发明授权
US08030178B2 Layer having functionality, method for forming flexible substrate having the same, and method for manufacturing semiconductor device
有权
具有功能的层，具有该层的柔性基板的形成方法以及半导体装置的制造方法
- 专利标题： Layer having functionality, method for forming flexible substrate having the same, and method for manufacturing semiconductor device
- 专利标题（中）： 具有功能的层，具有该层的柔性基板的形成方法以及半导体装置的制造方法
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申请号： US12618956申请日： 2009-11-16
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公开(公告)号： US08030178B2公开(公告)日： 2011-10-04
- 发明人: Tomoyuki Aoki , Takuya Tsurume
- 申请人： Tomoyuki Aoki , Takuya Tsurume
- 申请人地址： JP Atsugi-shi, Kanagawa-ken
- 专利权人： Semiconductor Energy Laboratory Co., Ltd.
- 当前专利权人： Semiconductor Energy Laboratory Co., Ltd.
- 当前专利权人地址： JP Atsugi-shi, Kanagawa-ken
- 代理机构： Robinson Intellectual Property Law Office, P.C.
- 代理商 Eric J. Robinson
- 优先权： JP2005-327951 20051111
- 主分类号： H01L21/46
- IPC分类号： H01L21/46 ; H01L21/469 ; H01L21/31 ; H01L21/84 ; H01L21/205 ; H01L21/331 ; H01L21/336
摘要：
It is an object of the present invention to provide a method for forming a layer having functionality including a conductive layer and a colored layer and a flexible substrate having a layer having functionality with a high yield. Further, it is an object of the present invention to provide a method for manufacturing a semiconductor device that is small-sized, thin, and lightweight. After coating a substrate having heat resistance with a silane coupling agent, a layer having functionality is formed. Then, after attaching an adhesive to the layer having functionality, the layer having functionality is peeled from the substrate. Further, after coating a substrate having heat resistance with a silane coupling agent, a layer having functionality is formed. Then, an adhesive is attached to the layer having functionality. Thereafter, the layer having functionality is peeled from the substrate, and a flexible substrate is attached to the layer having functionality.
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