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公开(公告)号：CN104103680A
公开(公告)日：2014-10-15
申请号：CN201410143506.8
申请日：2014-04-10
申请人： 英飞凌科技奥地利有限公司
IPC分类号： H01L29/417 , H01L21/28
CPC分类号： H01L23/34 , H01L23/3107 , H01L23/4951 , H01L23/49548 , H01L23/49562 , H01L23/49575 , H01L24/05 , H01L24/06 , H01L24/29 , H01L24/30 , H01L24/32 , H01L24/33 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2224/02371 , H01L2224/02381 , H01L2224/04026 , H01L2224/04042 , H01L2224/05139 , H01L2224/05144 , H01L2224/05147 , H01L2224/05155 , H01L2224/05166 , H01L2224/05548 , H01L2224/06188 , H01L2224/29008 , H01L2224/2902 , H01L2224/29023 , H01L2224/291 , H01L2224/3015 , H01L2224/30183 , H01L2224/32225 , H01L2224/32245 , H01L2224/48245 , H01L2224/48247 , H01L2224/48257 , H01L2224/4903 , H01L2224/73265 , H01L2224/8314 , H01L2224/83191 , H01L2224/83385 , H01L2924/00014 , H01L2924/1305 , H01L2924/13055 , H01L2924/13062 , H01L2924/13091 , H01L2924/15156 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2924/014 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： 各个实施例提供了一种芯片和芯片装置。芯片可以包括具有两个主表面和多个侧表面的本体；在本体的至少一个主表面和至少一个侧表面之上延伸的第一功率电极；以及在本体的至少一个主表面和至少一个侧表面之上延伸的第二功率电极。
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公开(公告)号：CN1779959A
公开(公告)日：2006-05-31
申请号：CN200510114180.7
申请日：2005-10-26
申请人： 精工爱普生株式会社
发明人： 田中秀一
IPC分类号： H01L23/485 , H01L21/28
CPC分类号： H01L23/562 , G02F1/13458 , H01L21/563 , H01L24/06 , H01L24/11 , H01L24/13 , H01L24/14 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/90 , H01L24/91 , H01L2224/0231 , H01L2224/02313 , H01L2224/0233 , H01L2224/0236 , H01L2224/02377 , H01L2224/0239 , H01L2224/024 , H01L2224/0401 , H01L2224/114 , H01L2224/116 , H01L2224/11831 , H01L2224/13016 , H01L2224/13099 , H01L2224/131 , H01L2224/1319 , H01L2224/13624 , H01L2224/13644 , H01L2224/13647 , H01L2224/13655 , H01L2224/13664 , H01L2224/13666 , H01L2224/13671 , H01L2224/13684 , H01L2224/16225 , H01L2224/27825 , H01L2224/27831 , H01L2224/29008 , H01L2224/29013 , H01L2224/29017 , H01L2224/29023 , H01L2224/29101 , H01L2224/2919 , H01L2224/29191 , H01L2224/29563 , H01L2224/2957 , H01L2224/29582 , H01L2224/29624 , H01L2224/29644 , H01L2224/29647 , H01L2224/29655 , H01L2224/29664 , H01L2224/29666 , H01L2224/29671 , H01L2224/29684 , H01L2224/29695 , H01L2224/30155 , H01L2224/32225 , H01L2224/73204 , H01L2224/83101 , H01L2224/83191 , H01L2224/83856 , H01L2924/0001 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01022 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01049 , H01L2924/0105 , H01L2924/01066 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/0665 , H01L2924/14 , H01L2924/3511 , H01L2924/00014 , H01L2924/01023 , H01L2924/00 , H01L2924/01028 , H01L2924/01084
摘要： 一种半导体装置，具备：半导体元件，在所述半导体元件上形成的电极焊盘，与所述电极焊盘导电连接的凸块电极；所述凸块电极，具备在所述半导体元件的有源面上形成的树脂突起，和从所述电极焊盘到所述树脂突起的表面配置的导电膜；所述导电膜和所述树脂突起，被非贴紧地配置的半导体装置。
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公开(公告)号：CN104103680B
公开(公告)日：2017-04-12
申请号：CN201410143506.8
申请日：2014-04-10
申请人： 英飞凌科技奥地利有限公司
IPC分类号： H01L29/417 , H01L21/28
CPC分类号： H01L23/34 , H01L23/3107 , H01L23/4951 , H01L23/49548 , H01L23/49562 , H01L23/49575 , H01L24/05 , H01L24/06 , H01L24/29 , H01L24/30 , H01L24/32 , H01L24/33 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2224/02371 , H01L2224/02381 , H01L2224/04026 , H01L2224/04042 , H01L2224/05139 , H01L2224/05144 , H01L2224/05147 , H01L2224/05155 , H01L2224/05166 , H01L2224/05548 , H01L2224/06188 , H01L2224/29008 , H01L2224/2902 , H01L2224/29023 , H01L2224/291 , H01L2224/3015 , H01L2224/30183 , H01L2224/32225 , H01L2224/32245 , H01L2224/48245 , H01L2224/48247 , H01L2224/48257 , H01L2224/4903 , H01L2224/73265 , H01L2224/8314 , H01L2224/83191 , H01L2224/83385 , H01L2924/00014 , H01L2924/1305 , H01L2924/13055 , H01L2924/13062 , H01L2924/13091 , H01L2924/15156 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2924/014 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： 各个实施例提供了一种芯片和芯片装置。芯片可以包括具有两个主表面和多个侧表面的本体；在本体的至少一个主表面和至少一个侧表面之上延伸的第一功率电极；以及在本体的至少一个主表面和至少一个侧表面之上延伸的第二功率电极。
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公开(公告)号：CN100424862C
公开(公告)日：2008-10-08
申请号：CN200510114180.7
申请日：2005-10-26
申请人： 精工爱普生株式会社
发明人： 田中秀一
IPC分类号： H01L23/485 , H01L21/28
CPC分类号： H01L23/562 , G02F1/13458 , H01L21/563 , H01L24/06 , H01L24/11 , H01L24/13 , H01L24/14 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/90 , H01L24/91 , H01L2224/0231 , H01L2224/02313 , H01L2224/0233 , H01L2224/0236 , H01L2224/02377 , H01L2224/0239 , H01L2224/024 , H01L2224/0401 , H01L2224/114 , H01L2224/116 , H01L2224/11831 , H01L2224/13016 , H01L2224/13099 , H01L2224/131 , H01L2224/1319 , H01L2224/13624 , H01L2224/13644 , H01L2224/13647 , H01L2224/13655 , H01L2224/13664 , H01L2224/13666 , H01L2224/13671 , H01L2224/13684 , H01L2224/16225 , H01L2224/27825 , H01L2224/27831 , H01L2224/29008 , H01L2224/29013 , H01L2224/29017 , H01L2224/29023 , H01L2224/29101 , H01L2224/2919 , H01L2224/29191 , H01L2224/29563 , H01L2224/2957 , H01L2224/29582 , H01L2224/29624 , H01L2224/29644 , H01L2224/29647 , H01L2224/29655 , H01L2224/29664 , H01L2224/29666 , H01L2224/29671 , H01L2224/29684 , H01L2224/29695 , H01L2224/30155 , H01L2224/32225 , H01L2224/73204 , H01L2224/83101 , H01L2224/83191 , H01L2224/83856 , H01L2924/0001 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01022 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01049 , H01L2924/0105 , H01L2924/01066 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/0665 , H01L2924/14 , H01L2924/3511 , H01L2924/00014 , H01L2924/01023 , H01L2924/00 , H01L2924/01028 , H01L2924/01084
摘要： 一种半导体装置，具备：半导体元件，在所述半导体元件上形成的电极焊盘，与所述电极焊盘导电连接的凸块电极；所述凸块电极，具备在所述半导体元件的有源面上形成的树脂突起，和从所述电极焊盘到所述树脂突起的表面配置的导电膜；所述导电膜和所述树脂突起，被非贴紧地配置的半导体装置。
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