公开(公告)号：US11791296B2

公开(公告)日：2023-10-17

申请号：US17544888

申请日：2021-12-07

申请人： TEXAS INSTRUMENTS INCORPORATED

发明人： Scott Robert Summerfelt ,  Benjamin Stassen Cook ,  Ralf Jakobskrueger Muenster ,  Sreenivasan Kalyani Koduri

IPC分类号： H01L23/00

CPC分类号： H01L24/13 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/13005 ,  H01L2224/13023 ,  H01L2224/13026 ,  H01L2224/13078 ,  H01L2224/279 ,  H01L2224/29078 ,  H01L2224/3207 ,  H01L2224/83895 ,  H01L2224/83896

摘要： In some examples, an electronic device comprises a first component having a surface, a second component having a surface, and a bond layer positioned between the surfaces of the first and second components to couple the first and second components to each other. The bond layer includes a set of metallic nanowires and a dielectric portion. The dielectric portion comprises a polymer matrix and dielectric nanoparticles.

公开(公告)号：US11735546B2

公开(公告)日：2023-08-22

申请号：US17569900

申请日：2022-01-06

申请人： VueReal Inc.

发明人： Gholamreza Chaji ,  Ehsanollah Fathi

IPC分类号： H01L21/687 ,  H01L23/00 ,  H01L25/00 ,  G01R31/26 ,  H01L21/683 ,  H01L21/66 ,  H05K13/04

CPC分类号： H01L24/08 ,  H01L21/68714 ,  H01L24/29 ,  H01L24/83 ,  H01L24/95 ,  H01L24/97 ,  G01R31/2635 ,  H01L21/6831 ,  H01L21/6835 ,  H01L22/14 ,  H01L22/20 ,  H01L24/27 ,  H01L24/32 ,  H01L24/75 ,  H01L25/50 ,  H01L2221/68322 ,  H01L2221/68368 ,  H01L2221/68381 ,  H01L2224/08238 ,  H01L2224/27002 ,  H01L2224/2732 ,  H01L2224/27334 ,  H01L2224/29006 ,  H01L2224/29011 ,  H01L2224/29019 ,  H01L2224/2919 ,  H01L2224/29026 ,  H01L2224/29078 ,  H01L2224/32237 ,  H01L2224/7598 ,  H01L2224/75252 ,  H01L2224/75253 ,  H01L2224/83005 ,  H01L2224/8314 ,  H01L2224/8316 ,  H01L2224/8318 ,  H01L2224/83121 ,  H01L2224/83141 ,  H01L2224/83143 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83234 ,  H01L2224/83238 ,  H01L2224/83862 ,  H01L2224/83902 ,  H01L2224/95 ,  H01L2224/95001 ,  H01L2224/97 ,  H05K13/0411

摘要： A method of selectively transferring micro devices from a donor substrate to contact pads on a receiver substrate. Micro devices being attached to a donor substrate with a donor force. The donor substrate and receiver substrate are aligned and brought together so that selected micro devices meet corresponding contact pads. A receiver force is generated to hold selected micro devices to the contact pads on the receiver substrate. The donor force is weakened and the substrates are moved apart leaving selected micro devices on the receiver substrate. Several methods of generating the receiver force are disclosed, including adhesive, mechanical and electrostatic techniques.

公开(公告)号：US09941188B2

公开(公告)日：2018-04-10

申请号：US15414061

申请日：2017-01-24

申请人： STMicroelectronics (Crolles 2) SAS ,  SOCPRA Sciences et Génie S.E.C.

发明人： Louis-Michel Collin ,  Luc Guy Frechette ,  Sandrine Lhostis

IPC分类号： H01L21/44 ,  H01L23/42 ,  H01L23/498 ,  H01L23/367 ,  H01L21/48 ,  H01L23/00 ,  H01L21/56

CPC分类号： H01L23/42 ,  H01L21/31116 ,  H01L21/481 ,  H01L21/4825 ,  H01L21/4853 ,  H01L21/4875 ,  H01L21/4878 ,  H01L21/52 ,  H01L21/54 ,  H01L21/56 ,  H01L21/563 ,  H01L23/3121 ,  H01L23/315 ,  H01L23/3157 ,  H01L23/3672 ,  H01L23/473 ,  H01L23/492 ,  H01L23/4952 ,  H01L23/49568 ,  H01L23/49811 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/17 ,  H01L24/27 ,  H01L24/29 ,  H01L24/30 ,  H01L24/33 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/04026 ,  H01L2224/05647 ,  H01L2224/11462 ,  H01L2224/13012 ,  H01L2224/13013 ,  H01L2224/13015 ,  H01L2224/13024 ,  H01L2224/13078 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/136 ,  H01L2224/14051 ,  H01L2224/14151 ,  H01L2224/14152 ,  H01L2224/14154 ,  H01L2224/14177 ,  H01L2224/14517 ,  H01L2224/16058 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16245 ,  H01L2224/17051 ,  H01L2224/17181 ,  H01L2224/27462 ,  H01L2224/29012 ,  H01L2224/29013 ,  H01L2224/29015 ,  H01L2224/29078 ,  H01L2224/29147 ,  H01L2224/30151 ,  H01L2224/30152 ,  H01L2224/32058 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/73103 ,  H01L2224/73203 ,  H01L2224/73253 ,  H01L2224/81193 ,  H01L2224/81203 ,  H01L2224/81447 ,  H01L2224/81801 ,  H01L2224/83193 ,  H01L2224/83203 ,  H01L2224/83447 ,  H01L2224/83801 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06524 ,  H01L2225/06586 ,  H01L2225/06589 ,  H01L2924/1815 ,  H01L2924/351 ,  H01L2924/37002 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/00012 ,  H01L2224/1415

摘要： An assembly includes an integrated circuit chip and a plate with at least one heat removal channel arranged between the chip and the plate. Metal sidewalls are formed to extend from one surface of the chip to an opposite surface of the plate. The assembly is encapsulated in a body that includes an opening extending to reach the channel. The plate may be one of an interposer, an integrated circuit chip, a support of surface-mount type, or a metal plate.

公开(公告)号：US20170215280A1

公开(公告)日：2017-07-27

申请号：US15442293

申请日：2017-02-24

申请人： VueReal Inc.

发明人： Gholamreza Chaji

IPC分类号： H05K1/11 ,  H05K13/04 ,  H05K13/00

CPC分类号： H05K1/111 ,  G01R31/2635 ,  H01L21/6835 ,  H01L22/14 ,  H01L22/20 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/75 ,  H01L24/83 ,  H01L24/95 ,  H01L24/97 ,  H01L25/00 ,  H01L25/50 ,  H01L2221/68322 ,  H01L2221/68368 ,  H01L2221/68381 ,  H01L2224/27002 ,  H01L2224/2732 ,  H01L2224/27334 ,  H01L2224/29006 ,  H01L2224/29011 ,  H01L2224/29019 ,  H01L2224/29026 ,  H01L2224/29078 ,  H01L2224/2919 ,  H01L2224/32237 ,  H01L2224/75252 ,  H01L2224/75253 ,  H01L2224/7598 ,  H01L2224/83005 ,  H01L2224/83121 ,  H01L2224/8314 ,  H01L2224/83141 ,  H01L2224/83143 ,  H01L2224/8316 ,  H01L2224/8318 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83234 ,  H01L2224/83238 ,  H01L2224/83862 ,  H01L2224/83902 ,  H01L2224/95 ,  H01L2224/95001 ,  H01L2224/97 ,  H05K13/0015 ,  H05K13/0069 ,  H05K13/04 ,  H01L2924/00012 ,  H01L2224/83 ,  H01L2224/27 ,  H01L2924/00014 ,  H01L2924/07802 ,  H01L2924/0781

摘要： What is disclosed is a method of selectively transferring micro devices from a donor substrate to contact pads on a receiver substrate. Micro devices being attached to a donor substrate with a donor force. The donor substrate and receiver substrate are aligned and brought together so that selected micro devices meet corresponding contact pads. A receiver force is generated to hold selected micro devices to the contact pads on the receiver substrate. The donor force is weakened and the substrates are moved apart leaving selected micro devices on the receiver substrate. Several methods of generating the receiver force are disclosed, including adhesive, mechanical and electrostatic techniques.

公开(公告)号：US20170213746A1

公开(公告)日：2017-07-27

申请号：US15482346

申请日：2017-04-07

申请人： Semiconductor Manufacturing International (Shanghai) Corporation

发明人： Yuankun HOU ,  Kuanchieh YU ,  Yu HUA ,  Yuelin ZHAO

IPC分类号： H01L21/56 ,  H01L21/308 ,  H01L23/10 ,  H01L21/306 ,  H01L25/00 ,  H01L25/065

CPC分类号： H01L21/56 ,  H01L21/30604 ,  H01L21/308 ,  H01L22/12 ,  H01L23/10 ,  H01L24/03 ,  H01L24/05 ,  H01L24/06 ,  H01L24/08 ,  H01L24/27 ,  H01L24/29 ,  H01L24/30 ,  H01L24/32 ,  H01L24/80 ,  H01L24/83 ,  H01L24/92 ,  H01L24/94 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/04026 ,  H01L2224/05571 ,  H01L2224/0612 ,  H01L2224/08145 ,  H01L2224/08148 ,  H01L2224/2761 ,  H01L2224/29011 ,  H01L2224/29012 ,  H01L2224/29013 ,  H01L2224/29014 ,  H01L2224/29078 ,  H01L2224/30145 ,  H01L2224/32145 ,  H01L2224/32148 ,  H01L2224/80011 ,  H01L2224/80203 ,  H01L2224/80805 ,  H01L2224/8081 ,  H01L2224/80895 ,  H01L2224/83011 ,  H01L2224/83193 ,  H01L2224/83203 ,  H01L2224/83805 ,  H01L2224/8381 ,  H01L2224/9211 ,  H01L2224/94 ,  H01L2924/00015 ,  H01L2924/0002 ,  H01L2924/163 ,  H01L2924/00 ,  H01L2224/48 ,  H01L2224/2919 ,  H01L2224/83 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2224/80

摘要： A method of forming a sealing structure for a bonded wafer is provided. The method includes providing the lower wafer and the upper wafer, forming a sealing material layer on each of the lower wafer and the upper wafer, forming a mask layer on the sealing material layer on each of the lower wafer and the upper wafer, etching the sealing material layer using the mask layer as an etch mask, so as to form a first protrusion at an edge of the lower wafer and a second protrusion at an edge of the upper wafer, and bonding the first protrusion and the second protrusion together to form the sealing structure. The sealing structure encloses a gap between the lower wafer and the upper wafer at an edge of the bonded wafer, so as to form a hermetically sealed cavity at the edge of the bonded wafer.

公开(公告)号：US20170146302A1

公开(公告)日：2017-05-25

申请号：US15422602

申请日：2017-02-02

申请人： Northrop Grumman Systems Corporation ,  The Board of Trustees of the Leland Stanford Junior University

发明人： John A. Starkovich ,  Edward M. Silverman ,  Jesse B. Tice ,  Hsiao-Hu Peng ,  Michael T. Barako ,  Kenneth E. Goodson

IPC分类号： F28F3/02 ,  B23P15/26 ,  B23K1/00

CPC分类号： F28F3/022 ,  B23K1/0012 ,  B23K20/023 ,  B23K2101/14 ,  B23P15/26 ,  B82Y30/00 ,  C25D3/30 ,  C25D3/48 ,  C25D5/02 ,  C25D5/48 ,  C25D7/0607 ,  C25D9/02 ,  F28F2255/20 ,  H01L23/373 ,  H01L23/3736 ,  H01L23/3737 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/27462 ,  H01L2224/27466 ,  H01L2224/29078 ,  H01L2224/29211 ,  H01L2224/29244 ,  H01L2224/83203 ,  H01L2224/83232 ,  H01L2224/83238

摘要： A thermally-conductive and mechanically-robust bonding method for attaching a metal nanowire (MNW) array to an adjacent surface includes the steps of: removing a template membrane from the MNW; infiltrating the MNW with a bonding material: placing the bonding material on the adjacent surface; bringing an adjacent surface into contact with a top surface of the MNW while the bonding material is bondable; and allowing the bonding material to cool and form a solid bond between the MNW and the adjacent surface. A thermally-conductive and mechanically-robust bonding method for attaching a metal nanowire (MNW) array to an adjacent surface includes the steps of: choosing a bonding material based on a desired bonding process; and without removing the MNW from a template membrane that fills an interstitial volume of the MNW, depositing the bonding material onto a tip of the MNW.

公开(公告)号：US09406636B2

公开(公告)日：2016-08-02

申请号：US14715484

申请日：2015-05-18

申请人： Broadcom Corporation

发明人： Sam Ziqun Zhao ,  Rezaur Rahman Khan

IPC分类号： H01L23/02 ,  H01L23/00 ,  H01L23/31 ,  H01L21/48 ,  H01L23/498 ,  H01L25/10

CPC分类号： H01L24/17 ,  H01L21/4853 ,  H01L23/3157 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49833 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/30 ,  H01L24/32 ,  H01L24/33 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L25/105 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/16113 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/29007 ,  H01L2224/29012 ,  H01L2224/29014 ,  H01L2224/29015 ,  H01L2224/29035 ,  H01L2224/29036 ,  H01L2224/29078 ,  H01L2224/2919 ,  H01L2224/3012 ,  H01L2224/30131 ,  H01L2224/30141 ,  H01L2224/30179 ,  H01L2224/32225 ,  H01L2224/33181 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/81815 ,  H01L2224/831 ,  H01L2224/83101 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/92125 ,  H01L2224/9221 ,  H01L2224/92242 ,  H01L2225/1058 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2924/181 ,  H01L2924/3511 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/00014 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/00012 ,  H01L2924/00

摘要： An integrated circuit (IC) package includes an IC die having a first surface and a second surface opposite of the first surface. The IC package includes first contact members coupled to the second surface of the IC die. The IC package includes a bottom substrate having a first surface and a second surface opposite of the first surface, where the first surface of the bottom substrate is coupled to the second surface of the IC die via the first contact members. The IC package includes an interposer substrate coupled to the first surface of the IC die via an adhesive material, where the adhesive material is disposed on at least a surface of the interposer substrate. The IC package includes second contact members coupled along a periphery of the interposer substrate, where the interposer substrate is coupled to the first surface of the bottom substrate via the second contact members.

公开(公告)号：US20160163670A1

公开(公告)日：2016-06-09

申请号：US15040861

申请日：2016-02-10

申请人： Taiwan Semiconductor Manufacturing Company, Ltd.

发明人： Kuei-Sung Chang ,  Nien-Tsung Tsai ,  Ting-Hau Wu ,  Yi Heng Tsai

IPC分类号： H01L23/00

CPC分类号： H01L24/29 ,  H01L24/05 ,  H01L24/32 ,  H01L24/83 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/05082 ,  H01L2224/26145 ,  H01L2224/2745 ,  H01L2224/29011 ,  H01L2224/29012 ,  H01L2224/29013 ,  H01L2224/29036 ,  H01L2224/29078 ,  H01L2224/291 ,  H01L2224/29124 ,  H01L2224/29144 ,  H01L2224/29147 ,  H01L2224/29193 ,  H01L2224/32506 ,  H01L2224/83097 ,  H01L2224/83193 ,  H01L2224/83194 ,  H01L2224/83203 ,  H01L2224/83805 ,  H01L2225/06513 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/00014 ,  H01L2924/01032 ,  H01L2924/00012

摘要： A system and method for bonding semiconductor devices is provided. An embodiment comprises halting the flow of a eutectic bonding material by providing additional material of one of the reactants in a grid pattern, such that, as the eutectic material flows into the additional material, the additional material will change the composition of the flowing eutectic material and solidify the material, thereby stopping the flow. Other embodiments provide for additional layouts to put the additional material into the path of the flowing eutectic material.

公开(公告)号：US20160086830A1

公开(公告)日：2016-03-24

申请号：US14489651

申请日：2014-09-18

申请人： Kwok Yuen CHEUNG ,  Kwok Wah TONG ,  Jin Hui MENG ,  Wan Yin YAU ,  Man Kit CHOW

发明人： Kwok Yuen CHEUNG ,  Kwok Wah TONG ,  Jin Hui MENG ,  Wan Yin YAU ,  Man Kit CHOW

IPC分类号： H01L21/67 ,  H01L21/687

CPC分类号： H01L24/75 ,  H01L22/12 ,  H01L24/29 ,  H01L24/32 ,  H01L24/743 ,  H01L24/83 ,  H01L2224/29078 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/75251 ,  H01L2224/75301 ,  H01L2224/7531 ,  H01L2224/75611 ,  H01L2224/75702 ,  H01L2224/75745 ,  H01L2224/831 ,  H01L2224/83191 ,  H01L2224/83193 ,  H01L2224/83862 ,  H01L2924/00012 ,  H01L2924/00014

摘要： Disclosed is a die bonding tool comprising: a rigid body; and a collet having a die-holding portion; wherein the collet is mechanically coupled to the rigid body by a flexible element which is configured to angularly deflect relative to the rigid body on application of a torque to the collet and/or to a die held by the collet. Also disclosed is a die bonding system comprising the die bonding tool, and an adhesive dispenser for a die bonding system.

摘要翻译： 公开了一种芯片焊接工具，其包括：刚体; 以及具有模具保持部的夹头; 其中所述夹头通过柔性元件机械地联接到所述刚体，所述柔性元件构造成在将力矩施加到所述夹头和/或由所述夹头保持的模具上时相对于所述刚性体成角度地偏转。 还公开了一种管芯接合系统，其包括管芯接合工具和用于管芯接合系统的粘合剂分配器。

公开(公告)号：US20150327388A1

公开(公告)日：2015-11-12

申请号：US14715191

申请日：2015-05-18

申请人： Semprius, Inc.

发明人： Etienne Menard ,  Christopher Bower ,  Matthew Meitl ,  Philip Garrou

IPC分类号： H05K7/06 ,  H05K3/00 ,  H05K3/10

CPC分类号： H01L27/1266 ,  H01L21/6835 ,  H01L21/76898 ,  H01L23/481 ,  H01L24/02 ,  H01L24/05 ,  H01L24/08 ,  H01L24/24 ,  H01L24/27 ,  H01L24/29 ,  H01L24/30 ,  H01L24/32 ,  H01L24/73 ,  H01L24/82 ,  H01L24/83 ,  H01L24/92 ,  H01L27/1214 ,  H01L27/14618 ,  H01L31/0203 ,  H01L2221/6835 ,  H01L2221/68372 ,  H01L2221/68381 ,  H01L2224/02371 ,  H01L2224/02372 ,  H01L2224/0239 ,  H01L2224/04026 ,  H01L2224/05548 ,  H01L2224/056 ,  H01L2224/08238 ,  H01L2224/24011 ,  H01L2224/24137 ,  H01L2224/24147 ,  H01L2224/24226 ,  H01L2224/245 ,  H01L2224/24998 ,  H01L2224/2731 ,  H01L2224/29078 ,  H01L2224/291 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29344 ,  H01L2224/3012 ,  H01L2224/32104 ,  H01L2224/32146 ,  H01L2224/32227 ,  H01L2224/73267 ,  H01L2224/76155 ,  H01L2224/80203 ,  H01L2224/80224 ,  H01L2224/81192 ,  H01L2224/82007 ,  H01L2224/821 ,  H01L2224/82102 ,  H01L2224/82106 ,  H01L2224/83093 ,  H01L2224/83121 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83805 ,  H01L2224/83815 ,  H01L2224/8384 ,  H01L2224/83851 ,  H01L2224/83855 ,  H01L2224/83859 ,  H01L2224/83862 ,  H01L2224/83868 ,  H01L2224/83871 ,  H01L2224/83874 ,  H01L2224/92143 ,  H01L2224/92244 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15787 ,  H01S5/02236 ,  H01S5/02276 ,  H05K1/18 ,  H05K3/0058 ,  H05K3/10 ,  Y10T29/4913 ,  Y10T29/49139 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/13111

摘要： An active component array includes a target substrate having one or more contacts formed on a side of the target substrate, and one or more printable active components distributed over the target substrate. Each active component includes an active layer having a top side and an opposing bottom side and one or more active element(s) formed on or in the top side of the active layer. The active element(s) are electrically connected to the contact(s), and the bottom side is adhered to the target substrate. Related fabrication methods are also discussed.

摘要翻译： 有源元件阵列包括具有形成在目标基板一侧上的一个或多个触点的目标基板和分布在目标基板上的一个或多个可印刷的有源元件。 每个有源部件包括有源层，其具有形成在有源层的顶侧上或其中的上侧和相对的底侧以及一个或多个有源元件。 有源元件电连接到触点，并且底侧粘附到目标基板。 还讨论了相关的制造方法。