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公开(公告)号：CN102812548B
公开(公告)日：2015-11-25
申请号：CN201080065118.2
申请日：2010-10-15
申请人： 吉林克斯公司
IPC分类号： H01L21/98 , H01L25/065 , H01L23/538 , H01L23/00 , H01L21/68 , H01L23/31 , H01L21/56
CPC分类号： H01L21/82 , H01L21/561 , H01L21/568 , H01L21/6835 , H01L23/3114 , H01L23/5389 , H01L24/13 , H01L24/19 , H01L24/20 , H01L24/24 , H01L24/80 , H01L24/82 , H01L24/83 , H01L24/96 , H01L25/0655 , H01L25/16 , H01L25/50 , H01L2221/6834 , H01L2221/68359 , H01L2224/0401 , H01L2224/04105 , H01L2224/08137 , H01L2224/12105 , H01L2224/24101 , H01L2224/24137 , H01L2224/24226 , H01L2224/2902 , H01L2224/29187 , H01L2224/30181 , H01L2224/30183 , H01L2224/32137 , H01L2224/73267 , H01L2224/80006 , H01L2224/80896 , H01L2224/83005 , H01L2224/83896 , H01L2224/92244 , H01L2224/96 , H01L2224/97 , H01L2924/01027 , H01L2924/01033 , H01L2924/014 , H01L2924/10253 , H01L2924/10271 , H01L2924/14 , H01L2924/141 , H01L2924/1431 , H01L2924/1433 , H01L2924/14335 , H01L2924/1434 , H01L2924/1437 , H01L2924/1438 , H01L2924/1443 , H01L2924/145 , H01L2924/15311 , H01L2924/181 , H01L2224/11 , H01L2224/19 , H01L2224/82 , H01L2924/00 , H01L2224/83
摘要： 一种复合集成电路(IC，100)在重建晶圆底座上结合具有第一晶上互连结构(114)的第一IC晶粒(芯片，102)与具有第二晶上互连结构(115)的第二IC晶粒(104)。第二IC晶粒是以氧化物对氧化物边缘接合(110)而被边缘接合到第一IC晶粒。芯片对芯片互连结构(118)电气耦合第一IC晶粒与第二IC晶粒。制造所述种复合集成电路的方法亦被描述于此。
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公开(公告)号：CN104103680A
公开(公告)日：2014-10-15
申请号：CN201410143506.8
申请日：2014-04-10
申请人： 英飞凌科技奥地利有限公司
IPC分类号： H01L29/417 , H01L21/28
CPC分类号： H01L23/34 , H01L23/3107 , H01L23/4951 , H01L23/49548 , H01L23/49562 , H01L23/49575 , H01L24/05 , H01L24/06 , H01L24/29 , H01L24/30 , H01L24/32 , H01L24/33 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2224/02371 , H01L2224/02381 , H01L2224/04026 , H01L2224/04042 , H01L2224/05139 , H01L2224/05144 , H01L2224/05147 , H01L2224/05155 , H01L2224/05166 , H01L2224/05548 , H01L2224/06188 , H01L2224/29008 , H01L2224/2902 , H01L2224/29023 , H01L2224/291 , H01L2224/3015 , H01L2224/30183 , H01L2224/32225 , H01L2224/32245 , H01L2224/48245 , H01L2224/48247 , H01L2224/48257 , H01L2224/4903 , H01L2224/73265 , H01L2224/8314 , H01L2224/83191 , H01L2224/83385 , H01L2924/00014 , H01L2924/1305 , H01L2924/13055 , H01L2924/13062 , H01L2924/13091 , H01L2924/15156 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2924/014 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： 各个实施例提供了一种芯片和芯片装置。芯片可以包括具有两个主表面和多个侧表面的本体；在本体的至少一个主表面和至少一个侧表面之上延伸的第一功率电极；以及在本体的至少一个主表面和至少一个侧表面之上延伸的第二功率电极。
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公开(公告)号：CN104103680B
公开(公告)日：2017-04-12
申请号：CN201410143506.8
申请日：2014-04-10
申请人： 英飞凌科技奥地利有限公司
IPC分类号： H01L29/417 , H01L21/28
CPC分类号： H01L23/34 , H01L23/3107 , H01L23/4951 , H01L23/49548 , H01L23/49562 , H01L23/49575 , H01L24/05 , H01L24/06 , H01L24/29 , H01L24/30 , H01L24/32 , H01L24/33 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2224/02371 , H01L2224/02381 , H01L2224/04026 , H01L2224/04042 , H01L2224/05139 , H01L2224/05144 , H01L2224/05147 , H01L2224/05155 , H01L2224/05166 , H01L2224/05548 , H01L2224/06188 , H01L2224/29008 , H01L2224/2902 , H01L2224/29023 , H01L2224/291 , H01L2224/3015 , H01L2224/30183 , H01L2224/32225 , H01L2224/32245 , H01L2224/48245 , H01L2224/48247 , H01L2224/48257 , H01L2224/4903 , H01L2224/73265 , H01L2224/8314 , H01L2224/83191 , H01L2224/83385 , H01L2924/00014 , H01L2924/1305 , H01L2924/13055 , H01L2924/13062 , H01L2924/13091 , H01L2924/15156 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2924/014 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： 各个实施例提供了一种芯片和芯片装置。芯片可以包括具有两个主表面和多个侧表面的本体；在本体的至少一个主表面和至少一个侧表面之上延伸的第一功率电极；以及在本体的至少一个主表面和至少一个侧表面之上延伸的第二功率电极。
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公开(公告)号：CN106098573A
公开(公告)日：2016-11-09
申请号：CN201610283784.2
申请日：2016-04-29
申请人： 三菱电机株式会社
IPC分类号： H01L21/58 , H01L21/603
CPC分类号： H01L24/83 , H01L24/27 , H01L24/29 , H01L24/32 , H01L2224/2711 , H01L2224/27334 , H01L2224/27505 , H01L2224/27848 , H01L2224/29013 , H01L2224/29139 , H01L2224/29147 , H01L2224/29294 , H01L2224/29347 , H01L2224/2957 , H01L2224/2969 , H01L2224/32054 , H01L2224/32225 , H01L2224/32245 , H01L2224/45124 , H01L2224/45147 , H01L2224/48137 , H01L2224/48175 , H01L2224/48472 , H01L2224/73265 , H01L2224/743 , H01L2224/82203 , H01L2224/83192 , H01L2224/83447 , H01L2224/8384 , H01L2224/83986 , H01L2224/92247 , H01L2224/97 , H01L2224/83 , H01L2924/00014 , H01L2924/00012 , H01L2021/603 , H01L2224/2902 , H01L2224/321 , H01L2224/325 , H01L2224/83009 , H01L2224/83053 , H01L2224/8319 , H01L2224/83203 , H01L2924/01029 , H01L2924/01047
摘要： 本发明的目的在于提供一种半导体装置的制造方法，该方法抑制烧结性的接合材料的材料成本的增大，且进行高品质的接合。本发明涉及的半导体装置的制造方法具有下述工序：工序(a)，在基板(绝缘基板(3))之上配置片状的烧结性的接合材料(2a)；工序(b)，在工序(a)之后，在接合材料(2a)之上配置半导体元件(1)；以及工序(c)，一边在基板与半导体元件(1)之间对所述接合材料(2a)施加压力、一边对所述接合材料(2a)进行烧结，接合材料(2a)含有Ag或Cu的微粒，微粒被有机膜包裹。
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公开(公告)号：CN103165558B
公开(公告)日：2016-02-03
申请号：CN201210535771.1
申请日：2012-12-12
申请人： 乾坤科技股份有限公司
IPC分类号： H01L23/488 , H01L23/498 , H01L21/60
CPC分类号： H01L24/32 , H01L23/3121 , H01L23/498 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/81 , H01L24/83 , H01L2224/0401 , H01L2224/04026 , H01L2224/0556 , H01L2224/06181 , H01L2224/13111 , H01L2224/13116 , H01L2224/13139 , H01L2224/13147 , H01L2224/16245 , H01L2224/16505 , H01L2224/16507 , H01L2224/2902 , H01L2224/29034 , H01L2224/29111 , H01L2224/29116 , H01L2224/29118 , H01L2224/29139 , H01L2224/30181 , H01L2224/32225 , H01L2224/32505 , H01L2224/32507 , H01L2224/81815 , H01L2224/8192 , H01L2224/83411 , H01L2224/83416 , H01L2224/83418 , H01L2224/83439 , H01L2224/83815 , H01L2224/8392 , H01L2924/00014 , H01L2924/01322 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13091 , H01L2924/181 , Y10T29/49155 , H01L2924/00012 , H01L2924/01029 , H01L2924/00 , H01L2224/05552
摘要： 本发明揭示了一种封装结构及其制造方法，其具有一覆盖于焊接材料的覆盖金属材料。一基板包含在其上的一第一焊接垫和一第二焊接垫。一在基板上的导电组件包含在其上的第一电极和第二电极。一焊接材料分别电性连接该第一焊接垫和该第二焊接垫至该第一电极和该第二电极。一覆盖金属材料覆盖该焊接材料、该第一焊接垫、该第二焊接垫、该第一电极和该第二电极露出的复数个区域，其中该露出的复数个区域包含熔点比该覆盖金属材料低的金属材料。
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公开(公告)号：CN102812548A
公开(公告)日：2012-12-05
申请号：CN201080065118.2
申请日：2010-10-15
申请人： 吉林克斯公司
IPC分类号： H01L21/98 , H01L25/065 , H01L23/538 , H01L23/00 , H01L21/68 , H01L23/31 , H01L21/56
CPC分类号： H01L21/82 , H01L21/561 , H01L21/568 , H01L21/6835 , H01L23/3114 , H01L23/5389 , H01L24/13 , H01L24/19 , H01L24/20 , H01L24/24 , H01L24/80 , H01L24/82 , H01L24/83 , H01L24/96 , H01L25/0655 , H01L25/16 , H01L25/50 , H01L2221/6834 , H01L2221/68359 , H01L2224/0401 , H01L2224/04105 , H01L2224/08137 , H01L2224/12105 , H01L2224/24101 , H01L2224/24137 , H01L2224/24226 , H01L2224/2902 , H01L2224/29187 , H01L2224/30181 , H01L2224/30183 , H01L2224/32137 , H01L2224/73267 , H01L2224/80006 , H01L2224/80896 , H01L2224/83005 , H01L2224/83896 , H01L2224/92244 , H01L2224/96 , H01L2224/97 , H01L2924/01027 , H01L2924/01033 , H01L2924/014 , H01L2924/10253 , H01L2924/10271 , H01L2924/14 , H01L2924/141 , H01L2924/1431 , H01L2924/1433 , H01L2924/14335 , H01L2924/1434 , H01L2924/1437 , H01L2924/1438 , H01L2924/1443 , H01L2924/145 , H01L2924/15311 , H01L2924/181 , H01L2224/11 , H01L2224/19 , H01L2224/82 , H01L2924/00 , H01L2224/83
摘要： 一种复合集成电路(IC，100)在重建晶圆底座上结合具有第一晶上互连结构(114)的第一IC晶粒(芯片，102)与具有第二晶上互连结构(115)的第二IC晶粒(104)。第二IC晶粒是以氧化物对氧化物边缘接合(110)而被边缘接合到第一IC晶粒。芯片对芯片互连结构(118)电气耦合第一IC晶粒与第二IC晶粒。制造所述种复合集成电路的方法亦被描述于此。
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公开(公告)号：CN102386113A
公开(公告)日：2012-03-21
申请号：CN201110271021.3
申请日：2011-09-02
申请人： 新科金朋有限公司
IPC分类号： H01L21/60 , H01L21/56 , H01L23/498 , H01L23/31 , H01L25/00
CPC分类号： H01L25/50 , H01L21/486 , H01L21/56 , H01L21/561 , H01L21/568 , H01L21/6835 , H01L23/295 , H01L23/3107 , H01L23/3121 , H01L23/3128 , H01L23/3157 , H01L23/49827 , H01L23/49833 , H01L23/5384 , H01L23/5389 , H01L23/544 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/19 , H01L24/20 , H01L24/24 , H01L24/25 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/82 , H01L24/83 , H01L24/97 , H01L25/03 , H01L25/0655 , H01L25/0657 , H01L25/105 , H01L25/16 , H01L2221/68345 , H01L2221/68381 , H01L2221/68386 , H01L2223/54426 , H01L2224/0345 , H01L2224/03452 , H01L2224/03462 , H01L2224/03464 , H01L2224/0401 , H01L2224/04042 , H01L2224/04105 , H01L2224/05611 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/06131 , H01L2224/1132 , H01L2224/11334 , H01L2224/1134 , H01L2224/1145 , H01L2224/11462 , H01L2224/11464 , H01L2224/11849 , H01L2224/11901 , H01L2224/12105 , H01L2224/131 , H01L2224/13111 , H01L2224/13113 , H01L2224/13116 , H01L2224/13124 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/16225 , H01L2224/21 , H01L2224/2105 , H01L2224/215 , H01L2224/22 , H01L2224/221 , H01L2224/24011 , H01L2224/2405 , H01L2224/24101 , H01L2224/24226 , H01L2224/24227 , H01L2224/245 , H01L2224/25171 , H01L2224/27002 , H01L2224/29 , H01L2224/2902 , H01L2224/29101 , H01L2224/29144 , H01L2224/2919 , H01L2224/29298 , H01L2224/32155 , H01L2224/32225 , H01L2224/48091 , H01L2224/48105 , H01L2224/48175 , H01L2224/48227 , H01L2224/48228 , H01L2224/73265 , H01L2224/73267 , H01L2224/82101 , H01L2224/82104 , H01L2224/82106 , H01L2224/83005 , H01L2224/83191 , H01L2224/8385 , H01L2224/94 , H01L2224/95001 , H01L2224/97 , H01L2225/06548 , H01L2225/1035 , H01L2225/1041 , H01L2225/1052 , H01L2225/107 , H01L2924/00013 , H01L2924/00014 , H01L2924/01004 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01073 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/0665 , H01L2924/078 , H01L2924/12041 , H01L2924/12042 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/15153 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H05K1/186 , H05K3/007 , H05K2201/10674 , H01L2224/81 , H01L2924/01014 , H01L2224/82 , H01L2924/00 , H01L2924/00012 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/2929 , H01L2224/03 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： 一种半导体器件具有安装于载体上的第一半导体小片。插入框架具有在插入框架中的开口和形成于插入框架上的多个导电柱。将插入器安装于载体和第一小片上，其中导电柱安置于该小片周围。可在插入框架中形成腔，以包含所述第一小片的一部分。通过在插入框架中的开口在载体和第一小片上沉积密封剂。可替换地，密封剂沉积于载体和第一小片上并将插入框架压靠在密封剂上。过量的密封剂通过在插入框架中的开口引出。移除载体。在密封剂和第一小片上形成互连结构。可在第一小片上或在插入框架上安装第二半导体小片。
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公开(公告)号：CN103367350B
公开(公告)日：2017-04-26
申请号：CN201310114551.6
申请日：2013-04-03
申请人： 英飞凌科技股份有限公司
CPC分类号： H01L23/3121 , H01L21/563 , H01L23/49524 , H01L23/49562 , H01L23/49572 , H01L23/49575 , H01L24/13 , H01L24/29 , H01L24/32 , H01L24/37 , H01L24/40 , H01L24/73 , H01L24/83 , H01L24/92 , H01L25/16 , H01L2224/0401 , H01L2224/04026 , H01L2224/06181 , H01L2224/131 , H01L2224/16 , H01L2224/16245 , H01L2224/27436 , H01L2224/2902 , H01L2224/2919 , H01L2224/2929 , H01L2224/293 , H01L2224/321 , H01L2224/32145 , H01L2224/32245 , H01L2224/37147 , H01L2224/40095 , H01L2224/40245 , H01L2224/73253 , H01L2224/73269 , H01L2224/81191 , H01L2224/83191 , H01L2224/83801 , H01L2224/8485 , H01L2924/014 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/1461 , H01L2924/00012 , H01L2924/00 , H01L2924/00014
摘要： 电子模块包括第一载体和布置在第一载体上的第一半导体芯片。第二半导体芯片布置在第一半导体芯片上方。材料层将第二半导体芯片粘合至第一载体并封装第一半导体芯片。
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公开(公告)号：CN102386113B
公开(公告)日：2016-06-22
申请号：CN201110271021.3
申请日：2011-09-02
申请人： 新科金朋有限公司
IPC分类号： H01L21/60 , H01L21/56 , H01L23/498 , H01L23/31 , H01L25/00
CPC分类号： H01L25/50 , H01L21/486 , H01L21/56 , H01L21/561 , H01L21/568 , H01L21/6835 , H01L23/295 , H01L23/3107 , H01L23/3121 , H01L23/3128 , H01L23/3157 , H01L23/49827 , H01L23/49833 , H01L23/5384 , H01L23/5389 , H01L23/544 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/19 , H01L24/20 , H01L24/24 , H01L24/25 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/82 , H01L24/83 , H01L24/97 , H01L25/03 , H01L25/0655 , H01L25/0657 , H01L25/105 , H01L25/16 , H01L2221/68345 , H01L2221/68381 , H01L2221/68386 , H01L2223/54426 , H01L2224/0345 , H01L2224/03452 , H01L2224/03462 , H01L2224/03464 , H01L2224/0401 , H01L2224/04042 , H01L2224/04105 , H01L2224/05611 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/06131 , H01L2224/1132 , H01L2224/11334 , H01L2224/1134 , H01L2224/1145 , H01L2224/11462 , H01L2224/11464 , H01L2224/11849 , H01L2224/11901 , H01L2224/12105 , H01L2224/131 , H01L2224/13111 , H01L2224/13113 , H01L2224/13116 , H01L2224/13124 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/16225 , H01L2224/21 , H01L2224/2105 , H01L2224/215 , H01L2224/22 , H01L2224/221 , H01L2224/24011 , H01L2224/2405 , H01L2224/24101 , H01L2224/24226 , H01L2224/24227 , H01L2224/245 , H01L2224/25171 , H01L2224/27002 , H01L2224/29 , H01L2224/2902 , H01L2224/29101 , H01L2224/29144 , H01L2224/2919 , H01L2224/29298 , H01L2224/32155 , H01L2224/32225 , H01L2224/48091 , H01L2224/48105 , H01L2224/48175 , H01L2224/48227 , H01L2224/48228 , H01L2224/73265 , H01L2224/73267 , H01L2224/82101 , H01L2224/82104 , H01L2224/82106 , H01L2224/83005 , H01L2224/83191 , H01L2224/8385 , H01L2224/94 , H01L2224/95001 , H01L2224/97 , H01L2225/06548 , H01L2225/1035 , H01L2225/1041 , H01L2225/1052 , H01L2225/107 , H01L2924/00013 , H01L2924/00014 , H01L2924/01004 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01073 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/0665 , H01L2924/078 , H01L2924/12041 , H01L2924/12042 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/15153 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H05K1/186 , H05K3/007 , H05K2201/10674 , H01L2224/81 , H01L2924/01014 , H01L2224/82 , H01L2924/00 , H01L2924/00012 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/2929 , H01L2224/03 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： 一种半导体器件具有安装于载体上的第一半导体小片。插入框架具有在插入框架中的开口和形成于插入框架上的多个导电柱。将插入器安装于载体和第一小片上，其中导电柱安置于该小片周围。可在插入框架中形成腔，以包含所述第一小片的一部分。通过在插入框架中的开口在载体和第一小片上沉积密封剂。可替换地，密封剂沉积于载体和第一小片上并将插入框架压靠在密封剂上。过量的密封剂通过在插入框架中的开口引出。移除载体。在密封剂和第一小片上形成互连结构。可在第一小片上或在插入框架上安装第二半导体小片。
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公开(公告)号：CN103367350A
公开(公告)日：2013-10-23
申请号：CN201310114551.6
申请日：2013-04-03
申请人： 英飞凌科技股份有限公司
CPC分类号： H01L23/3121 , H01L21/563 , H01L23/49524 , H01L23/49562 , H01L23/49572 , H01L23/49575 , H01L24/13 , H01L24/29 , H01L24/32 , H01L24/37 , H01L24/40 , H01L24/73 , H01L24/83 , H01L24/92 , H01L25/16 , H01L2224/0401 , H01L2224/04026 , H01L2224/06181 , H01L2224/131 , H01L2224/16 , H01L2224/16245 , H01L2224/27436 , H01L2224/2902 , H01L2224/2919 , H01L2224/2929 , H01L2224/293 , H01L2224/321 , H01L2224/32145 , H01L2224/32245 , H01L2224/37147 , H01L2224/40095 , H01L2224/40245 , H01L2224/73253 , H01L2224/73269 , H01L2224/81191 , H01L2224/83191 , H01L2224/83801 , H01L2224/8485 , H01L2924/014 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/1461 , H01L2924/00012 , H01L2924/00 , H01L2924/00014
摘要： 电子模块包括第一载体和布置在第一载体上的第一半导体芯片。第二半导体芯片布置在第一半导体芯片上方。材料层将第二半导体芯片粘合至第一载体并封装第一半导体芯片。
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