公开(公告)号：US20150287695A1

公开(公告)日：2015-10-08

申请号：US14438668

申请日：2013-03-20

申请人： COMMISSARIAT A L' ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES ,  STMICROELECTRONICS (CROLLES 2) SAS

发明人： Léa Di Cioccio ,  Sébastien Mermoz ,  Loïc Sanchez

IPC分类号： H01L23/00 ,  H01L23/14 ,  H01L21/311

CPC分类号： H01L24/83 ,  H01L21/311 ,  H01L21/481 ,  H01L23/13 ,  H01L23/147 ,  H01L23/15 ,  H01L24/08 ,  H01L24/80 ,  H01L24/95 ,  H01L25/50 ,  H01L2224/08237 ,  H01L2224/08238 ,  H01L2224/08257 ,  H01L2224/08258 ,  H01L2224/80143 ,  H01L2224/80203 ,  H01L2224/80487 ,  H01L2224/83192 ,  H01L2224/95085 ,  H01L2224/95146 ,  H05K3/303 ,  Y02P70/613 ,  Y10T428/24488 ,  Y10T428/24802 ,  H01L2924/05442

摘要： A method for producing at least one pad assembly (32, 50) on a support (19, 43) for use in a method for self-assembling at least one element (10) on the support (19, 43), comprises fanning, on the support (19, 43), a layer (28, 48) of at least one fluorinated material around the location (30, 44) of the pad assembly (32, 50), the layer (28, 48) having a thickness greater than 10 nm. The layer (28, 48) and the location (30, 44) are exposed to an ultraviolet treatment in the presence of ozone to form the pad assembly (32, 50) at said location (30, 44), wherein a drop of liquid (16) having a static contact angle on the pad assembly (32, 50) less than or equal to 15°, after the exposure to the ultraviolet treatment, has a static contact angle on the layer (28, 48) greater than or equal to 100°.

摘要翻译： 一种用于在用于自组装支撑件（19,43）上的至少一个元件（10）的方法中的用于在支撑件（19,43）上产生至少一个垫组件（32,50）的方法，包括扇形， 在所述支撑件（19,43）上的围绕所述垫组件（32,50）的位置（30,44）的至少一个氟化材料的层（28,48），所述层（28,48）具有厚度 大于10nm。 在臭氧存在下，将层（28,48）和位置（30,44）暴露于紫外线处理，以在所述位置（30,44）处形成衬垫组件（32,50），其中一滴液体 （16）在所述衬垫组件（32,50）上具有小于或等于15°的静态接触角，在所述紫外线处理之后，所述层（28,48）上的静态接触角大于或等于 至100°。

公开(公告)号：US08884314B1

公开(公告)日：2014-11-11

申请号：US13891874

申请日：2013-05-10

申请人： Jeffery J. Serre

发明人： Jeffery J. Serre

IPC分类号： H01L29/18 ,  H01L33/62 ,  H01L27/15

CPC分类号： H01L33/62 ,  G06F17/5045 ,  G06F17/5068 ,  G06F2217/64 ,  H01L21/485 ,  H01L23/5382 ,  H01L24/95 ,  H01L25/0753 ,  H01L25/50 ,  H01L2224/16225 ,  H01L2224/95085 ,  H01L2224/95101 ,  H01L2224/95146 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/00

摘要： The present disclosure is directed to circuitry configurable based on device orientation. Example circuitry may comprise at least one device location and configurable conductors. The at least one device location may include at least two conductive pads onto which a device may be populated by a manufacturing process. The configurable conductors may be coupled to each of the at least two conductive pads. The configurable conductors may be configured by adding conductive material to at least one configurable conductor or subtracting at least part of at least one configurable conductor. For example, conductive material may be added to close a space between two segments of a configurable conductor to form a conduction path. Alternatively, at least part of at least one of a plurality of configurable conductors coupled to a conductive pad may be subtracted (e.g., cut) to stop conduction in the at least one configurable conductor.

摘要翻译： 本公开涉及基于设备取向配置的电路。 示例电路可以包括至少一个设备位置和可配置导体。 至少一个设备位置可以包括至少两个导电焊盘，其上可以通过制造工艺填充设备。 可配置导体可以耦合到至少两个导电焊盘中的每一个。 可配置导体可以通过将导电材料添加到至少一个可配置导体或减去至少一个可配置导体的至少一部分来配置。 例如，可以添加导电材料以封闭可配置导体的两个部分之间的空间以形成传导路径。 或者，可以减去耦合到导电焊盘的多个可配置导体中的至少一个的至少一个，以便减少（例如，切割）以停止在至少一个可配置导体中的导通。

公开(公告)号：US08642391B2

公开(公告)日：2014-02-04

申请号：US12936765

申请日：2009-04-07

申请人： Lea Di Cioccio ,  Francois Grossi ,  Pierric Gueguen ,  Laurent Vandroux

发明人： Lea Di Cioccio ,  Francois Grossi ,  Pierric Gueguen ,  Laurent Vandroux

IPC分类号： H01L21/00

CPC分类号： H01L24/83 ,  H01L24/24 ,  H01L24/29 ,  H01L24/32 ,  H01L24/81 ,  H01L24/82 ,  H01L24/90 ,  H01L24/95 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/08235 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2224/24011 ,  H01L2224/24226 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/80004 ,  H01L2224/80143 ,  H01L2224/81136 ,  H01L2224/81143 ,  H01L2224/81801 ,  H01L2224/81894 ,  H01L2224/83002 ,  H01L2224/83141 ,  H01L2224/83143 ,  H01L2224/83192 ,  H01L2224/8385 ,  H01L2224/83894 ,  H01L2224/9202 ,  H01L2224/95085 ,  H01L2224/95146 ,  H01L2225/06562 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/07802 ,  H01L2924/10157 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15192 ,  H01L2924/0665 ,  H01L2924/00

摘要： A method of forming, on a surface of a substrate, at least one hydrophilic attachment area for the purpose of self-assembling a component or a chip, in which a hydrophobic area, which delimits the hydrophilic attachment area, is produced.

摘要翻译： 在衬底的表面上形成至少一个亲水附着区域的方法，用于自组装组件或芯片，其中产生界定亲水附着区域的疏水区域。

公开(公告)号：US08394458B2

公开(公告)日：2013-03-12

申请号：US13453629

申请日：2012-04-23

申请人： Hidekazu Arase

发明人： Hidekazu Arase

IPC分类号： H01L21/50 ,  H01L21/58 ,  H05K13/00 ,  H05K13/04 ,  H05K3/30

CPC分类号： H01L24/97 ,  H01L2224/95085 ,  H01L2224/95145 ,  H01L2224/95146 ,  H01L2924/15788 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49133 ,  H01L2924/00

摘要： In order to increase the probability that the component is disposed on the hydrophilic region, used is a substrate comprises a water-repellant region, a hydrophilic region, and a hydrophilic line, wherein the water-repellant region surrounds the hydrophilic region and the hydrophilic line, the hydrophilic region and the hydrophilic line are disposed along the +X direction in this order, the value of D1/D2 is not less than 0.1 and not more than 1.2, the value of D3 is not less than 5 micrometers, the value of D4 is less than the minimum length of the component.

摘要翻译： 为了增加组分设置在亲水区域上的可能性，使用的基材包括防水区域，亲水区域和亲水性线路，其中防水区域包围亲水区域和亲水线路 ，亲水性区域和亲水性线沿着+ X方向依次配置，D1 / D2的值不小于0.1且不大于1.2，D3的值不小于5微米， D4小于组件的最小长度。

公开(公告)号：US08349652B2

公开(公告)日：2013-01-08

申请号：US13258664

申请日：2010-03-10

申请人： Mitsumasa Koyanagi ,  Takafumi Fukushima ,  Masahiko Sugiyama

发明人： Mitsumasa Koyanagi ,  Takafumi Fukushima ,  Masahiko Sugiyama

IPC分类号： H01L21/50

CPC分类号： H01L21/50 ,  H01L21/6835 ,  H01L21/76898 ,  H01L23/13 ,  H01L23/481 ,  H01L24/11 ,  H01L24/13 ,  H01L24/95 ,  H01L25/0657 ,  H01L25/18 ,  H01L25/50 ,  H01L29/0657 ,  H01L2221/68318 ,  H01L2221/6834 ,  H01L2221/68354 ,  H01L2221/68368 ,  H01L2224/0401 ,  H01L2224/05008 ,  H01L2224/05009 ,  H01L2224/06182 ,  H01L2224/13009 ,  H01L2224/13025 ,  H01L2224/13099 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13184 ,  H01L2224/1403 ,  H01L2224/14181 ,  H01L2224/81193 ,  H01L2224/81801 ,  H01L2224/83002 ,  H01L2224/83005 ,  H01L2224/83143 ,  H01L2224/83193 ,  H01L2224/83896 ,  H01L2224/921 ,  H01L2224/95001 ,  H01L2224/95146 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/0001 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/15788 ,  Y10T156/1798 ,  H01L2924/00014 ,  H01L2924/00

摘要： There is provided a three-dimensional integrated circuit manufacturing method for temporarily attaching a chip to a transcription substrate, and securely detaching the chip from the transcription substrate when the chip is transferred to a supporting substrate. When a chip is temporarily attached to a transcription substrate, by evaporating a liquid existing between the chip and the transcription substrate, the solids of the chip and the transcription substrate can be attached to each other. Accordingly, the chip can be temporarily attached to the transcription substrate so as not to be deviated from its own position. Further, by setting adhesive strength between the chip and a supporting substrate to be higher than that between the chip and the transcription substrate, the chip can be securely detached from the transcription substrate when the chip is transferred from the transcription substrate to the supporting substrate.

摘要翻译： 提供了一种用于将芯片临时附接到转录底物的三维集成电路制造方法，并且当芯片被转移到支撑衬底时，可靠地将芯片从转录衬底上分离。 当芯片临时连接到转录底物时，通过蒸发芯片和转录底物之间的液体，芯片和转录底物的固体可以彼此附着。 因此，芯片可以临时安装到转录基片上，以便不会偏离其本身的位置。 此外，通过将芯片和支撑基板之间的粘合强度设置为高于芯片和转录基板之间的粘合强度，当芯片从转录基板转移到支撑基板时，可以将芯片从转录基板上牢固地分离。

公开(公告)号：US08283208B2

公开(公告)日：2012-10-09

申请号：US11813032

申请日：2005-12-28

申请人： Mitsumasa Koyanagi

发明人： Mitsumasa Koyanagi

IPC分类号： H01L21/00

CPC分类号： H01L21/6835 ,  H01L21/568 ,  H01L21/6836 ,  H01L24/05 ,  H01L24/13 ,  H01L24/29 ,  H01L24/75 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L24/95 ,  H01L24/96 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/50 ,  H01L2221/68313 ,  H01L2221/68327 ,  H01L2221/68354 ,  H01L2221/68363 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/13147 ,  H01L2224/13184 ,  H01L2224/1319 ,  H01L2224/1329 ,  H01L2224/133 ,  H01L2224/16 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/73259 ,  H01L2224/75 ,  H01L2224/7598 ,  H01L2224/78743 ,  H01L2224/81097 ,  H01L2224/81143 ,  H01L2224/81193 ,  H01L2224/81201 ,  H01L2224/81801 ,  H01L2224/81907 ,  H01L2224/83193 ,  H01L2224/838 ,  H01L2224/83907 ,  H01L2224/95001 ,  H01L2224/95145 ,  H01L2224/95146 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/12043 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15311 ,  H01L2924/15788 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2924/01031

摘要： In a method of fabricating an integrated circuit device having a three-dimensional stacked structured, the step of fixing many chip-shaped semiconductor circuits to a support substrate or a circuit layer with a predetermined layout can be performed easily and efficiently with a desired accuracy. Temporary adhesion portions 12b of semiconductor chips 13 are temporarily adhered to corresponding temporary adhesion regions 72a of a carrier substrate 73a by way of water films 81. The carrier substrate 73a is then pressed toward a support substrate or a desired circuit layer, thereby contacting connecting portions 12 of the chips 13 on the carrier substrate 73a with corresponding predetermined positions on the support substrate or a circuit layer. Thereafter, by fixing the connecting portions 12 to the predetermined positions, the chips 13 are attached to the support substrate or the circuit layer with a desired layout.

摘要翻译： 在制造具有三维堆叠结构的集成电路器件的方法中，可以以期望的精度容易且有效地执行将许多芯片形半导体电路固定到支撑衬底或具有预定布局的电路层的步骤。 半导体芯片13的临时粘合部分12b通过水膜81临时粘附到载体基板73a的相应的临时粘合区域72a上。然后将载体基板73a压向支撑基板或所需的电路层，从而接触连接部分 载体基板73a上的芯片13的12个，在支撑基板或电路层上具有对应的预定位置。 此后，通过将连接部分12固定到预定位置，芯片13以期望的布局附接到支撑基板或电路层。

公开(公告)号：US08138868B2

公开(公告)日：2012-03-20

申请号：US12102758

申请日：2008-04-14

申请人： David Patrick Arnold

发明人： David Patrick Arnold

IPC分类号： H01F7/00 ,  H01F1/00 ,  B23P19/00

CPC分类号： B81C1/00007 ,  B81C3/002 ,  H01L24/83 ,  H01L24/95 ,  H01L25/50 ,  H01L2224/83801 ,  H01L2224/95085 ,  H01L2224/95092 ,  H01L2224/95136 ,  H01L2224/95144 ,  H01L2224/95145 ,  H01L2224/95146 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/01105 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15155 ,  H01L2924/15165 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/3025 ,  H05K3/303 ,  H05K2201/083 ,  H05K2201/10636 ,  H05K2201/10674 ,  H05K2203/048 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/49075 ,  Y10T29/4913 ,  Y10T29/5313 ,  Y10T29/53196 ,  H01L2924/15153 ,  H01L2924/3512 ,  H01L2924/00

摘要： A magnetically directed, self-assembled structure has a first body. The first body includes a single magnet or plurality of magnets disposed thereon to form a spatially variable magnetic field in a first predetermined pattern. A second body has a single magnet or plurality of magnets disposed thereon to form a spatially variable magnetic field in a second predetermined pattern. The second predetermined pattern is complementary to the first pattern. The first body is attracted to the second body with an attractive force greater than a mixture force such that the first body and second body are fully aligned to each other and bonded together.

摘要翻译： 一个磁性指向的自组装结构具有第一体。 第一主体包括设置在其上的单个磁体或多个磁体，以形成第一预定图案中的空间可变磁场。 第二主体具有设置在其上的单个磁体或多个磁体，以形成第二预定图案中的空间可变的磁场。 第二预定图案与第一图案互补。 第一主体以比混合力更大的吸引力吸引到第二主体，使得第一主体和第二主体彼此完全对准并结合在一起。

公开(公告)号：US20100147441A1

公开(公告)日：2010-06-17

申请号：US12712640

申请日：2010-02-25

申请人： Tohru NAKAGAWA ,  Hideo TORII

发明人： Tohru NAKAGAWA ,  Hideo TORII

IPC分类号： B32B37/00

CPC分类号： H01L24/83 ,  H01L21/67144 ,  H01L24/75 ,  H01L24/95 ,  H01L25/0655 ,  H01L2224/2919 ,  H01L2224/83136 ,  H01L2224/83192 ,  H01L2224/8385 ,  H01L2224/95085 ,  H01L2224/95102 ,  H01L2224/95146 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/0101 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01052 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/1306 ,  H01L2924/14 ,  H01L2924/15788 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30107 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49133 ,  Y10T29/49155 ,  Y10T156/10 ,  H01L2924/00

摘要： A mounting method comprising the steps of (A) disposing first liquid (2) on first region (11) provided on one principal surface of substrate (1); (B) bringing member-containing liquid (5) containing second liquid (3) and at least one member (4) into contact with the first liquid (2) disposed on the first region (11); and (C) removing the first liquid (2) and the second liquid (3) from the one principal surface to thereby dispose the member (4) on the first region (11). The first liquid (2) is substantially not dissolved in the second liquid (3). The wettability of the first liquid (2) with respect to the surface of the member (4) is higher than that of the second liquid (3).

摘要翻译： 一种安装方法，包括以下步骤：（A）将第一液体（2）设置在设置在基板（1）的一个主表面上的第一区域（11）上; （B）使含有第二液体（3）的构件的液体（5）和至少一个构件（4）与设置在第一区域（11）上的第一液体（2）接触; 和（C）从一个主表面去除第一液体（2）和第二液体（3），从而将构件（4）设置在第一区域（11）上。 第一液体（2）基本上不溶解在第二液体（3）中。 第一液体（2）相对于构件（4）的表面的润湿性高于第二液体（3）的润湿性。

公开(公告)号：US07730610B2

公开(公告)日：2010-06-08

申请号：US12088194

申请日：2006-09-29

申请人： Tohru Nakagawa ,  Hideo Torii

发明人： Tohru Nakagawa ,  Hideo Torii

IPC分类号： H05K3/20 ,  H05K3/30

CPC分类号： H01L24/83 ,  H01L21/67144 ,  H01L24/75 ,  H01L24/95 ,  H01L25/0655 ,  H01L2224/2919 ,  H01L2224/83136 ,  H01L2224/83192 ,  H01L2224/8385 ,  H01L2224/95085 ,  H01L2224/95102 ,  H01L2224/95146 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/0101 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01052 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/1306 ,  H01L2924/14 ,  H01L2924/15788 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30107 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49133 ,  Y10T29/49155 ,  Y10T156/10 ,  H01L2924/00

摘要： A mounting method comprising the steps of (A) disposing first liquid (2) on first region (11) provided on one principal surface of substrate (1); (B) bringing member-containing liquid (5) containing second liquid (3) and at least one member (4) into contact with the first liquid (2) disposed on the first region (11); and (C) removing the first liquid (2) and the second liquid (3) from the one principal surface to thereby dispose the member (4) on the first region (11). The first liquid (2) is substantially not dissolved in the second liquid (3). The wettability of the first liquid (2) with respect to the surface of the member (4) is higher than that of the second liquid (3).

摘要翻译： 一种安装方法，包括以下步骤：（A）将第一液体（2）设置在设置在基板（1）的一个主表面上的第一区域（11）上; （B）使含有第二液体（3）的构件的液体（5）和至少一个构件（4）与设置在第一区域（11）上的第一液体（2）接触; 和（C）从一个主表面去除第一液体（2）和第二液体（3），从而将构件（4）设置在第一区域（11）上。 第一液体（2）基本上不溶解在第二液体（3）中。 第一液体（2）相对于构件（4）的表面的润湿性高于第二液体（3）的润湿性。

公开(公告)号：US20090265929A1

公开(公告)日：2009-10-29

申请号：US12088194

申请日：2006-09-29

申请人： Tohru Nakagawa ,  Hideo Torii

发明人： Tohru Nakagawa ,  Hideo Torii

IPC分类号： H05K3/10 ,  C23C16/00

CPC分类号： H01L24/83 ,  H01L21/67144 ,  H01L24/75 ,  H01L24/95 ,  H01L25/0655 ,  H01L2224/2919 ,  H01L2224/83136 ,  H01L2224/83192 ,  H01L2224/8385 ,  H01L2224/95085 ,  H01L2224/95102 ,  H01L2224/95146 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/0101 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01052 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/1306 ,  H01L2924/14 ,  H01L2924/15788 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30107 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49133 ,  Y10T29/49155 ,  Y10T156/10 ,  H01L2924/00

摘要： A mounting method comprising the steps of (A) disposing first liquid (2) on first region (11) provided on one principal surface of substrate (1); (B) bringing member-containing liquid (5) containing second liquid (3) and at least one member (4) into contact with the first liquid (2) disposed on the first region (11); and (C) removing the first liquid (2) and the second liquid (3) from the one principal surface to thereby dispose the member (4) on the first region (11). The first liquid (2) is substantially not dissolved in the second liquid (3). The wettability of the first liquid (2) with respect to the surface of the member (4) is higher than that of the second liquid (3).

摘要翻译： 一种安装方法，包括以下步骤：（A）将第一液体（2）设置在设置在基板（1）的一个主表面上的第一区域（11）上; （B）使含有第二液体（3）的构件的液体（5）和至少一个构件（4）与设置在第一区域（11）上的第一液体（2）接触; 和（C）从一个主表面去除第一液体（2）和第二液体（3），从而将构件（4）设置在第一区域（11）上。 第一液体（2）基本上不溶解在第二液体（3）中。 第一液体（2）相对于构件（4）的表面的润湿性高于第二液体（3）的润湿性。