Invention Grant
- Patent Title: Method for disposing a component
- Patent Title (中): 配置组件的方法
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Application No.: US13453629Application Date: 2012-04-23
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Publication No.: US08394458B2Publication Date: 2013-03-12
- Inventor: Hidekazu Arase
- Applicant: Hidekazu Arase
- Applicant Address: JP Osaka
- Assignee: Panasonic Corporation
- Current Assignee: Panasonic Corporation
- Current Assignee Address: JP Osaka
- Agency: McDermott Will & Emery LLP
- Priority: JP2011-028204 20110214
- Main IPC: H01L21/50
- IPC: H01L21/50 ; H01L21/58 ; H05K13/00 ; H05K13/04 ; H05K3/30

Abstract:
In order to increase the probability that the component is disposed on the hydrophilic region, used is a substrate comprises a water-repellant region, a hydrophilic region, and a hydrophilic line, wherein the water-repellant region surrounds the hydrophilic region and the hydrophilic line, the hydrophilic region and the hydrophilic line are disposed along the +X direction in this order, the value of D1/D2 is not less than 0.1 and not more than 1.2, the value of D3 is not less than 5 micrometers, the value of D4 is less than the minimum length of the component.
Public/Granted literature
- US20120207930A1 METHOD FOR DISPOSING A COMPONENT Public/Granted day:2012-08-16
Information query
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