Invention Grant
- Patent Title: Probe card for simultaneously testing multiple dies
- Patent Title (中): 用于同时测试多个模具的探针卡
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Application No.: US13969284Application Date: 2013-08-16
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Publication No.: US09594096B2Publication Date: 2017-03-14
- Inventor: You-Hua Chou , Yi-Jen Lai
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater Matsil, LLP
- Main IPC: G01R31/20
- IPC: G01R31/20 ; G01R1/073 ; G01R3/00
Abstract:
In accordance with an embodiment, a probe card comprises a contact pad interface comprising front side contacts and back side contacts electrically coupled together. The front side contacts are arranged to simultaneously electrically couple respective bumps of a plurality of dies on a wafer, and the back side contacts are arranged to electrically couple respective contacts of a testing structure.
Public/Granted literature
- US20130328586A1 Probe Card for Simultaneously Testing Multiple Dies Public/Granted day:2013-12-12
Information query
