Abstract: The electrical properties, particularly contact resistance and volume resistivity, of materials prepared by curing organosiloxane compositions containing finely divided silver as the electroconductive filler are improved by treating the silver particles with an organosilicon compound prior to incorporating the particles into the organosiloxane composition.

公开(公告)号：US20060047043A1

公开(公告)日：2006-03-02

申请号：US10536669

申请日：2003-11-17

Applicant: Kazumi Nakayoshi ,  Hiroki Ishikawa ,  Ryoto Shima ,  Katsutoshi Mine

Inventor： Kazumi Nakayoshi ,  Hiroki Ishikawa ,  Ryoto Shima ,  Katsutoshi Mine

IPC: C08K3/22

CPC classification number: C08L83/04 ,  C08G77/12 ,  C08G77/20 ,  C08K9/04 ,  C09J183/04 ,  H05K3/321

Abstract: A silver-based powder is surface-treated with an oxidation inhibitor by means of a mechanochemical reaction. A method of preparation of the silver-based powder includes using an organic solution of the oxidation inhibitor as a lubricating agent, applying mechanical energy to the silver-based powder, and subjecting the silver-based powder to surface treatment with said oxidation inhibitor by means of a mechanochemical reaction.

Abstract translation: 通过机械化学反应用氧化抑制剂对银基粉末进行表面处理。 制备银基粉末的方法包括使用氧化抑制剂的有机溶液作为润滑剂，向银基粉末施加机械能，并用所述氧化抑制剂对银基粉末进行表面处理 的机械化学反应。

公开(公告)号：US5036024A

公开(公告)日：1991-07-30

申请号：US580054

申请日：1990-09-10

Applicant: Katsutoshi Mine ,  Akemi Kogo ,  Kimio Yamakawa ,  Kazumi Nakayoshi

Inventor： Katsutoshi Mine ,  Akemi Kogo ,  Kimio Yamakawa ,  Kazumi Nakayoshi

IPC: H01L21/56 ,  H01L23/29 ,  H01L23/31 ,  H01L25/065

CPC classification number: H01L21/56 ,  H01L23/293 ,  H01L23/3135 ,  H01L25/0652 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/8592 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/01014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/1301 ,  H01L2924/181 ,  Y10T29/49121

Abstract: Semiconductor devices which comprise a semiconductor chip, electrically conductive materials for connections to external leads, and encapsulated by a sealing resin has a surface and a portion of the electrically conductive material covered with a hardened silicone layer whose surface is exposed to ultraviolet radiation and the irradiation processed surface adheres to and is unified with the sealing resin. The sealing resin does not break easily when the device is exposed to heat cycles, thermal shock, repeated interruptions in current flow, and long periods of time at high temperature or low temperature. Such devices also exhibit excellent properties of moisture resistance, corrosion resistance and stress relaxation.

公开(公告)号：US20050118845A1

公开(公告)日：2005-06-02

申请号：US10496558

申请日：2002-11-21

Applicant: Akihiko Kobayashi ,  Kazumi Nakayoshi ,  Ryoto Shima ,  Yoshito Ushio ,  Katsutoshi Mine

Inventor： Akihiko Kobayashi ,  Kazumi Nakayoshi ,  Ryoto Shima ,  Yoshito Ushio ,  Katsutoshi Mine

IPC: C09J7/00 ,  C09J9/02 ,  C09J121/00 ,  C09J183/04 ,  H01B5/16 ,  H01B13/00 ,  H01L21/48 ,  H01L21/60 ,  H01L23/498 ,  H01R11/01 ,  H05K3/32 ,  H01R4/58

CPC classification number: H01L24/83 ,  C09J7/10 ,  C09J9/02 ,  C09J2201/602 ,  C09J2483/00 ,  H01L21/486 ,  H01L23/49827 ,  H01L24/29 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29299 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/83101 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01058 ,  H01L2924/01061 ,  H01L2924/0107 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/12042 ,  H01L2924/351 ,  H05K3/321 ,  H05K2201/0133 ,  H05K2201/0314 ,  H05K2201/10378 ,  H05K2201/10674 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/05599

Abstract: An anisotropically electroconductive adhesive film is characterized by containing an electroconductive elastomer that traverses the thickness of the adhesive film and is insulated in the plane of the adhesive film comprising electrically insulating elastomer, and both the electroconductive elastomer and the electrically insulating elastomer have a modulus of elasticity at 150° C. that is no greater than 100 MPa. A method for producing the anisotropically electroconductive adhesive film is characterized by forming through holes across the thickness of the adhesive film comprising electrically insulating elastomer, thereafter filling the through holes with an electroconductive elastomer composition, and curing the electroconductive elastomer composition to form the electroconductive elastomer after filling the through holes. A semiconductor device characterized by the electrical connection of the terminals of a semiconductor chip to the interconnect pads of an interconnect substrate by the aforementioned anisotropically electroconductive adhesive film.

Abstract translation: 各向异性导电粘合剂膜的特征在于含有穿过粘合剂膜的厚度并在包含电绝缘弹性体的粘合剂膜的平面中绝缘的导电弹性体，并且导电弹性体和电绝缘弹性体都具有弹性模量 在150℃下不大于100MPa。 制造各向异性导电粘合膜的方法的特征在于，在包括电绝缘弹性体的粘合剂膜的厚度上形成通孔，然后用导电弹性体组合物填充通孔，并且固化导电弹性体组合物以形成导电弹性体 填充通孔。 一种半导体器件，其特征在于通过上述各向异性导电粘合剂膜将半导体芯片的端子与互连衬底的互连焊盘电连接。

公开(公告)号：US06518204B2

公开(公告)日：2003-02-11

申请号：US10094231

申请日：2002-03-07

Applicant: Kimio Yamakawa ,  Kazumi Nakayoshi ,  Hiroki Ishikawa ,  Ryoto Shima ,  Junji Nakanishi ,  Tomoko Kato ,  Minoru Isshiki ,  Katsutoshi Mine

Inventor： Kimio Yamakawa ,  Kazumi Nakayoshi ,  Hiroki Ishikawa ,  Ryoto Shima ,  Junji Nakanishi ,  Tomoko Kato ,  Minoru Isshiki ,  Katsutoshi Mine

IPC: H01L2131

CPC classification number: H01L23/3135 ,  C08F283/12 ,  H01L21/02126 ,  H01L21/02216 ,  H01L21/02282 ,  H01L21/3122 ,  H01L23/293 ,  H01L2224/48091 ,  H01L2924/1301 ,  H01L2924/19041 ,  C08F230/08 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A curable organopolysiloxane composition comprises: (A) an organopolysiloxane with two or more silicon-bonded hydrogen atoms contained in one molecule in an amount not exceeding 0.05 wt. %; (B) an organopolysiloxane with two or more alkenyl groups in one molecule {alkenyl groups of this components are to be in an amount of 0.01 to 1 mole per 1 mole of a silicon-bonded hydrogen atoms contained in said component (A)}; and (C) a hydrosilylation-reaction metal catalyst (with content of metal atoms within the range of 0.01 to 1,000 ppm in terms of weight units). A method of manufacturing a semiconductor device comprises: applying onto the surface of a semiconductor device and curing, the aforementioned curable organopolysiloxane composition.

公开(公告)号：US5173765A

公开(公告)日：1992-12-22

申请号：US619842

申请日：1990-11-29

Applicant: Kazumi Nakayoshi ,  Katsutoshi Mine

Inventor： Kazumi Nakayoshi ,  Katsutoshi Mine

IPC: C09J183/05 ,  C08L83/07 ,  C09J9/02 ,  C09J11/04 ,  C09J183/00 ,  C09J183/07 ,  H01B1/12 ,  H01L21/60 ,  H01L23/495 ,  H01R4/04

CPC classification number: H01L24/83 ,  H01L23/49513 ,  H01L24/29 ,  H01L24/32 ,  H01L2224/05624 ,  H01L2224/29 ,  H01L2224/2919 ,  H01L2224/29191 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48624 ,  H01L2224/48647 ,  H01L2224/48824 ,  H01L2224/48847 ,  H01L2224/73265 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2224/85201 ,  H01L2224/85205 ,  H01L2224/85447 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01055 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/09701 ,  H01L2924/181 ,  Y10T428/31663

Abstract: A conductive adhesive for bonding semiconductor pellets to tabs is made from a conductive addition reaction-curing silicone rubber composition which contains.ltoreq.500 ppm of low-molecular-weight siloxane which has a vapor pressure.gtoreq.10 mmHg at 200.degree. C. The conductive adhesive can contain a metal micropowder such as gold, silver, nickel or copper.

公开(公告)号：US5145931A

公开(公告)日：1992-09-08

申请号：US604843

申请日：1990-10-26

Applicant: Kazumi Nakayoshi ,  Katsutoshi Mine

Inventor： Kazumi Nakayoshi ,  Katsutoshi Mine

IPC: H01L21/52 ,  C08G77/34 ,  C08L83/07 ,  C09J183/00 ,  C09J183/04 ,  C09J183/05 ,  C09J183/07

CPC classification number: C08G77/34 ,  C09J183/04 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/15747

Abstract: An adhesive for bonding a semiconductor pellet to an attachment site where the adhesive is an addition reaction-curing silicone rubber composition which contain .ltoreq.500 ppm of low-molecular-weight siloxane which has a vapor pressure .gtoreq.10 mmHg at 200.degree. C.

公开(公告)号：US07375158B2

公开(公告)日：2008-05-20

申请号：US10511659

申请日：2003-05-29

Applicant: Hiroki Ishikawa ,  Katsutoshi Mine ,  Kimio Yamakawa ,  Kazumi Nakayoshi

Inventor： Hiroki Ishikawa ,  Katsutoshi Mine ,  Kimio Yamakawa ,  Kazumi Nakayoshi

IPC: C08L83/04

CPC classification number: C08K3/08 ,  C08G77/12 ,  C08G77/20 ,  C08K3/10 ,  C08K3/22 ,  C08K2003/2227 ,  C08L83/04 ,  C09K5/14 ,  H01L23/3736 ,  H01L23/3737 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2924/12044 ,  H01L2924/1301 ,  Y10T428/31511 ,  Y10T428/31663 ,  C08L2666/54 ,  C08L83/00 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A thermoconductive curable liquid polymer composition including (A) a curable liquid polymer, (B) a filler made from a thermally-elongatable shape-memory alloy, and (C) a thermoconductive filler other than (B). A semiconductor device having a semiconductor element glued or coated with the thermoconductive curable liquid polymer composition.

Abstract translation: 一种导热固化液体聚合物组合物，其包含（A）可固化液体聚合物，（B）由热可伸长形状记忆合金制成的填料，和（C）除（B）之外的导热填料。 一种半导体器件，其具有胶合或涂覆有导热可固化液体聚合物组合物的半导体元件。

公开(公告)号：US20070292697A1

公开(公告)日：2007-12-20

申请号：US10598967

申请日：2005-03-08

Applicant: Kazumi Nakayoshi ,  Katsutoshi Mine ,  Akihiko Kobayashi

Inventor： Kazumi Nakayoshi ,  Katsutoshi Mine ,  Akihiko Kobayashi

IPC: H01L33/00

CPC classification number: H05K1/056 ,  H01L33/64 ,  H05K2201/0162 ,  H05K2201/10106

Abstract: A metal base circuit substrate for an optical device, which effectively reflects the generated light and radiates heat from the substrate, comprises a metal base substrate made from aluminum or aluminum alloy that supports an electric circuit via an insulation layer, wherein the insulation layer is formed from a transparent cross-linked silicone body, and the electric circuit is formed directly on the insulation layer. And an efficient method for manufacturing the aforementioned substrate comprises the steps of: a) applying a cross-linkable silicone onto the surface of a metal base substrate made from aluminum or aluminum alloy, b) cross-link

Abstract translation: 一种用于光学器件的金属基底电路基板，其有效地反射所产生的光并从基板辐射热量，包括由铝或铝合金制成的金属基底，其通过绝缘层支撑电路，其中形成绝缘层 由透明的交联硅氧烷体构成，电路直接形成在绝缘层上。 并且制造上述基板的有效方法包括以下步骤：a）将可交联的硅氧烷涂覆在由铝或铝合金制成的金属基底的表面上，b）交联