公开(公告)号：US10062658B2

公开(公告)日：2018-08-28

申请号：US14792476

申请日：2015-07-06

Applicant: FUJITSU LIMITED

Inventor： Seiki Sakuyama ,  Toshiya Akamatsu ,  Nobuhiro Imaizumi ,  Keisuke Uenishi ,  Kenichi Yasaka ,  Toru Sakai

IPC: H01L23/00 ,  H01L23/498 ,  H05K3/34

CPC classification number: H01L24/16 ,  H01L23/49811 ,  H01L23/49838 ,  H01L23/49866 ,  H01L24/05 ,  H01L24/13 ,  H01L2224/0401 ,  H01L2224/05023 ,  H01L2224/05147 ,  H01L2224/05564 ,  H01L2224/05568 ,  H01L2224/05639 ,  H01L2224/13023 ,  H01L2224/13111 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2224/16503 ,  H01L2224/16505 ,  H01L2924/00014 ,  H05K3/3436 ,  H01L2924/01047 ,  H01L2924/00012 ,  H01L2924/01029 ,  H01L2924/0105 ,  H01L2224/05552

Abstract: A surface of at least one of a connection terminal of an electronic component and a connection terminal of a circuit board is covered with a protection layer made of a AgSn alloy. The connection terminal of the electronic component is soldered to the connection terminal of the circuit board.

公开(公告)号：US10056342B2

公开(公告)日：2018-08-21

申请号：US13664761

申请日：2012-10-31

Applicant: FUJITSU LIMITED

Inventor： Seiki Sakuyama ,  Toshiya Akamatsu ,  Nobuhiro Imaizumi ,  Keisuke Uenishi ,  Kenichi Yasaka ,  Toru Sakai

IPC: H01L23/48 ,  H01L23/52 ,  H01L23/00 ,  H01L23/498 ,  H05K3/34

CPC classification number: H01L24/16 ,  H01L23/49811 ,  H01L23/49838 ,  H01L23/49866 ,  H01L24/05 ,  H01L24/13 ,  H01L2224/0401 ,  H01L2224/05023 ,  H01L2224/05147 ,  H01L2224/05564 ,  H01L2224/05568 ,  H01L2224/05639 ,  H01L2224/13023 ,  H01L2224/13111 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2224/16503 ,  H01L2224/16505 ,  H01L2924/00014 ,  H05K3/3436 ,  H01L2924/01047 ,  H01L2924/00012 ,  H01L2924/01029 ,  H01L2924/0105 ,  H01L2224/05552

Abstract: A surface of at least one of a connection terminal of an electronic component and a connection terminal of a circuit board is covered with a protection layer made of a AgSn alloy. The connection terminal of the electronic component is soldered to the connection terminal of the circuit board.

公开(公告)号：US20150311171A1

公开(公告)日：2015-10-29

申请号：US14792476

申请日：2015-07-06

Applicant: FUJITSU LIMITED

Inventor： Seiki SAKUYAMA ,  Toshiya Akamatsu ,  Nobuhiro Imaizumi ,  Keisuke Uenishi ,  Kenichi Yasaka ,  Toru Sakai

IPC: H01L23/00 ,  H01L23/498

CPC classification number: H01L24/16 ,  H01L23/49811 ,  H01L23/49838 ,  H01L23/49866 ,  H01L24/05 ,  H01L24/13 ,  H01L2224/0401 ,  H01L2224/05023 ,  H01L2224/05147 ,  H01L2224/05564 ,  H01L2224/05568 ,  H01L2224/05639 ,  H01L2224/13023 ,  H01L2224/13111 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2224/16503 ,  H01L2224/16505 ,  H01L2924/00014 ,  H05K3/3436 ,  H01L2924/01047 ,  H01L2924/00012 ,  H01L2924/01029 ,  H01L2924/0105 ,  H01L2224/05552

Abstract: A surface of a connection terminal of an electronic component is covered with a protection layer made of a AgSn alloy. The electronic component is soldered to a connection terminal of a circuit board.

Abstract translation: 电子部件的连接端子的表面覆盖有由AgSn合金制成的保护层。 电子部件被焊接到电路板的连接端子。