Invention Grant
US08394458B2 Method for disposing a component 有权
配置组件的方法

Method for disposing a component
Abstract:
In order to increase the probability that the component is disposed on the hydrophilic region, used is a substrate comprises a water-repellant region, a hydrophilic region, and a hydrophilic line, wherein the water-repellant region surrounds the hydrophilic region and the hydrophilic line, the hydrophilic region and the hydrophilic line are disposed along the +X direction in this order, the value of D1/D2 is not less than 0.1 and not more than 1.2, the value of D3 is not less than 5 micrometers, the value of D4 is less than the minimum length of the component.
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