知搜-全球专利检索

  1. 登录
  2. 注册

搜索结果

7 条记录 (耗时 0.015 秒)

    Circuit board, method for manufacturing circuit board, and electronic device
    1.
    发明授权
    Circuit board, method for manufacturing circuit board, and electronic device 有权

    公开(公告)号：US10896871B2

    公开(公告)日：2021-01-19

    申请号：US16163778

    申请日：2018-10-18

    申请人： FUJITSU LIMITED

    发明人： Tomoyuki Akahoshi ,  Masaharu Furuyama ,  Daisuke Mizutani

    IPC分类号： H01L23/522 ,  H01G4/228 ,  H01L23/498 ,  H01G4/33 ,  H05K1/16 ,  H01L23/48 ,  H01L49/02 ,  H05K1/11 ,  H05K3/46

    摘要： A circuit board includes an insulating layer; a capacitor which is provided in the insulating layer and includes a dielectric layer, a first conductor layer provided on a first surface of the dielectric layer and including a first opening part, and a second conductor layer provided on a second surface opposite to the first surface of the dielectric layer and including a second opening part at a position corresponding to the first opening part; a first conductor via provided in the insulating layer, penetrating the dielectric layer, the first opening part and the second opening part, and being smaller than the first opening part and the second opening part in plan view; a second conductor via provided in the insulating layer and making contact with the second conductor layer; and a third conductor layer provided on the insulating layer and electrically coupled to the first and the second conductor vias.

    CIRCUIT SUBSTRATE AND METHOD FOR FABRICATING CIRCUIT SUBSTRATE
    4.
    发明申请
    CIRCUIT SUBSTRATE AND METHOD FOR FABRICATING CIRCUIT SUBSTRATE 审中-公开

    公开(公告)号：US20190306981A1

    公开(公告)日：2019-10-03

    申请号：US16263041

    申请日：2019-01-31

    申请人： FUJITSU LIMITED

    发明人： Masaharu Furuyama ,  Daisuke Mizutani ,  Tomoyuki AKAHOSHI

    IPC分类号： H05K1/16 ,  H05K1/11 ,  H05K1/02 ,  H05K3/46 ,  H05K3/34

    摘要： A circuit substrate includes a first insulating layer, a capacitor disposed over the first insulating layer, the capacitor including a dielectric layer, a first conductor layer disposed on a first face of the dielectric layer, and a second conductor layer disposed on a second face opposite to the first face of the dielectric layer and having an electric resistivity higher than that of the first conductor layer, a third conductor layer disposed on a surface of the second conductor layer, the third conductor layer having an electric resistivity lower than that of the second conductor layer, a second insulating layer covering the capacitor, and a conductor via disposed in the second insulating layer, the conductor via being coupled to a portion of the third conductor layer.

    CIRCUIT BOARD, METHOD FOR MANUFACTURING CIRCUIT BOARD, AND ELECTRONIC DEVICE
    6.
    发明申请
    CIRCUIT BOARD, METHOD FOR MANUFACTURING CIRCUIT BOARD, AND ELECTRONIC DEVICE 审中-公开

    公开(公告)号：US20190051598A1

    公开(公告)日：2019-02-14

    申请号：US16163778

    申请日：2018-10-18

    申请人： FUJITSU LIMITED

    发明人： Tomoyuki AKAHOSHI ,  Masaharu Furuyama ,  Daisuke Mizutani

    IPC分类号： H01L23/522 ,  H05K1/16 ,  H05K1/11 ,  H01L49/02 ,  H01L23/48

    摘要： A circuit board includes an insulating layer, a capacitor which is provided in the insulating layer and includes a dielectric layer, a first conductor layer provided on a first surface of the dielectric layer and including a first opening part, and a second conductor layer provided on a second surface opposite to the first surface of the dielectric layer and including a second opening part at a position corresponding to the first opening part; a first conductor via provided in the insulating layer, penetrating the dielectric layer, the first opening part and the second opening part, and being smaller than the first opening part and the second opening part in plan view; a second conductor via provided in the insulating layer and making contact with the second conductor layer; and a third conductor layer provided on the insulating layer and electrically coupled to the first and the second conductor vias.