- Patent Title: Method of forming conductive bumps for cooling device connection
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Application No.: US14593617Application Date: 2015-01-09
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Publication No.: US09899296B2Publication Date: 2018-02-20
- Inventor: You-Hua Chou , Yi-Jen Lai , Chun-Jen Chen , Perre Kao
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Hauptman, Ham, LLP
- Main IPC: H01L21/44
- IPC: H01L21/44 ; H01L23/473 ; H01L25/065 ; H01L23/488 ; H01L23/00 ; H01L23/48 ; H01L23/367 ; H01L23/42

Abstract:
A method of preparing a semiconductor substrate with metal bumps on both sides of the substrate includes depositing a first-side UBM layer on a first surface of the substrate, and forming a plurality of first-side metal bumps on the first surface of the substrate after the first-side UBM layer is deposited. The method includes forming a second-side UBM layer on a second side of the substrate, and the first surface and the second surface are opposite of each other. The method includes forming a plurality of second-side metal bumps on the second surface of the substrate after the second-side UBM layer is deposited. The method includes removing exposed first-side UBM layer and exposed second-side UBM layer after the plurality of first-side metal bumps and the plurality of second-side metal bumps are formed. The method includes reflowing the plurality of first-side metal bumps and the plurality of second side metal bumps.
Public/Granted literature
- US20150125998A1 METAL BUMPS FOR COOLING DEVICE CONNECTION Public/Granted day:2015-05-07
Information query
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