公开(公告)号：US20170250090A1

公开(公告)日：2017-08-31

申请号：US15594756

申请日：2017-05-15

申请人： Taiwan Semiconductor Manufacturing Company, Ltd.

发明人： Chen-Hua Yu ,  Der-Chyang Yeh

IPC分类号： H01L21/3105 ,  H01L21/683 ,  H01L23/31 ,  H01L25/00 ,  H01L23/498 ,  H01L23/00 ,  H01L25/065 ,  H01L25/18 ,  H01L21/56 ,  H01L23/48

CPC分类号： H01L21/31053 ,  H01L21/565 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3128 ,  H01L23/481 ,  H01L23/49838 ,  H01L24/05 ,  H01L24/13 ,  H01L24/14 ,  H01L24/17 ,  H01L24/19 ,  H01L24/81 ,  H01L24/92 ,  H01L25/0657 ,  H01L25/18 ,  H01L25/50 ,  H01L2221/68381 ,  H01L2224/02379 ,  H01L2224/0345 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/05008 ,  H01L2224/05569 ,  H01L2224/05572 ,  H01L2224/0572 ,  H01L2224/12105 ,  H01L2224/13022 ,  H01L2224/131 ,  H01L2224/16146 ,  H01L2224/16235 ,  H01L2224/1703 ,  H01L2224/17181 ,  H01L2224/73204 ,  H01L2224/73259 ,  H01L2224/81005 ,  H01L2224/81815 ,  H01L2224/9202 ,  H01L2224/92224 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2225/06562 ,  H01L2225/06568 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/00014 ,  H01L2224/11 ,  H01L2924/00 ,  H01L2924/014

摘要： A device includes a redistribution layer over a molding compound layer, a first chip over the fan-out structure, wherein the first chip comprise a plurality of first through vias connected to the redistribution layer and a second chip over the first chip, the second chip being connected to the first chip through a plurality of bumps, wherein the first chip and the second chip are in the molding compound layer, and wherein a center line of the first chip is not vertically aligned with a center line of the second chip.

公开(公告)号：US20170194292A1

公开(公告)日：2017-07-06

申请号：US15058818

申请日：2016-03-02

申请人： Taiwan Semiconductor Manufacturing Company, Ltd.

发明人： Chen-Hua Yu ,  An-Jhih Su ,  Wei-Yu Chen ,  Ying-Ju Chen ,  Tsung-Shu Lin ,  Chin-Chuan Chang ,  Hsien-Wei Chen ,  Wei-Cheng Wu ,  Der-Chyang Yeh ,  Li-Hsien Huang ,  Chi-Hsi Wu

IPC分类号： H01L25/065 ,  H01L21/78 ,  H01L23/498 ,  H01L21/56 ,  H01L23/31 ,  H01L25/00 ,  H01L21/48

CPC分类号： H01L25/0657 ,  H01L21/4853 ,  H01L21/486 ,  H01L21/56 ,  H01L21/78 ,  H01L23/3114 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/49838 ,  H01L25/0652 ,  H01L25/50 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/18 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2224/97 ,  H01L2225/06527 ,  H01L2225/06548 ,  H01L2225/06555 ,  H01L2924/3511

摘要： A method includes attaching a first-level device die to a dummy die, encapsulating the first-level device die in a first encapsulating material, forming through-vias over and electrically coupled to the first-level device die, attaching a second-level device die over the first-level device die, and encapsulating the through-vias and the second-level device die in a second encapsulating material. Redistribution lines are formed over and electrically coupled to the through-vias and the second-level device die. The dummy die, the first-level device die, the first encapsulating material, the second-level device die, and the second encapsulating material form parts of a composite wafer.

公开(公告)号：US20170194226A1

公开(公告)日：2017-07-06

申请号：US15058699

申请日：2016-03-02

申请人： Taiwan Semiconductor Manufacturing Company, Ltd.

发明人： Ying-Ju Chen ,  An-Jhih Su ,  Hsien-Wei Chen ,  Der-Chyang Yeh ,  Chi-Hsi Wu ,  Chen-Hua Yu

IPC分类号： H01L23/31 ,  H01L23/00 ,  H01L23/522 ,  H01L21/56

CPC分类号： H01L23/3128 ,  H01L21/4846 ,  H01L21/563 ,  H01L23/49816 ,  H01L23/5226 ,  H01L23/5383 ,  H01L23/5389 ,  H01L24/11 ,  H01L24/14 ,  H01L24/19 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/26145 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2924/01029 ,  H01L2924/01078 ,  H01L2924/14 ,  H01L2924/19104

摘要： A semiconductor device and method of reducing the risk of underbump metallization poisoning from the application of underfill material is provided. In an embodiment a spacer is located between a first underbump metallization and a second underbump metallization. When an underfill material is dispensed between the first underbump metallization and the second underbump metallization, the spacer prevents the underfill material from creeping towards the second underbump metallization. In another embodiment a passivation layer is used to inhibit the flow of underfill material as the underfill material is being dispensed.

公开(公告)号：US09653433B2

公开(公告)日：2017-05-16

申请号：US15085837

申请日：2016-03-30

申请人： Taiwan Semiconductor Manufacturing Company, Ltd.

发明人： Chen-Hua Yu ,  Der-Chyang Yeh

IPC分类号： H01L25/065 ,  H01L25/00 ,  H01L23/00 ,  H01L23/31 ,  H01L21/56 ,  H01L25/18 ,  H01L21/3105 ,  H01L21/683 ,  H01L23/48 ,  H01L23/498

CPC分类号： H01L21/31053 ,  H01L21/565 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3128 ,  H01L23/481 ,  H01L23/49838 ,  H01L24/05 ,  H01L24/13 ,  H01L24/14 ,  H01L24/17 ,  H01L24/19 ,  H01L24/81 ,  H01L24/92 ,  H01L25/0657 ,  H01L25/18 ,  H01L25/50 ,  H01L2221/68381 ,  H01L2224/02379 ,  H01L2224/0345 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/05008 ,  H01L2224/05569 ,  H01L2224/05572 ,  H01L2224/0572 ,  H01L2224/12105 ,  H01L2224/13022 ,  H01L2224/131 ,  H01L2224/16146 ,  H01L2224/16235 ,  H01L2224/1703 ,  H01L2224/17181 ,  H01L2224/73204 ,  H01L2224/73259 ,  H01L2224/81005 ,  H01L2224/81815 ,  H01L2224/9202 ,  H01L2224/92224 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2225/06562 ,  H01L2225/06568 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/00014 ,  H01L2224/11 ,  H01L2924/00 ,  H01L2924/014

摘要： A device comprises a first chip and a second chip stacked together to form a multi-chip structure, wherein the multi-chip structure is embedded in an encapsulation layer, and wherein at least one edge of the first chip and the second chip is exposed outside the encapsulation layer, a redistribution layer on a surface of a first side of the encapsulation layer and a plurality of conductive bumps over the redistribution layer and connected to the redistribution layer.

公开(公告)号：US20170133322A1

公开(公告)日：2017-05-11

申请号：US15415523

申请日：2017-01-25

申请人： Taiwan Semiconductor Manufacturing Company, Ltd.

发明人： Chen-Hua Yu ,  Shin-Puu Jeng ,  Der-Chyang Yeh ,  Hsien-Wei Chen

IPC分类号： H01L23/538 ,  H01L25/10 ,  H01L23/31

摘要： A package includes a corner, a device die, a plurality of redistribution lines underlying the device die, and a plurality of non-solder electrical connectors underlying and electrically coupled to the plurality of redistribution lines. The plurality of non-solder electrical connectors includes a corner electrical connector. The corner electrical connector is elongated. An electrical connector is farther away from the corner than the corner electrical connector, wherein the electrical connector is non-elongated.

公开(公告)号：US09461025B2

公开(公告)日：2016-10-04

申请号：US14472681

申请日：2014-08-29

申请人： Taiwan Semiconductor Manufacturing Company, Ltd.

发明人： Chen-Hua Yu ,  Shin-Puu Jeng ,  Der-Chyang Yeh ,  Hsien-Wei Chen ,  Jie Chen

IPC分类号： H05K9/00 ,  H01L25/10 ,  H01L23/538 ,  H01L23/552 ,  H01L21/683 ,  H01L23/498 ,  H01L21/56 ,  H01L23/00

CPC分类号： H01L23/552 ,  H01L21/32051 ,  H01L21/568 ,  H01L21/6835 ,  H01L21/7684 ,  H01L21/76885 ,  H01L23/49816 ,  H01L23/5383 ,  H01L23/5384 ,  H01L23/5389 ,  H01L23/585 ,  H01L24/16 ,  H01L24/19 ,  H01L24/20 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L24/92 ,  H01L25/105 ,  H01L2221/68359 ,  H01L2221/68363 ,  H01L2221/68372 ,  H01L2224/12105 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48227 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/73267 ,  H01L2224/81005 ,  H01L2224/92244 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1431 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/3025 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A package includes a device die, a molding material molding the device die therein, and a through-via penetrating through the molding material. A redistribution line is on a side of the molding material. The redistribution line is electrically coupled to the through-via. A metal ring is close to edges of the package, wherein the metal ring is coplanar with the redistribution line.

摘要翻译： 包装包括装置模具，模制其中的装置模具的模制材料和穿过模制材料的穿通孔。 再分配线位于成型材料的一侧。 再分布线电连接到通孔。 金属环靠近封装的边缘，其中金属环与再分布线共面。

公开(公告)号：US09461020B2

公开(公告)日：2016-10-04

申请号：US14949006

申请日：2015-11-23

申请人： Taiwan Semiconductor Manufacturing Company, Ltd.

发明人： Der-Chyang Yeh ,  Hsien-Wei Chen ,  Ming-Yen Chiu ,  Ying-Ju Chen

IPC分类号： H01L21/56 ,  H01L23/538 ,  H01L23/00 ,  H01L23/13 ,  H01L23/31 ,  H01L25/00 ,  H01L25/065 ,  H01L23/12 ,  H01L25/10 ,  H01L23/498 ,  H01L23/50

CPC分类号： H01L25/0657 ,  H01L21/565 ,  H01L23/12 ,  H01L23/13 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/49811 ,  H01L23/50 ,  H01L23/538 ,  H01L23/5384 ,  H01L23/5386 ,  H01L23/5389 ,  H01L23/562 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/19 ,  H01L24/27 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L24/97 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/1132 ,  H01L2224/11334 ,  H01L2224/1145 ,  H01L2224/11462 ,  H01L2224/11849 ,  H01L2224/12105 ,  H01L2224/13082 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13116 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13164 ,  H01L2224/16225 ,  H01L2224/1703 ,  H01L2224/17181 ,  H01L2224/2518 ,  H01L2224/27015 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32258 ,  H01L2224/32502 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73259 ,  H01L2224/73265 ,  H01L2224/81815 ,  H01L2224/92125 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06568 ,  H01L2225/06572 ,  H01L2225/06586 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/1205 ,  H01L2924/1206 ,  H01L2924/1207 ,  H01L2924/1431 ,  H01L2924/1432 ,  H01L2924/1434 ,  H01L2924/15153 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19104 ,  H01L2924/351 ,  H01L2924/00012 ,  H01L2224/82 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

摘要： Embodiments of the present disclosure include semiconductor packages and methods of forming the same. An embodiment is a semiconductor package including a first package including one or more dies, and a package substrate bonded to a first side of the first package with by a first set of connectors. The semiconductor package further includes a surface mount device mounted to the first side of the first package, the surface mount device consisting essentially of one or more passive devices.

公开(公告)号：US09460987B2

公开(公告)日：2016-10-04

申请号：US14720154

申请日：2015-05-22

申请人： Taiwan Semiconductor Manufacturing Company, Ltd.

发明人： Jui-Pin Hung ,  Jing-Cheng Lin ,  Po-Hao Tsai ,  Yi-Jou Lin ,  Shuo-Mao Chen ,  Chiung-Han Yeh ,  Der-Chyang Yeh

IPC分类号： H01L23/48 ,  H01L23/00 ,  H01L23/528 ,  H01L23/538 ,  H01L23/28 ,  H01L23/498 ,  H01L25/10 ,  H01L21/768 ,  H01L21/82 ,  H01L25/18 ,  H01L25/00 ,  H01L25/065 ,  H01L21/56

CPC分类号： H01L23/481 ,  H01L21/4853 ,  H01L21/486 ,  H01L21/56 ,  H01L21/561 ,  H01L21/563 ,  H01L21/565 ,  H01L21/568 ,  H01L21/76843 ,  H01L21/82 ,  H01L23/28 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49838 ,  H01L23/528 ,  H01L23/5384 ,  H01L23/5386 ,  H01L23/5389 ,  H01L24/11 ,  H01L24/19 ,  H01L24/73 ,  H01L24/81 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/18 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/73267 ,  H01L2224/83 ,  H01L2224/92244 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/0652 ,  H01L2225/06541 ,  H01L2225/06548 ,  H01L2225/06568 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/18162 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/82

摘要： An interconnect structure and a method of forming an interconnect structure are provided. The interconnect structure is formed over a carrier substrate, upon which a die may also be attached. Upon removal of the carrier substrate and singulation, a first package is formed. A second package may be attached to the first package, wherein the second package may be electrically coupled to through vias formed in the first package.

摘要翻译： 提供互连结构和形成互连结构的方法。 互连结构形成在载体基板上，模具也可以附着在载体基板上。 在移除载体衬底和单片化时，形成第一封装。 第二封装可以附接到第一封装，其中第二封装可以电连接到形成在第一封装中的通孔。

公开(公告)号：US20160163566A1

公开(公告)日：2016-06-09

申请号：US14743451

申请日：2015-06-18

申请人： TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

发明人： Hsien-Wei Chen ,  Chen-Hua Yu ,  Chi-Hsi Wu ,  Der-Chyang Yeh ,  An-Jhih Su ,  Wei-Yu Chen

IPC分类号： H01L21/48 ,  H01L23/31 ,  H01L21/56 ,  H01L23/498

CPC分类号： H01L21/4846 ,  H01L21/486 ,  H01L21/565 ,  H01L21/568 ,  H01L23/3128 ,  H01L23/3185 ,  H01L23/498 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/20 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/19 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/73267 ,  H01L2224/83005 ,  H01L2224/92244 ,  H01L2225/0651 ,  H01L2225/06568 ,  H01L2225/1035 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18162

摘要： A semiconductor device and method for forming the semiconductor device is provided. The semiconductor device includes an integrated circuit having through vias adjacent to the integrated circuit die, wherein a molding compound is interposed between the integrated circuit die and the through vias. The through vias have a projection extending through a patterned layer, and the through vias may be offset from a surface of the patterned layer. The recess may be formed by selectively removing a seed layer used to form the through vias.

摘要翻译： 提供一种用于形成半导体器件的半导体器件和方法。 半导体器件包括具有与集成电路管芯相邻的通孔的集成电路，其中，在集成电路管芯和通孔之间插入有模塑料。 通孔具有延伸穿过图案化层的突起，并且通孔可以从图案化层的表面偏移。 可以通过选择性地去除用于形成通孔的种子层来形成凹部。

公开(公告)号：US20150287700A1

公开(公告)日：2015-10-08

申请号：US14244111

申请日：2014-04-03

申请人： Taiwan Semiconductor Manufacturing Company, Ltd.

发明人： Chen-Hua Yu ,  Shin-Puu Jeng ,  Der-Chyang Yeh ,  Hsien-Wei Chen ,  Jie Chen

IPC分类号： H01L25/065 ,  H01L23/48 ,  H01L23/00

CPC分类号： H01L25/0657 ,  H01L23/3128 ,  H01L23/481 ,  H01L23/50 ,  H01L23/5386 ,  H01L23/5389 ,  H01L23/562 ,  H01L24/09 ,  H01L24/17 ,  H01L24/19 ,  H01L24/20 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/105 ,  H01L2224/02372 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/04105 ,  H01L2224/0912 ,  H01L2224/12105 ,  H01L2224/16145 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/73267 ,  H01L2224/81385 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06548 ,  H01L2225/1035 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/1431 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A package includes a corner, a device die, a plurality of redistribution lines underlying the device die, and a plurality of metal pads electrically coupled to the plurality of redistribution lines. The plurality of metal pads includes a corner metal pad closest to the corner, wherein the corner metal pad is a center-facing pad having a bird-beak direction substantially pointing to a center of the package. The plurality of metal pads further includes a metal pad farther away from the corner than the corner metal pad, wherein the metal pad is a non-center-facing pad having a bird-beak direction pointing away from the center of the package.

摘要翻译： 封装包括角部，器件裸片，器件裸片下方的多个再分配线以及电耦合到多个再分配线的多个金属焊盘。 多个金属垫包括最靠近拐角的角金属垫，其中角金属垫是具有基本上指向包装中心的鸟嘴方向的中心面垫。 多个金属垫还包括远离拐角金属垫的金属垫，其中金属垫是具有远离包装中心的鸟嘴方向的非中心的垫。