- 专利标题： Electronic component and electronic device
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申请号： US13664761申请日： 2012-10-31
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公开(公告)号： US10056342B2公开(公告)日： 2018-08-21
- 发明人: Seiki Sakuyama , Toshiya Akamatsu , Nobuhiro Imaizumi , Keisuke Uenishi , Kenichi Yasaka , Toru Sakai
- 申请人： FUJITSU LIMITED
- 申请人地址： JP Kawasaki
- 专利权人： FUJITSU LIMITED
- 当前专利权人： FUJITSU LIMITED
- 当前专利权人地址： JP Kawasaki
- 代理机构： Kratz, Quintos & Hanson, LLP
- 优先权： JP2011-282725 20111226
- 主分类号： H01L23/48
- IPC分类号： H01L23/48 ; H01L23/52 ; H01L23/00 ; H01L23/498 ; H05K3/34
摘要：
A surface of at least one of a connection terminal of an electronic component and a connection terminal of a circuit board is covered with a protection layer made of a AgSn alloy. The connection terminal of the electronic component is soldered to the connection terminal of the circuit board.
公开/授权文献
- US20130164956A1 ELECTRONIC COMPONENT AND ELECTRONIC DEVICE 公开/授权日：2013-06-27
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