Abstract:
Integrated optical structures include a first wafer layer, a first insulator layer directly connected to the top of the first wafer layer, a second wafer layer directly connected to the top of the first insulator layer, a second insulator layer directly connected to the top of the second wafer layer, and a third wafer layer directly connected to the top of the second insulator layer. Such structures include: a first optical waveguide positioned within the second wafer layer; an optical coupler positioned within the second wafer layer, the second insulator layer, and the third wafer layer; and a second optical waveguide positioned within the third wafer layer. The optical coupler transmits an optical beam from the first optical waveguide to the second optical waveguide through the second insulator layer.
Abstract:
Various embodiments include solutions for analyzing three-dimensional video data. Various embodiments include a system having: at least one sensor for detecting at least one of object occlusion or drift in visual data; and a digital signal processor coupled with the at least one sensor, the digital signal processor having at least one database (DB) including target template sets for analyzing both object occlusion in visual data and drift in visual data, wherein the digital signal processor is configured to switch between one of the target template sets and a distinct target template set in the at least one DB based upon detection of the at least one of object occlusion or drift in the visual data.
Abstract:
A structure and method of using the structure. The structure including an integrated circuit chip having a set of micro-channels; an electro-rheological coolant fluid filling the micro-channels; first and second parallel channel electrodes on opposite sides of at least one micro-channel, the first channel electrode connected to an output of an auto-compensating temperature control circuit, the second channel electrode connected to ground; the auto-compensating temperature control circuit comprising a temperature stable current source connected between a positive voltage rail and the output and having a temperature sensitive circuit connected between ground and the output, a leakage current of the temperature stable current source being essentially insensitive to temperature and a leakage current of the temperature sensitive circuit increasing with temperature.
Abstract:
A structure and method of using the structure. The structure including an integrated circuit chip having a set of micro-channels; an electro-rheological coolant fluid filling the micro-channels; first and second parallel channel electrodes on opposite sides of at least one micro-channel, the first channel electrode connected to an output of an auto-compensating temperature control circuit, the second channel electrode connected to ground; the auto-compensating temperature control circuit comprising a temperature stable current source connected between a positive voltage rail and the output and having a temperature sensitive circuit connected between ground and the output, a leakage current of the temperature stable current source being essentially insensitive to temperature and a leakage current of the temperature sensitive circuit increasing with temperature.
Abstract:
In one embodiment, the invention is a method and apparatus for secure and reliable computing. One embodiment of an end-to-end security system for protecting a computing system includes a processor interface coupled to at least one of an application processor and an accelerator of the computing system, for receiving requests from the at least one of the application processor and the accelerator, a security processor integrating at least one embedded storage unit and connected to the processor interface with a tightly coupled memory unit for performing at least one of: authenticating, managing, monitoring, and processing the requests, and a data interface for communicating with a display, a network, and at least one embedded storage unit for securely holding at least one of data and programs used by the at least one of the application processor and the accelerator.
Abstract:
An integrated circuit includes logic regions and dynamically adjustable voltage controllers. A voltage controller connected to each logic region enables voltage adjustment while the chip is operating. Each voltage controller has a selector device connected to voltage input lines providing different voltages. A voltage sensor connected to the output of the selector device provides a supply voltage to one of the logic regions. A control circuit dynamically monitors the supply voltage, captures and stores a digital representation of the supply voltage during each cycle of a clock, and tracks variations over time, based on operation of the logic regions. When variations in the supply voltage exceed an operational threshold of one of the logic regions, the control circuit submits a request to a central controller. When the central controller grants permission, the control circuit dynamically adjusts the voltage by enabling the selector device to choose a different voltage input line.
Abstract:
An integrated circuit includes logic regions and dynamically adjustable voltage controllers. A voltage controller connected to each logic region enables voltage adjustment while the chip is operating. Each voltage controller has a selector device connected to voltage input lines providing different voltages. A voltage sensor connected to the output of the selector device provides a supply voltage to one of the logic regions. A control circuit dynamically monitors the supply voltage, captures and stores a digital representation of the supply voltage during each cycle of a clock, and tracks variations over time, based on operation of the logic regions. When variations in the supply voltage exceed an operational threshold of one of the logic regions, the control circuit submits a request to a central controller. When the central controller grants permission, the control circuit dynamically adjusts the voltage by enabling the selector device to choose a different voltage input line.
Abstract:
Various embodiments include solutions for analyzing three-dimensional video data. Various embodiments include a system having: at least one sensor for detecting at least one of object occlusion or drift in visual data; and a digital signal processor coupled with the at least one sensor, the digital signal processor having at least one database (DB) including target template sets for analyzing both object occlusion in visual data and drift in visual data, wherein the digital signal processor is configured to switch between one of the target template sets and a distinct target template set in the at least one DB based upon detection of the at least one of object occlusion or drift in the visual data.
Abstract:
Various particular embodiments include a primary waveguide including an end section; cantilevered waveguides, each cantilevered waveguide including an end section disposed adjacent the end section of the primary waveguide; and control pins for applying an electrical bias to the cantilevered waveguides to selectively displace the end sections of the cantilevered waveguides away from the end section of the primary waveguide.
Abstract:
A chip fabricated from a semiconductor material is disclosed, which may include active devices located below a first depth from the chip back side, and a structure to remove heat from the active devices to the chip back side. The structure may include thermally conductive partial vias (TCPVs), which may include a recess with a depth, from the chip back side towards the active devices less than the first depth. Each TCPV may include a barrier layer deposited within the recess and deposited upon the back side of the chip. Each TCPV may also include a thermally conductive layer deposited upon the barrier layer. The structure may also include through-silicon vias (TSVs) electrically connected to active devices, extending from the back side to an active device side of the chip to conductively remove heat from the active devices to the back side of the chip.