公开(公告)号：US09583416B2

公开(公告)日：2017-02-28

申请号：US15058671

申请日：2016-03-02

Applicant: OLYMPUS CORPORATION

Inventor： Takanori Sekido ,  Masato Mikami

IPC: H01L23/00 ,  H01L23/48 ,  H01L21/56 ,  H01L23/24 ,  H01L23/31 ,  H01L23/498 ,  H01L25/065 ,  H01L23/544

CPC classification number: H01L23/48 ,  H01L21/56 ,  H01L23/24 ,  H01L23/3107 ,  H01L23/3135 ,  H01L23/3157 ,  H01L23/3185 ,  H01L23/4985 ,  H01L23/544 ,  H01L24/16 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/0657 ,  H01L2224/0401 ,  H01L2224/05099 ,  H01L2224/05599 ,  H01L2224/1134 ,  H01L2224/131 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/16238 ,  H01L2224/26145 ,  H01L2224/2929 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/8113 ,  H01L2224/81132 ,  H01L2224/81139 ,  H01L2224/81191 ,  H01L2224/81815 ,  H01L2224/8313 ,  H01L2224/83132 ,  H01L2224/83191 ,  H01L2224/83862 ,  H01L2224/83874 ,  H01L2224/92125 ,  H01L2224/92225 ,  H01L2225/06517 ,  H01L2225/06562 ,  H01L2225/06572 ,  H01L2225/06582 ,  H01L2225/06593 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/014

Abstract: A semiconductor-device mounting structure includes a first semiconductor device and a plate-shaped second semiconductor device connected to the first semiconductor device. The first semiconductor device includes a flexible board, an electronic component, and a sealing resin. The flexible board includes a bendable flexible portion and a hard portion. The flexible portion is bent at a boundary with the hard portion, along a shape of the electronic component such that the flexible board covers the electronic component. The flexible board and the electronic component are sealed with the sealing resin. The first semiconductor device is provided vertical to the second semiconductor device such that the hard portion is provided parallel to the second semiconductor device, and a length of the hard portion in a direction perpendicular to a bend line of the flexible portion is equal to a thickness of a bottom surface of the electronic component in the direction.

Abstract translation: 半导体器件安装结构包括第一半导体器件和连接到第一半导体器件的板状第二半导体器件。 第一半导体器件包括柔性板，电子部件和密封树脂。 柔性板包括可弯曲的柔性部分和硬的部分。 柔性部分沿着电子部件的形状与硬部分的边界弯曲，使得柔性板覆盖电子部件。 柔性板和电子部件用密封树脂密封。 第一半导体器件垂直于第二半导体器件设置，使得硬部分平行于第二半导体器件设置，并且在垂直于柔性部分的弯曲线的方向上的硬部分的长度等于厚度 的电子部件的底面。

公开(公告)号：US09490191B2

公开(公告)日：2016-11-08

申请号：US13932333

申请日：2013-07-01

Applicant: OLYMPUS CORPORATION

Inventor： Takanori Sekido ,  Masato Mikami

IPC: H01L23/48 ,  H01L21/56 ,  H01L23/24 ,  H01L23/31 ,  H01L23/498 ,  H01L25/065 ,  H01L23/544 ,  H01L23/00

CPC classification number: H01L23/48 ,  H01L21/56 ,  H01L23/24 ,  H01L23/3107 ,  H01L23/3135 ,  H01L23/3157 ,  H01L23/3185 ,  H01L23/4985 ,  H01L23/544 ,  H01L24/16 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/0657 ,  H01L2224/0401 ,  H01L2224/05099 ,  H01L2224/05599 ,  H01L2224/1134 ,  H01L2224/131 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/16238 ,  H01L2224/26145 ,  H01L2224/2929 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/8113 ,  H01L2224/81132 ,  H01L2224/81139 ,  H01L2224/81191 ,  H01L2224/81815 ,  H01L2224/8313 ,  H01L2224/83132 ,  H01L2224/83191 ,  H01L2224/83862 ,  H01L2224/83874 ,  H01L2224/92125 ,  H01L2224/92225 ,  H01L2225/06517 ,  H01L2225/06562 ,  H01L2225/06572 ,  H01L2225/06582 ,  H01L2225/06593 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/014

Abstract: A semiconductor-device mounting structure includes a first semiconductor device and a plate-shaped second semiconductor device connected to the first semiconductor device. The first semiconductor device includes a flexible board, an electronic component, and a sealing resin. The flexible board includes a bendable flexible portion and a hard portion. The flexible portion is bent at a boundary with the hard portion, along a shape of the electronic component such that the flexible board covers the electronic component. The flexible board and the electronic component are sealed with the sealing resin. The first semiconductor device is provided vertical to the second semiconductor device such that the hard portion is provided parallel to the second semiconductor device.

Abstract translation: 半导体器件安装结构包括第一半导体器件和连接到第一半导体器件的板状第二半导体器件。 第一半导体器件包括柔性板，电子部件和密封树脂。 柔性板包括可弯曲的柔性部分和硬的部分。 柔性部分沿着电子部件的形状与硬部分的边界弯曲，使得柔性板覆盖电子部件。 柔性板和电子部件用密封树脂密封。 第一半导体器件垂直于第二半导体器件设置，使得硬部分平行于第二半导体器件设置。

公开(公告)号：US09472483B2

公开(公告)日：2016-10-18

申请号：US14802341

申请日：2015-07-17

Applicant: International Business Machines Corporation

Inventor： Jeffrey P. Gambino ,  Richard S. Graf ,  Sudeep Mandal ,  Sebastian T. Ventrone

IPC: H01L23/34 ,  H01L23/367 ,  H01L23/48 ,  H01L23/373 ,  H01L21/768 ,  H01L21/48 ,  H01L25/00 ,  H01L25/065 ,  H01L21/56

CPC classification number: H01L23/367 ,  H01L21/4871 ,  H01L21/563 ,  H01L21/76898 ,  H01L23/3171 ,  H01L23/3677 ,  H01L23/3736 ,  H01L23/481 ,  H01L24/03 ,  H01L24/05 ,  H01L24/06 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L24/94 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/0345 ,  H01L2224/03452 ,  H01L2224/03462 ,  H01L2224/0347 ,  H01L2224/036 ,  H01L2224/0401 ,  H01L2224/05082 ,  H01L2224/05166 ,  H01L2224/05184 ,  H01L2224/05187 ,  H01L2224/0556 ,  H01L2224/05569 ,  H01L2224/0557 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/06181 ,  H01L2224/11849 ,  H01L2224/131 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13116 ,  H01L2224/13118 ,  H01L2224/1312 ,  H01L2224/13139 ,  H01L2224/13147 ,  H01L2224/16145 ,  H01L2224/16227 ,  H01L2224/17181 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/8101 ,  H01L2224/81011 ,  H01L2224/81024 ,  H01L2224/8113 ,  H01L2224/81132 ,  H01L2224/81191 ,  H01L2224/81204 ,  H01L2224/81815 ,  H01L2224/83104 ,  H01L2224/8313 ,  H01L2224/83132 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83204 ,  H01L2224/92 ,  H01L2224/9211 ,  H01L2224/92125 ,  H01L2224/922 ,  H01L2224/92225 ,  H01L2224/94 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06544 ,  H01L2225/06565 ,  H01L2225/06589 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/1432 ,  H01L2924/1434 ,  H01L2924/15311 ,  H01L2924/3512 ,  H01L2924/014 ,  H01L2224/11 ,  H01L2224/03 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/0665 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2224/81203 ,  H01L2224/83203 ,  H01L2924/00012 ,  H01L2924/04941

Abstract: A chip fabricated from a semiconductor material is disclosed, which may include active devices located below a first depth from the chip back side, and a structure to remove heat from the active devices to the chip back side. The structure may include thermally conductive partial vias (TCPVs), which may include a recess with a depth, from the chip back side towards the active devices less than the first depth. Each TCPV may include a barrier layer deposited within the recess and deposited upon the back side of the chip. Each TCPV may also include a thermally conductive layer deposited upon the barrier layer. The structure may also include through-silicon vias (TSVs) electrically connected to active devices, extending from the back side to an active device side of the chip to conductively remove heat from the active devices to the back side of the chip.

Abstract translation: 公开了一种由半导体材料制造的芯片，其可以包括位于从芯片背面的第一深度以下的有源器件，以及将热量从有源器件移除到芯片背面的结构。 该结构可以包括导热部分通孔（TCPV），其可以包括从芯片背侧朝向有源器件的深度的凹陷小于第一深度。 每个TCPV可以包括沉积在凹槽内并沉积在芯片背面的阻挡层。 每个TCPV还可以包括沉积在阻挡层上的导热层。 该结构还可以包括电连接到有源器件的穿硅通孔（TSV），其从芯片的背面延伸到有源器件侧，以将热量从有源器件导电移除到芯片的背面。

公开(公告)号：US09354388B2

公开(公告)日：2016-05-31

申请号：US14446525

申请日：2014-07-30

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Michael Renne Ty Tan ,  Georgios Panotopoulos ,  Paul Kessler Rosenberg ,  Sagi Varhgese Mathai ,  Wayne Victor Sorin ,  Susant K. Patra

IPC: H01L29/40 ,  G02B6/12 ,  G02B6/122 ,  H01L23/00 ,  H01L25/00 ,  H01L25/065 ,  B29D11/00

CPC classification number: G02B6/12004 ,  B29D11/00307 ,  B29D11/0073 ,  G02B6/122 ,  H01L24/16 ,  H01L24/32 ,  H01L24/81 ,  H01L24/83 ,  H01L24/96 ,  H01L24/97 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/81815 ,  H01L2224/8313 ,  H01L2224/83132 ,  H01L2224/83141 ,  H01L2224/8385 ,  H01L2224/83898 ,  H01L2224/96 ,  H01L2224/97 ,  H01L2225/06593 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A composite wafer includes a molded wafer and a second wafer. The molded wafer includes a plurality of first components, and the second wafer includes a plurality of second components. The second wafer is combined with the molded wafer to form the composite wafer. At least one of the first components is aligned with at least one of the second components to form a multi-component element. The multi-component element is singulatable from the composite wafer.

Abstract translation: 复合晶片包括模制晶片和第二晶片。 模制的晶片包括多个第一部件，并且第二晶片包括多个第二部件。 将第二晶片与模制晶片组合以形成复合晶片。 第一组分中的至少一个与至少一个第二组分对准以形成多组分元素。 多组分元素可从复合晶片中分离出来。

公开(公告)号：US20150364384A1

公开(公告)日：2015-12-17

申请号：US14836049

申请日：2015-08-26

Applicant: A.B. Mikroelektronik Gesellschaft mit beschraenkter Haftung

Inventor： Andreas KARCH

IPC: H01L21/66 ,  H01L23/00 ,  H01L25/00

CPC classification number: H01L22/12 ,  H01L22/22 ,  H01L24/83 ,  H01L25/50 ,  H01L2224/8313 ,  H01L2224/8321 ,  H01L2224/83359 ,  H05K1/0269 ,  H05K3/303 ,  H05K3/321 ,  H05K3/341 ,  H05K13/046 ,  H05K13/0812 ,  H05K13/0815 ,  H05K2201/10106 ,  H05K2203/166 ,  Y02P70/613

Abstract: The invention concerns a process for the production of a circuit carrier (1) equipped with at least one surface-mount LED (SMD-LED), wherein the at least one SMD-LED (2) is positioned in oriented relationship to one or more reference points (3) of the circuit carrier (1) on the circuit carrier (1), wherein the position of a light-emitting region (4) of the at least one SMD-LED (2) is optically detected in the SMD-LED (2) and the at least one SMD-LED (2) is mounted to the circuit carrier (1) in dependence on the detected position of the light-emitting region (4) of the at least one SMD-LED (2), and such a circuit carrier (1).

Abstract translation: 本发明涉及一种用于生产装备有至少一个表面贴装LED（SMD-LED）的电路载体（1）的方法，其中至少一个SMD-LED（2）定位成与一个或多个 在电路载体（1）上的电路载体（1）的参考点（3），其中至少一个SMD-LED（2）的发光区域（4）的位置在SMD- 根据检测到的至少一个SMD-LED（2）的发光区域（4）的位置，将LED（2）和至少一个SMD-LED（2）安装到电路载体（1） ，以及这种电路载体（1）。

公开(公告)号：US08900885B1

公开(公告)日：2014-12-02

申请号：US13903198

申请日：2013-05-28

Applicant: International Business Machines Corporation

Inventor： Alex R. Hubbard ,  Douglas C. La Tulipe, Jr. ,  Spyridon Skordas ,  Kevin R. Winstel

IPC: H01L21/00 ,  H01L21/66 ,  H01L21/30 ,  H01L23/00

CPC classification number: H01L22/12 ,  H01L23/544 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/80 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L24/94 ,  H01L25/0657 ,  H01L2223/54426 ,  H01L2224/0401 ,  H01L2224/08145 ,  H01L2224/131 ,  H01L2224/16145 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/8013 ,  H01L2224/80896 ,  H01L2224/80908 ,  H01L2224/8113 ,  H01L2224/81908 ,  H01L2224/8313 ,  H01L2224/83908 ,  H01L2224/9202 ,  H01L2224/94 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/3511 ,  H01L2224/80 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/014

Abstract: A method for wafer bonding includes measuring grid distortion for a mated pairing of wafers to be bonded to determine if misalignment exists between the wafers. During processing of subsequent wafers, magnification of one or more lithographic patterns is adjusted to account for the misalignment. The subsequent wafers are bonded with reduced misalignment.

Abstract translation: 用于晶片接合的方法包括测量待接合的晶片的配对配对的栅格畸变，以确定晶片之间是否存在偏差。 在后续晶片的处理期间，调整一个或多个光刻图案的放大率以解决未对准。 随后的晶片以缩小的未对准结合。

公开(公告)号：US08841783B2

公开(公告)日：2014-09-23

申请号：US13312565

申请日：2011-12-06

Applicant: Satoru Wakiyama

Inventor： Satoru Wakiyama

IPC: H01L23/544 ,  H01L23/00 ,  H01L21/56 ,  H01L25/00 ,  H01L25/065

CPC classification number: H01L25/0657 ,  H01L21/561 ,  H01L21/563 ,  H01L23/3142 ,  H01L23/544 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L25/50 ,  H01L2223/54426 ,  H01L2224/0345 ,  H01L2224/03462 ,  H01L2224/03912 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/051 ,  H01L2224/05568 ,  H01L2224/056 ,  H01L2224/10135 ,  H01L2224/10165 ,  H01L2224/11015 ,  H01L2224/11462 ,  H01L2224/11849 ,  H01L2224/13014 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/13166 ,  H01L2224/14131 ,  H01L2224/14515 ,  H01L2224/16145 ,  H01L2224/16148 ,  H01L2224/16238 ,  H01L2224/26135 ,  H01L2224/26145 ,  H01L2224/26165 ,  H01L2224/27334 ,  H01L2224/27416 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/451 ,  H01L2224/48 ,  H01L2224/73104 ,  H01L2224/8113 ,  H01L2224/81132 ,  H01L2224/81139 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/81203 ,  H01L2224/814 ,  H01L2224/81815 ,  H01L2224/81903 ,  H01L2224/83007 ,  H01L2224/8313 ,  H01L2224/83132 ,  H01L2224/83141 ,  H01L2224/83191 ,  H01L2224/83203 ,  H01L2224/8385 ,  H01L2224/83862 ,  H01L2224/92 ,  H01L2225/06513 ,  H01L2225/06568 ,  H01L2225/06593 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/01047 ,  H01L2924/00012 ,  H01L2224/05552 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A semiconductor device includes a semiconductor element; a pad electrode that is formed on the semiconductor element; an alignment mark that is formed on the semiconductor element; a connection electrode that is formed on the pad electrode; and an underfill resin that is formed to cover the connection electrode. The height of the alignment mark from the semiconductor element is greater than that of the connection electrode.

Abstract translation: 半导体器件包括半导体元件; 形成在半导体元件上的焊盘电极; 形成在半导体元件上的对准标记; 形成在焊盘电极上的连接电极; 和形成为覆盖连接电极的底部填充树脂。 来自半导体元件的对准标记的高度大于连接电极的高度。

公开(公告)号：US20140065759A1

公开(公告)日：2014-03-06

申请号：US14067453

申请日：2013-10-30

Applicant: Soitec

Inventor： Marcel BROEKAART

IPC: H01L21/762 ,  H01L27/146

CPC classification number: H01L21/76251 ,  H01L21/2003 ,  H01L21/67092 ,  H01L23/544 ,  H01L24/83 ,  H01L24/94 ,  H01L25/50 ,  H01L27/14 ,  H01L27/14601 ,  H01L27/14687 ,  H01L2223/54426 ,  H01L2223/54453 ,  H01L2223/54493 ,  H01L2224/8313 ,  H01L2224/83894 ,  H01L2224/94 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2224/83

Abstract: A method for bonding first and second wafers by molecular adhesion. The method includes placing the wafers in an environment having a first pressure (P1) greater than a predetermined threshold pressure above which initiation of bonding wave propagation is prevented, bringing the first wafer and the second wafer into alignment and contact, and spontaneously initiating the propagation of a bonding wave between the wafers after they are in contact solely by reducing the pressure within the environment to a second pressure (P2) below the threshold pressure.

Abstract translation: 一种通过分子粘附将第一和第二晶片接合的方法。 该方法包括将晶片放置在具有大于预定阈值压力的第一压力（P1）的环境中，在该环境下，防止接合波传播的起始，使第一晶片和第二晶片对准和接触，并且自发地启动传播 只有通过将环境中的压力降低到低于阈值压力的第二压力（P2），晶片之间的结合波在它们接触之后。

公开(公告)号：US20140021624A1

公开(公告)日：2014-01-23

申请号：US13932333

申请日：2013-07-01

Applicant: OLYMPUS CORPORATION

Inventor： Takanori SEKIDO ,  Masato MIKAMI

IPC: H01L23/48 ,  H01L21/56

CPC classification number: H01L23/48 ,  H01L21/56 ,  H01L23/24 ,  H01L23/3107 ,  H01L23/3135 ,  H01L23/3157 ,  H01L23/3185 ,  H01L23/4985 ,  H01L23/544 ,  H01L24/16 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/0657 ,  H01L2224/0401 ,  H01L2224/05099 ,  H01L2224/05599 ,  H01L2224/1134 ,  H01L2224/131 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/16238 ,  H01L2224/26145 ,  H01L2224/2929 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/8113 ,  H01L2224/81132 ,  H01L2224/81139 ,  H01L2224/81191 ,  H01L2224/81815 ,  H01L2224/8313 ,  H01L2224/83132 ,  H01L2224/83191 ,  H01L2224/83862 ,  H01L2224/83874 ,  H01L2224/92125 ,  H01L2224/92225 ,  H01L2225/06517 ,  H01L2225/06562 ,  H01L2225/06572 ,  H01L2225/06582 ,  H01L2225/06593 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/014

Abstract: A semiconductor-device mounting structure includes a first semiconductor device and a plate-shaped second semiconductor device connected to the first semiconductor device. The first semiconductor device includes a flexible board, an electronic component, and a sealing resin. The flexible board includes a bendable flexible portion and a hard portion. The flexible portion is bent at a boundary with the hard portion, along a shape of the electronic component such that the flexible board covers the electronic component. The flexible board and the electronic component are sealed with the sealing resin. The first semiconductor device is provided vertical to the second semiconductor device such that the hard portion is provided parallel to the second semiconductor device.

Abstract translation: 半导体器件安装结构包括第一半导体器件和连接到第一半导体器件的板状第二半导体器件。 第一半导体器件包括柔性板，电子部件和密封树脂。 柔性板包括可弯曲的柔性部分和硬的部分。 柔性部分沿着电子部件的形状与硬部分的边界弯曲，使得柔性板覆盖电子部件。 柔性板和电子部件用密封树脂密封。 第一半导体器件垂直于第二半导体器件设置，使得硬部分平行于第二半导体器件设置。

公开(公告)号：US20130286614A1

公开(公告)日：2013-10-31

申请号：US13459924

申请日：2012-04-30

Applicant: Michael Renne Ty Tan ,  Georgios Panotopoulos ,  Paul Kessler Rosenberg ,  Sagi Varghese Mathai ,  Wayne Victor Sorin ,  Susant K. Patra

Inventor： Michael Renne Ty Tan ,  Georgios Panotopoulos ,  Paul Kessler Rosenberg ,  Sagi Varghese Mathai ,  Wayne Victor Sorin ,  Susant K. Patra

IPC: H05K7/06 ,  H01L21/78

CPC classification number: G02B6/12004 ,  B29D11/00307 ,  B29D11/0073 ,  G02B6/122 ,  H01L24/16 ,  H01L24/32 ,  H01L24/81 ,  H01L24/83 ,  H01L24/96 ,  H01L24/97 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/81815 ,  H01L2224/8313 ,  H01L2224/83132 ,  H01L2224/83141 ,  H01L2224/8385 ,  H01L2224/83898 ,  H01L2224/96 ,  H01L2224/97 ,  H01L2225/06593 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A composite wafer includes a molded wafer and a second wafer. The molded wafer includes a plurality of first components, and the second wafer includes a plurality of second components. The second wafer is combined with the molded wafer to form the composite wafer. At least one of the first components is aligned with at least one of the second components to form a multi-component element. The multi-component element is singulatable from the composite wafer.

Abstract translation: 复合晶片包括模制晶片和第二晶片。 模制的晶片包括多个第一部件，并且第二晶片包括多个第二部件。 将第二晶片与模制晶片组合以形成复合晶片。 第一组分中的至少一个与至少一个第二组分对准以形成多组分元素。 多组分元素可从复合晶片中分离出来。