发明申请
- 专利标题： METHOD OF MOUNTING ELECTRONIC CIRCUIT CONSTITUTING MEMBER AND RELEVANT MOUNTING APPARATUS
- 专利标题（中）： 安装电子电路组件和相关安装设备的方法
-
申请号： US12712640申请日： 2010-02-25
-
公开(公告)号： US20100147441A1公开(公告)日： 2010-06-17
- 发明人: Tohru NAKAGAWA , Hideo TORII
- 申请人： Tohru NAKAGAWA , Hideo TORII
- 申请人地址： JP Osaka
- 专利权人： PANASONIC CORPORATION
- 当前专利权人： PANASONIC CORPORATION
- 当前专利权人地址： JP Osaka
- 优先权： JP2005-284329 20050929; JP2006-051066 20060227
- 主分类号： B32B37/00
- IPC分类号： B32B37/00
摘要：
A mounting method comprising the steps of (A) disposing first liquid (2) on first region (11) provided on one principal surface of substrate (1); (B) bringing member-containing liquid (5) containing second liquid (3) and at least one member (4) into contact with the first liquid (2) disposed on the first region (11); and (C) removing the first liquid (2) and the second liquid (3) from the one principal surface to thereby dispose the member (4) on the first region (11). The first liquid (2) is substantially not dissolved in the second liquid (3). The wettability of the first liquid (2) with respect to the surface of the member (4) is higher than that of the second liquid (3).
公开/授权文献
信息查询
