公开(公告)号：US10056342B2

公开(公告)日：2018-08-21

申请号：US13664761

申请日：2012-10-31

申请人： FUJITSU LIMITED

发明人： Seiki Sakuyama ,  Toshiya Akamatsu ,  Nobuhiro Imaizumi ,  Keisuke Uenishi ,  Kenichi Yasaka ,  Toru Sakai

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L23/00 ,  H01L23/498 ,  H05K3/34

CPC分类号： H01L24/16 ,  H01L23/49811 ,  H01L23/49838 ,  H01L23/49866 ,  H01L24/05 ,  H01L24/13 ,  H01L2224/0401 ,  H01L2224/05023 ,  H01L2224/05147 ,  H01L2224/05564 ,  H01L2224/05568 ,  H01L2224/05639 ,  H01L2224/13023 ,  H01L2224/13111 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2224/16503 ,  H01L2224/16505 ,  H01L2924/00014 ,  H05K3/3436 ,  H01L2924/01047 ,  H01L2924/00012 ,  H01L2924/01029 ,  H01L2924/0105 ,  H01L2224/05552

摘要： A surface of at least one of a connection terminal of an electronic component and a connection terminal of a circuit board is covered with a protection layer made of a AgSn alloy. The connection terminal of the electronic component is soldered to the connection terminal of the circuit board.

公开(公告)号：US20170207186A1

公开(公告)日：2017-07-20

申请号：US15362246

申请日：2016-11-28

申请人： FUJITSU LIMITED

发明人： Taiki Uemura ,  Seiki Sakuyama

IPC分类号： H01L23/00 ,  C22C13/00 ,  C22C28/00 ,  C22C9/02 ,  B23K35/26 ,  B23K35/30

CPC分类号： H01L24/17 ,  B23K35/262 ,  B23K35/302 ,  C22C9/02 ,  C22C13/00 ,  C22C28/00 ,  H01L24/11 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/05147 ,  H01L2224/13082 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13139 ,  H01L2224/13147 ,  H01L2224/16145 ,  H01L2224/16227 ,  H01L2224/81815 ,  H01L2924/014

摘要： An electronic device includes an electrode including Cu, a solder including Sn and provided above the electrode, and a joining layer including In and Ag and provided along a boundary between the electrode and the solder. The joining layer including In and Ag prevents Cu—Sn alloy, such as Cu6 Sn5, from being formed at the boundary between the electrode and the solder, and prevents generation of voids and cracks resulting from the Cu—Sn alloy. The electrode and the solder are joined with sufficient strength by the joining layer.

公开(公告)号：US20170012013A1

公开(公告)日：2017-01-12

申请号：US15271744

申请日：2016-09-21

申请人： FUJITSU LIMITED

发明人： KOZO SHIMIZU ,  Seiki Sakuyama

IPC分类号： H01L23/00 ,  H01L23/498 ,  B23K35/26 ,  H01L23/31 ,  B23K1/00 ,  B23K35/02

CPC分类号： H01L24/17 ,  B23K1/0008 ,  B23K1/0016 ,  B23K3/085 ,  B23K35/0244 ,  B23K35/262 ,  B23K35/264 ,  B23K2101/40 ,  B23K2101/42 ,  H01L23/145 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/3675 ,  H01L23/488 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L24/13 ,  H01L24/16 ,  H01L24/19 ,  H01L24/20 ,  H01L24/73 ,  H01L24/75 ,  H01L24/81 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/05082 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05567 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/11334 ,  H01L2224/1146 ,  H01L2224/13016 ,  H01L2224/13076 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13164 ,  H01L2224/1601 ,  H01L2224/16145 ,  H01L2224/16157 ,  H01L2224/16235 ,  H01L2224/16238 ,  H01L2224/16505 ,  H01L2224/16507 ,  H01L2224/24137 ,  H01L2224/24195 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/32225 ,  H01L2224/33181 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/75253 ,  H01L2224/75501 ,  H01L2224/75502 ,  H01L2224/759 ,  H01L2224/81005 ,  H01L2224/81075 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/8121 ,  H01L2224/81411 ,  H01L2224/81815 ,  H01L2224/81948 ,  H01L2224/81986 ,  H01L2225/06513 ,  H01L2924/014 ,  H01L2924/10252 ,  H01L2924/10253 ,  H01L2924/10271 ,  H01L2924/10329 ,  H01L2924/10335 ,  H01L2924/13091 ,  H01L2924/15311 ,  H01L2924/15313 ,  H01L2924/1579 ,  H01L2924/16235 ,  H01L2924/16251 ,  H01L2924/1659 ,  H01L2924/16747 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/3512 ,  H01L2924/35121 ,  H05K1/0203 ,  H05K1/09 ,  H05K1/113 ,  H05K3/3436 ,  H05K3/3463 ,  H05K2201/0248 ,  H05K2201/09972 ,  H05K2201/1056 ,  H05K2203/1121 ,  H05K2203/304 ,  H01L2924/00012 ,  H01L2924/01047 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01028 ,  H01L2924/01079 ,  H01L2924/01046 ,  H01L2924/00

摘要： An electronic apparatus includes a first electronic part with a first terminal, a second electronic part with a second terminal opposite the first terminal, and a joining portion which joins the first terminal and the second terminal. The joining portion contains a pole-like compound extending in a direction in which the first terminal and the second terminal are opposite to each other. The joining portion contains the pole-like compound, so the strength of the joining portion is improved. When the first terminal and the second terminal are joined, the temperature of one of the first electronic part and the second electronic part is made higher than that of the other. A joining material is cooled and solidified in this state. By doing so, the pole-like compound is formed.

摘要翻译： 电子设备包括具有第一端子的第一电子部件，与第一端子相对的第二端子的第二电子部件和与第一端子和第二端子连接的接合部。 接合部分包含在第一端子和第二端子彼此相对的方向上延伸的极性化合物。 接合部分包含杆状化合物，从而提高接合部分的强度。 当第一端子和第二端子接合时，第一电子部件和第二电子部件之一的温度被制成高于另一端子的温度。 在该状态下将接合材料冷却并固化。 通过这样做，形成极点状化合物。

公开(公告)号：US20150024555A1

公开(公告)日：2015-01-22

申请号：US14508736

申请日：2014-10-07

申请人： FUJITSU LIMITED

发明人： Kozo SHIMIZU ,  Seiki Sakuyama ,  Toshiya Akamatsu

IPC分类号： H01L23/00

CPC分类号： H01L24/81 ,  H01L21/50 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49866 ,  H01L23/5383 ,  H01L24/13 ,  H01L24/16 ,  H01L24/73 ,  H01L25/0655 ,  H01L25/0657 ,  H01L2224/0401 ,  H01L2224/05647 ,  H01L2224/13111 ,  H01L2224/16145 ,  H01L2224/16148 ,  H01L2224/16238 ,  H01L2224/16506 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/81002 ,  H01L2224/81065 ,  H01L2224/81075 ,  H01L2224/81191 ,  H01L2224/8121 ,  H01L2224/8142 ,  H01L2224/81439 ,  H01L2224/81444 ,  H01L2224/81447 ,  H01L2224/81455 ,  H01L2224/81457 ,  H01L2224/81464 ,  H01L2224/81469 ,  H01L2224/81805 ,  H01L2224/81893 ,  H01L2224/81931 ,  H01L2224/83815 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/01083

摘要： A semiconductor device, includes: a connection member including a first pad formed on a principal surface thereof; a semiconductor chip including a circuit-formed surface on which a second pad is formed, the chip mounted on the connection member so that the circuit-formed surface faces the principal surface; and a solder bump that connects the first and second pads and is made of metal containing Bi and Sn, wherein the bump includes a first interface-layer formed adjacent to the second pad, a second interface-layer formed adjacent to the first pad, a first intermediate region formed adjacent to either one of the interface-layers, and a second intermediate region formed adjacent to the other one of the interface-layers and formed adjacent to the first intermediate region; Bi-concentration in the first intermediate region is higher than a Sn-concentration; and a Sn-concentration in the second intermediate region is higher than a Bi-concentration.

摘要翻译： 一种半导体器件，包括：连接构件，包括形成在其主表面上的第一焊盘; 半导体芯片，其包括形成有第二焊盘的电路形成表面，所述芯片安装在所述连接构件上，使得所述电路形成表面面向所述主表面; 以及焊料凸块，其连接所述第一和第二焊盘，并且由含有Bi和Sn的金属制成，其中所述凸块包括邻近所述第二焊盘形成的第一界面层，邻近所述第一焊盘形成的第二界面层， 形成在与所述界面层中的任一个邻接的第一中间区域和与所述界面层中的另一个相邻地形成并与所述第一中间区域相邻形成的第二中间区域; 第一中间区域的双浓度高于Sn-浓度; 并且第二中间区域中的Sn浓度高于Bi浓度。

公开(公告)号：US20140202739A1

公开(公告)日：2014-07-24

申请号：US14221431

申请日：2014-03-21

申请人： FUJITSU LIMITED

发明人： Taiji Sakai ,  Seiki Sakuyama

IPC分类号： H05K1/02 ,  H05K13/04

CPC分类号： H05K1/0298 ,  H01L23/49822 ,  H01L23/49866 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/13099 ,  H01L2224/81097 ,  H01L2224/81815 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01055 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/30105 ,  H05K3/3436 ,  H05K3/3473 ,  H05K13/0465 ,  H05K2201/10674 ,  H05K2203/072 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49128 ,  Y10T29/49139 ,  Y10T29/49149 ,  Y10T29/49155

摘要： A printed wiring board includes a Cu wiring pattern formed on a substrate. A first metal layer is formed on the Cu wiring pattern. A second metal layer is formed on the first metal layer. The first metal layer has a less reactivity with Cu than the second metal layer. The first metal layer and the second metal layer together cause an eutectic reaction.

摘要翻译： 印刷电路板包括形成在基板上的Cu布线图案。 在Cu布线图案上形成第一金属层。 在第一金属层上形成第二金属层。 第一金属层与Cu的反应性比第二金属层低。 第一金属层和第二金属层一起引起共晶反应。

公开(公告)号：US20140103097A1

公开(公告)日：2014-04-17

申请号：US14106041

申请日：2013-12-13

申请人： FUJITSU LIMITED

发明人： Masaharu Furuyama ,  Daisuke Mizutani ,  Seiki Sakuyama ,  Toshiya Akamatsu

IPC分类号： H05K3/10

CPC分类号： H05K3/10 ,  H01L23/49811 ,  H01L2224/13023 ,  H01L2924/0002 ,  H01L2924/15311 ,  H05K3/244 ,  H05K3/3436 ,  H05K3/3463 ,  H05K2203/1105 ,  H01L2924/00

摘要： There is provided a circuit board to which a solder ball composed of a lead (Pb)-free solder is to be connected, a semiconductor device including an electrode and a solder ball composed of a lead (Pb)-free solder disposed on the electrode, and a method of manufacturing the semiconductor device, in which mounting reliability can be improved by enhancing the bonding strength (adhesion strength) between the solder ball composed of a lead (Pb)-free solder and the electrode.

摘要翻译： 提供了一种电路板，由不含铅（Pb）的焊料组成的焊球将连接到该电路板上，包括电极的半导体器件和由设置在电极上的无铅焊料组成的焊球 以及通过提高由无铅焊料（Pb）构成的焊料球与电极之间的接合强度（粘合强度）可以提高安装可靠性的半导体装置的制造方法。

公开(公告)号：US20170062373A1

公开(公告)日：2017-03-02

申请号：US15351992

申请日：2016-11-15

申请人： FUJITSU LIMITED

发明人： Kozo Shimizu ,  Seiki Sakuyama

IPC分类号： H01L23/00 ,  H01L25/00 ,  H01L25/065

CPC分类号： H01L24/17 ,  B23K1/0008 ,  B23K1/0016 ,  B23K3/085 ,  B23K35/0244 ,  B23K35/262 ,  B23K35/264 ,  B23K2101/40 ,  B23K2101/42 ,  H01L23/145 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/3675 ,  H01L23/488 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L24/13 ,  H01L24/16 ,  H01L24/19 ,  H01L24/20 ,  H01L24/73 ,  H01L24/75 ,  H01L24/81 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/05082 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05567 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/11334 ,  H01L2224/1146 ,  H01L2224/13016 ,  H01L2224/13076 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13164 ,  H01L2224/1601 ,  H01L2224/16145 ,  H01L2224/16157 ,  H01L2224/16235 ,  H01L2224/16238 ,  H01L2224/16505 ,  H01L2224/16507 ,  H01L2224/24137 ,  H01L2224/24195 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/32225 ,  H01L2224/33181 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/75253 ,  H01L2224/75501 ,  H01L2224/75502 ,  H01L2224/759 ,  H01L2224/81005 ,  H01L2224/81075 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/8121 ,  H01L2224/81411 ,  H01L2224/81815 ,  H01L2224/81948 ,  H01L2224/81986 ,  H01L2225/06513 ,  H01L2924/014 ,  H01L2924/10252 ,  H01L2924/10253 ,  H01L2924/10271 ,  H01L2924/10329 ,  H01L2924/10335 ,  H01L2924/13091 ,  H01L2924/15311 ,  H01L2924/15313 ,  H01L2924/1579 ,  H01L2924/16235 ,  H01L2924/16251 ,  H01L2924/1659 ,  H01L2924/16747 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/3512 ,  H01L2924/35121 ,  H05K1/0203 ,  H05K1/09 ,  H05K1/113 ,  H05K3/3436 ,  H05K3/3463 ,  H05K2201/0248 ,  H05K2201/09972 ,  H05K2201/1056 ,  H05K2203/1121 ,  H05K2203/304 ,  H01L2924/00012 ,  H01L2924/01047 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01028 ,  H01L2924/01079 ,  H01L2924/01046 ,  H01L2924/00

摘要： An electronic apparatus includes a first electronic part with a first terminal, a second electronic part with a second terminal opposite the first terminal, and a joining portion which joins the first terminal and the second terminal. The joining portion contains a pole-like compound extending in a direction in which the first terminal and the second terminal are opposite to each other. The joining portion contains the pole-like compound, so the strength of the joining portion is improved. When the first terminal and the second terminal are joined, the temperature of one of the first electronic part and the second electronic part is made higher than that of the other. A joining material is cooled and solidified in this state. By doing so, the pole-like compound is formed.

公开(公告)号：US20160354871A1

公开(公告)日：2016-12-08

申请号：US15097516

申请日：2016-04-13

申请人： FUJITSU LIMITED

发明人： KOZO SHIMIZU ,  Seiki Sakuyama ,  Nobuhiro Imaizumi

IPC分类号： B23K35/36 ,  B23K35/362 ,  H01L23/00

CPC分类号： B23K35/3613 ,  B23K35/0222 ,  B23K35/262 ,  B23K35/3006 ,  B23K35/36 ,  B23K35/3612 ,  B23K35/362 ,  B23K2101/40 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/05647 ,  H01L2224/13111 ,  H01L2224/13139 ,  H01L2224/16238 ,  H01L2224/81011 ,  H01L2224/81024 ,  H01L2224/81193 ,  H01L2224/81203 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/8191 ,  H01L2924/014 ,  H01L2924/2064 ,  H01L2924/20641 ,  H01L2924/00014 ,  H01L2924/01047 ,  H01L2924/0105

摘要： A flux includes: a first glycol-based polyhydric alcohol having a molecular weight of 300 or less; and a second glycol-based polyhydric alcohol having a molecular weight of 600 or more.

摘要翻译： 助熔剂包括：分子量为300以下的第一种基于二醇的多元醇; 和分子量为600以上的第二二醇类多元醇。

公开(公告)号：US20160247776A1

公开(公告)日：2016-08-25

申请号：US15142690

申请日：2016-04-29

申请人： FUJITSU LIMITED

发明人： KOZO SHIMIZU ,  Seiki Sakuyama

IPC分类号： H01L23/00

CPC分类号： H01L24/17 ,  B23K1/0008 ,  B23K1/0016 ,  B23K3/085 ,  B23K35/0244 ,  B23K35/262 ,  B23K35/264 ,  B23K2101/40 ,  B23K2101/42 ,  H01L23/145 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/3675 ,  H01L23/488 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L24/13 ,  H01L24/16 ,  H01L24/19 ,  H01L24/20 ,  H01L24/73 ,  H01L24/75 ,  H01L24/81 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/05082 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05567 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/11334 ,  H01L2224/1146 ,  H01L2224/13016 ,  H01L2224/13076 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13164 ,  H01L2224/1601 ,  H01L2224/16145 ,  H01L2224/16157 ,  H01L2224/16235 ,  H01L2224/16238 ,  H01L2224/16505 ,  H01L2224/16507 ,  H01L2224/24137 ,  H01L2224/24195 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/32225 ,  H01L2224/33181 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/75253 ,  H01L2224/75501 ,  H01L2224/75502 ,  H01L2224/759 ,  H01L2224/81005 ,  H01L2224/81075 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/8121 ,  H01L2224/81411 ,  H01L2224/81815 ,  H01L2224/81948 ,  H01L2224/81986 ,  H01L2225/06513 ,  H01L2924/014 ,  H01L2924/10252 ,  H01L2924/10253 ,  H01L2924/10271 ,  H01L2924/10329 ,  H01L2924/10335 ,  H01L2924/13091 ,  H01L2924/15311 ,  H01L2924/15313 ,  H01L2924/1579 ,  H01L2924/16235 ,  H01L2924/16251 ,  H01L2924/1659 ,  H01L2924/16747 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/3512 ,  H01L2924/35121 ,  H05K1/0203 ,  H05K1/09 ,  H05K1/113 ,  H05K3/3436 ,  H05K3/3463 ,  H05K2201/0248 ,  H05K2201/09972 ,  H05K2201/1056 ,  H05K2203/1121 ,  H05K2203/304 ,  H01L2924/00012 ,  H01L2924/01047 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01028 ,  H01L2924/01079 ,  H01L2924/01046 ,  H01L2924/00

摘要： An electronic apparatus includes a first electronic part with a first terminal, a second electronic part with a second terminal opposite the first terminal, and a joining portion which joins the first terminal and the second terminal. The joining portion contains a pole-like compound extending in a direction in which the first terminal and the second terminal are opposite to each other. The joining portion contains the pole-like compound, so the strength of the joining portion is improved. When the first terminal and the second terminal are joined, the temperature of one of the first electronic part and the second electronic part is made higher than that of the other. A joining material is cooled and solidified in this state. By doing so, the pole-like compound is formed.

公开(公告)号：US20160233181A1

公开(公告)日：2016-08-11

申请号：US14994529

申请日：2016-01-13

申请人： FUJITSU LIMITED

发明人： Taiki Uemura ,  Seiki Sakuyama ,  Kozo Shimizu

IPC分类号： H01L23/00

CPC分类号： H01L24/05 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49894 ,  H01L23/528 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L24/98 ,  H01L2224/0401 ,  H01L2224/05082 ,  H01L2224/05084 ,  H01L2224/05109 ,  H01L2224/05139 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05164 ,  H01L2224/05609 ,  H01L2224/05644 ,  H01L2224/131 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/16227 ,  H01L2224/16503 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/81409 ,  H01L2224/81444 ,  H01L2224/81815 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0132 ,  H01L2924/0133 ,  H05K1/111 ,  H05K3/3436 ,  H05K3/4007 ,  H05K2201/0338 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/00012

摘要： An electronic device includes a first electronic component including a first electrode, a solder provided above the first electrode, and a first bonding layer provided between the first electrode and the solder and containing Pd, Ag, and In. In another aspect of the invention, a method for manufacturing an electronic device, the method includes providing a solder containing In and Ag above a layer containing Pd and provided above an electrode of an electronic component; and melting the solder by heating to form a bonding layer containing Pd, Ag, and In between the electrode and the solder.

摘要翻译： 电子设备包括第一电子部件，其包括第一电极，设置在第一电极上方的焊料，以及设置在第一电极和焊料之间并且包含Pd，Ag和In的第一接合层。 在本发明的另一方面，一种用于制造电子器件的方法，该方法包括在包含Pd的层上提供含有In和Ag的焊料，并且设置在电子部件的电极上方; 并通过加热熔化焊料，以在电极和焊料之间形成含有Pd，Ag和In的结合层。