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公开(公告)号：CN100524707C
公开(公告)日：2009-08-05
申请号：CN200480002887.2
申请日：2004-01-30
申请人： 飞思卡尔半导体公司
IPC分类号： H01L23/31
CPC分类号： H05K3/305 , H01L2224/29012 , H01L2224/29015 , H01L2224/3015 , H01L2224/30155 , H01L2224/32058 , H01L2224/73103 , H01L2224/73203 , H05K3/3436 , H05K7/1053 , H05K2201/0129 , H05K2201/09909 , H05K2201/10734 , H05K2203/0191 , Y02P70/613 , H01L2924/00012
摘要： 自支持底部填充膜(18)粘附性地使表面安装集成电路封装(14)键合到印刷电路板(10)上。印刷电路板在表面上具有导电迹线(12)和露出的导电焊盘(13)。膜粘合剂关键设置在靠近导电焊盘的印刷电路板上，然后把表面安装印刷电路板封装放置在板上，使得封装上的导电焊盘(16)对准板上的导电焊盘。当使封装焊接到板上时，膜粘合剂软化，并且膜最终用作底部填充以增强焊接点的机械完整性。
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公开(公告)号：CN104103680A
公开(公告)日：2014-10-15
申请号：CN201410143506.8
申请日：2014-04-10
申请人： 英飞凌科技奥地利有限公司
IPC分类号： H01L29/417 , H01L21/28
CPC分类号： H01L23/34 , H01L23/3107 , H01L23/4951 , H01L23/49548 , H01L23/49562 , H01L23/49575 , H01L24/05 , H01L24/06 , H01L24/29 , H01L24/30 , H01L24/32 , H01L24/33 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2224/02371 , H01L2224/02381 , H01L2224/04026 , H01L2224/04042 , H01L2224/05139 , H01L2224/05144 , H01L2224/05147 , H01L2224/05155 , H01L2224/05166 , H01L2224/05548 , H01L2224/06188 , H01L2224/29008 , H01L2224/2902 , H01L2224/29023 , H01L2224/291 , H01L2224/3015 , H01L2224/30183 , H01L2224/32225 , H01L2224/32245 , H01L2224/48245 , H01L2224/48247 , H01L2224/48257 , H01L2224/4903 , H01L2224/73265 , H01L2224/8314 , H01L2224/83191 , H01L2224/83385 , H01L2924/00014 , H01L2924/1305 , H01L2924/13055 , H01L2924/13062 , H01L2924/13091 , H01L2924/15156 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2924/014 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： 各个实施例提供了一种芯片和芯片装置。芯片可以包括具有两个主表面和多个侧表面的本体；在本体的至少一个主表面和至少一个侧表面之上延伸的第一功率电极；以及在本体的至少一个主表面和至少一个侧表面之上延伸的第二功率电极。
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公开(公告)号：CN1112729C
公开(公告)日：2003-06-25
申请号：CN93104636.X
申请日：1993-04-22
申请人： 国际商业机器公司
发明人： 迈克尔·J·布雷迪 , 柯蒂斯·E·法雷尔 , 宋·K·坎 , 杰弗里·R·马里诺 , 唐纳德·J·米卡莱森 , 保罗·A·莫斯科维茨 , 尤金·J·奥沙利文 , 特雷塞·R·奥图尔 , 桑普阿西·帕鲁索塔曼 , 谢尔登·C·里利 , 乔治·F·沃克
CPC分类号： H01L23/53271 , C23C18/50 , C25D3/54 , H01L21/288 , H01L21/2885 , H01L21/6835 , H01L21/76838 , H01L23/4951 , H01L23/4985 , H01L23/49872 , H01L24/03 , H01L24/05 , H01L24/13 , H01L24/45 , H01L24/48 , H01L24/85 , H01L24/97 , H01L2224/02126 , H01L2224/0347 , H01L2224/0401 , H01L2224/04042 , H01L2224/04073 , H01L2224/05022 , H01L2224/05027 , H01L2224/0508 , H01L2224/051 , H01L2224/05147 , H01L2224/05166 , H01L2224/05171 , H01L2224/05572 , H01L2224/05609 , H01L2224/05611 , H01L2224/05616 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/10126 , H01L2224/1145 , H01L2224/13022 , H01L2224/13101 , H01L2224/13105 , H01L2224/13109 , H01L2224/13111 , H01L2224/13113 , H01L2224/13116 , H01L2224/13118 , H01L2224/1312 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/2919 , H01L2224/3015 , H01L2224/32245 , H01L2224/45101 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/45155 , H01L2224/48091 , H01L2224/48247 , H01L2224/4826 , H01L2224/48465 , H01L2224/4847 , H01L2224/48609 , H01L2224/48611 , H01L2224/48616 , H01L2224/48624 , H01L2224/48639 , H01L2224/48644 , H01L2224/48647 , H01L2224/48709 , H01L2224/48711 , H01L2224/48716 , H01L2224/48724 , H01L2224/48739 , H01L2224/48744 , H01L2224/48747 , H01L2224/48809 , H01L2224/48811 , H01L2224/48816 , H01L2224/48839 , H01L2224/48844 , H01L2224/48847 , H01L2224/73215 , H01L2224/85001 , H01L2224/85201 , H01L2224/85203 , H01L2224/85205 , H01L2224/85214 , H01L2224/92147 , H01L2924/00014 , H01L2924/0002 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01031 , H01L2924/01032 , H01L2924/01033 , H01L2924/01042 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01058 , H01L2924/0106 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01083 , H01L2924/01327 , H01L2924/014 , H01L2924/05042 , H01L2924/09701 , H01L2924/10253 , H01L2924/10329 , H01L2924/12032 , H01L2924/12033 , H01L2924/12042 , H01L2924/14 , H01L2924/15747 , H01L2924/15787 , H01L2924/181 , H01L2924/30105 , H01L2924/3011 , Y10S428/901 , Y10T428/24917 , H01L2924/01048 , H01L2924/00 , H01L2924/00012 , H01L2224/48824 , H01L2224/05552 , H01L2224/05599
摘要： 在电子器件中将含硅和锗的材料用作导体的表面。焊料可以非熔化地焊接，而且导线可以焊接在这些表面上。在集成电路芯片的封装中，这些材料可以用作引线框架的表面涂层。这些材料可以用移画印花工艺(decal)转印在导体的表面或者用非电的或电解的方法设置在导体的表面上。
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公开(公告)号：CN104103680B
公开(公告)日：2017-04-12
申请号：CN201410143506.8
申请日：2014-04-10
申请人： 英飞凌科技奥地利有限公司
IPC分类号： H01L29/417 , H01L21/28
CPC分类号： H01L23/34 , H01L23/3107 , H01L23/4951 , H01L23/49548 , H01L23/49562 , H01L23/49575 , H01L24/05 , H01L24/06 , H01L24/29 , H01L24/30 , H01L24/32 , H01L24/33 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2224/02371 , H01L2224/02381 , H01L2224/04026 , H01L2224/04042 , H01L2224/05139 , H01L2224/05144 , H01L2224/05147 , H01L2224/05155 , H01L2224/05166 , H01L2224/05548 , H01L2224/06188 , H01L2224/29008 , H01L2224/2902 , H01L2224/29023 , H01L2224/291 , H01L2224/3015 , H01L2224/30183 , H01L2224/32225 , H01L2224/32245 , H01L2224/48245 , H01L2224/48247 , H01L2224/48257 , H01L2224/4903 , H01L2224/73265 , H01L2224/8314 , H01L2224/83191 , H01L2224/83385 , H01L2924/00014 , H01L2924/1305 , H01L2924/13055 , H01L2924/13062 , H01L2924/13091 , H01L2924/15156 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2924/014 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： 各个实施例提供了一种芯片和芯片装置。芯片可以包括具有两个主表面和多个侧表面的本体；在本体的至少一个主表面和至少一个侧表面之上延伸的第一功率电极；以及在本体的至少一个主表面和至少一个侧表面之上延伸的第二功率电极。
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公开(公告)号：CN1742369A
公开(公告)日：2006-03-01
申请号：CN200480002887.2
申请日：2004-01-30
申请人： 飞思卡尔半导体公司
IPC分类号： H01L23/31
CPC分类号： H05K3/305 , H01L2224/29012 , H01L2224/29015 , H01L2224/3015 , H01L2224/30155 , H01L2224/32058 , H01L2224/73103 , H01L2224/73203 , H05K3/3436 , H05K7/1053 , H05K2201/0129 , H05K2201/09909 , H05K2201/10734 , H05K2203/0191 , Y02P70/613 , H01L2924/00012
摘要： 自支持底部填充膜(18)粘附性地使表面安装集成电路封装(14)键合到印刷电路板(10)上。印刷电路板在表面上具有导电迹线(12)和露出的导电焊盘(13)。膜粘合剂关键设置在靠近导电焊盘的印刷电路板上，然后把表面安装印刷电路板封装放置在板上，使得封装上的导电焊盘(16)对准板上的导电焊盘。当使封装焊接到板上时，膜粘合剂软化，并且膜最终用作底部填充以增强焊接点的机械完整性。
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公开(公告)号：CN1082770A
公开(公告)日：1994-02-23
申请号：CN93104636.X
申请日：1993-04-22
申请人： 国际商业机器公司
发明人： 迈克尔·J·布雷迪 , 柯蒂斯·E·法雷尔 , 宋·K·坎 , 杰弗里·R·马里诺 , 唐纳德·J·米卡莱森 , 保罗·A·莫斯科维茨 , 尤金·J·奥沙利文 , 特雷塞·R·奥图尔 , 桑普阿西·帕鲁索塔曼 , 谢尔登·C·里利 , 乔治·F·沃克
CPC分类号： H01L23/53271 , C23C18/50 , C25D3/54 , H01L21/288 , H01L21/2885 , H01L21/6835 , H01L21/76838 , H01L23/4951 , H01L23/4985 , H01L23/49872 , H01L24/03 , H01L24/05 , H01L24/13 , H01L24/45 , H01L24/48 , H01L24/85 , H01L24/97 , H01L2224/02126 , H01L2224/0347 , H01L2224/0401 , H01L2224/04042 , H01L2224/04073 , H01L2224/05022 , H01L2224/05027 , H01L2224/0508 , H01L2224/051 , H01L2224/05147 , H01L2224/05166 , H01L2224/05171 , H01L2224/05572 , H01L2224/05609 , H01L2224/05611 , H01L2224/05616 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/10126 , H01L2224/1145 , H01L2224/13022 , H01L2224/13101 , H01L2224/13105 , H01L2224/13109 , H01L2224/13111 , H01L2224/13113 , H01L2224/13116 , H01L2224/13118 , H01L2224/1312 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/2919 , H01L2224/3015 , H01L2224/32245 , H01L2224/45101 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/45155 , H01L2224/48091 , H01L2224/48247 , H01L2224/4826 , H01L2224/48465 , H01L2224/4847 , H01L2224/48609 , H01L2224/48611 , H01L2224/48616 , H01L2224/48624 , H01L2224/48639 , H01L2224/48644 , H01L2224/48647 , H01L2224/48709 , H01L2224/48711 , H01L2224/48716 , H01L2224/48724 , H01L2224/48739 , H01L2224/48744 , H01L2224/48747 , H01L2224/48809 , H01L2224/48811 , H01L2224/48816 , H01L2224/48839 , H01L2224/48844 , H01L2224/48847 , H01L2224/73215 , H01L2224/85001 , H01L2224/85201 , H01L2224/85203 , H01L2224/85205 , H01L2224/85214 , H01L2224/92147 , H01L2924/00014 , H01L2924/0002 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01031 , H01L2924/01032 , H01L2924/01033 , H01L2924/01042 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01058 , H01L2924/0106 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01083 , H01L2924/01327 , H01L2924/014 , H01L2924/05042 , H01L2924/09701 , H01L2924/10253 , H01L2924/10329 , H01L2924/12032 , H01L2924/12033 , H01L2924/12042 , H01L2924/14 , H01L2924/15747 , H01L2924/15787 , H01L2924/181 , H01L2924/30105 , H01L2924/3011 , Y10S428/901 , Y10T428/24917 , H01L2924/01048 , H01L2924/00 , H01L2924/00012 , H01L2224/48824 , H01L2224/05552 , H01L2224/05599
摘要： 在电子器件中将含硅和锗的材料用作导体的表面。焊料可以非熔化地焊接，而且导线可以焊接在这些表面上。在集成电路芯片的封装中，这些材料可以用作引线框架的表面涂层。这些材料可用移画印花工艺(decal)转印在导体的表面或者用非电的或电解的方法设置在导体的表面上。
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