Substrate handling device and processing chamber

    公开(公告)号:US11752638B2

    公开(公告)日:2023-09-12

    申请号:US17835921

    申请日:2022-06-08

    摘要: A substrate handling device includes a substrate reception area defined by an edge. The substrate reception area includes a planar surface, wherein the edge extends upward from the planar surface. The substrate reception area further includes a plurality of contact structures extending upwards from the planar surface, wherein a first contact structure of the plurality of contact structures directly contacts a side surface of the edge, a second contact structure of the plurality of contact structures separated from the edge, a shape of the first contact structure is different from a shape of the second contact structure. The substrate reception area and the planar surface include a first material. Each contact structure of the plurality of contact structures includes a second material different from the first material, and the second material has a hardness aligned to a hardness of a substrate material.

    Method of forming conductive bumps for cooling device connection

    公开(公告)号:US10651111B2

    公开(公告)日:2020-05-12

    申请号:US15889450

    申请日:2018-02-06

    摘要: A method of preparing a semiconductor substrate with metal bumps on both sides of the substrate includes depositing a first-side UBM layer on a first surface of the substrate, and forming a plurality of first-side metal bumps on the first surface of the substrate after the first-side UBM layer is deposited. The method includes forming a second-side UBM layer on a second side of the substrate, and the first surface and the second surface are opposite of each other. The method includes forming a plurality of second-side metal bumps on the second surface of the substrate after the second-side UBM layer is deposited. The method includes removing exposed first-side UBM layer and exposed second-side UBM layer after the plurality of first-side metal bumps and the plurality of second-side metal bumps are formed. The method includes reflowing the plurality of first-side metal bumps and the plurality of second side metal bumps.

    Probe card for simultaneously testing multiple dies
    9.
    发明授权
    Probe card for simultaneously testing multiple dies 有权
    用于同时测试多个模具的探针卡

    公开(公告)号:US09594096B2

    公开(公告)日:2017-03-14

    申请号:US13969284

    申请日:2013-08-16

    IPC分类号: G01R31/20 G01R1/073 G01R3/00

    摘要: In accordance with an embodiment, a probe card comprises a contact pad interface comprising front side contacts and back side contacts electrically coupled together. The front side contacts are arranged to simultaneously electrically couple respective bumps of a plurality of dies on a wafer, and the back side contacts are arranged to electrically couple respective contacts of a testing structure.

    摘要翻译: 根据一个实施例,探针卡包括接触垫接口,其包括电连接在一起的前侧触点和后侧触点。 前侧触点被布置成同时电耦合在晶片上的多个管芯的相应凸起,并且后侧触点被布置成电耦合测试结构的各个触点。