公开(公告)号：US09722145B2

公开(公告)日：2017-08-01

申请号：US14749569

申请日：2015-06-24

申请人： Sharp Laboratories of America, Inc.

发明人： Kenji Alexander Sasaki ,  Paul John Schuele ,  Mark Albert Crowder

IPC分类号： H01L33/08 ,  H01L33/48 ,  H01L33/20

CPC分类号： H01L33/483 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L24/95 ,  H01L24/97 ,  H01L25/0753 ,  H01L25/50 ,  H01L33/20 ,  H01L33/62 ,  H01L2224/291 ,  H01L2224/32225 ,  H01L2224/83143 ,  H01L2224/83424 ,  H01L2224/83447 ,  H01L2224/83488 ,  H01L2224/83805 ,  H01L2224/83815 ,  H01L2224/95001 ,  H01L2224/95101 ,  H01L2224/95136 ,  H01L2224/95146 ,  H01L2224/97 ,  H01L2924/10155 ,  H01L2924/12041 ,  H01L2924/15153 ,  H01L2924/15155 ,  H01L2933/0033 ,  H01L2933/0066 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2924/0549 ,  H01L2924/0543 ,  H01L2924/01049 ,  H01L2924/0544 ,  H01L2924/0105 ,  H01L2224/83

摘要： Light emitting devices and methods for their manufacture are provided. According to one aspect, a light emitting device is provided that comprises a substrate having a recess, and an interlayer dielectric layer located on the substrate. The interlayer dielectric layer may have a first hole and a second hole, the first hole opening over the recess of the substrate. The light emitting device may further include first and second micro LEDs, the first micro LED having a thickness greater than the second micro LED. The first micro LED and the second micro LED may be placed in the first hole and the second hole, respectively.

公开(公告)号：US20160380158A1

公开(公告)日：2016-12-29

申请号：US14749569

申请日：2015-06-24

申请人： Sharp Laboratories of America, Inc.

发明人： Kenji Alexander Sasaki ,  Paul John Schuele ,  Mark Albert Crowder

IPC分类号： H01L33/48 ,  H01L33/20

CPC分类号： H01L33/483 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L24/95 ,  H01L24/97 ,  H01L25/0753 ,  H01L25/50 ,  H01L33/20 ,  H01L33/62 ,  H01L2224/291 ,  H01L2224/32225 ,  H01L2224/83143 ,  H01L2224/83424 ,  H01L2224/83447 ,  H01L2224/83488 ,  H01L2224/83805 ,  H01L2224/83815 ,  H01L2224/95001 ,  H01L2224/95101 ,  H01L2224/95136 ,  H01L2224/95146 ,  H01L2224/97 ,  H01L2924/10155 ,  H01L2924/12041 ,  H01L2924/15153 ,  H01L2924/15155 ,  H01L2933/0033 ,  H01L2933/0066 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2924/0549 ,  H01L2924/0543 ,  H01L2924/01049 ,  H01L2924/0544 ,  H01L2924/0105 ,  H01L2224/83

摘要： Light emitting devices and methods for their manufacture are provided. According to one aspect, a light emitting device is provided that comprises a substrate having a recess, and an interlayer dielectric layer located on the substrate. The interlayer dielectric layer may have a first hole and a second hole, the first hole opening over the recess of the substrate. The light emitting device may further include first and second micro LEDs, the first micro LED having a thickness greater than the second micro LED. The first micro LED and the second micro LED may be placed in the first hole and the second hole, respectively.

摘要翻译： 提供了用于其制造的发光器件和方法。 根据一个方面，提供一种发光器件，其包括具有凹陷的衬底和位于衬底上的层间电介质层。 层间绝缘层可以具有第一孔和第二孔，第一孔在衬底的凹部上方开口。 发光器件还可以包括第一和第二微型LED，第一微型LED的厚度大于第二微型LED。 第一微型LED和第二微型LED可以分别放置在第一孔和第二孔中。

公开(公告)号：US09070063B2

公开(公告)日：2015-06-30

申请号：US13595750

申请日：2012-08-27

申请人： Curt Carrender

发明人： Curt Carrender

IPC分类号： G08B13/14 ,  G06K19/07 ,  G06K19/077 ,  G08B13/24 ,  H01L23/00

CPC分类号： G06K19/0723 ,  G06K19/07788 ,  G08B13/2417 ,  G08B13/2437 ,  G08B13/2445 ,  H01L24/24 ,  H01L24/82 ,  H01L2224/24227 ,  H01L2224/7665 ,  H01L2224/82039 ,  H01L2224/95085 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15155 ,  H01L2924/15165 ,  Y10T29/49016 ,  Y10T29/49128 ,  Y10T29/49155 ,  H01L2924/15153 ,  H01L2924/00

摘要： An RFID device. The device comprises a conductive layer formed on a first substrate. An opening line (or two or more opening lines) is formed in the conductive layer to make the conductive layer a part of an antenna structure. An integrated circuit chip is placed over at least a portion the opening line and coupled to the conductive layer. The integrated circuit chip is electrically interconnected to the conductive layer.

摘要翻译： RFID设备。 该器件包括形成在第一衬底上的导电层。 在导电层中形成开口线（或两个或更多个开口线），以使导电层成为天线结构的一部分。 集成电路芯片放置在开口线的至少一部分上并且耦合到导电层。 集成电路芯片与导电层电互连。

公开(公告)号：US07687277B2

公开(公告)日：2010-03-30

申请号：US11021120

申请日：2004-12-22

申请人： Ravi Sharma ,  Charles P. Lusignan

发明人： Ravi Sharma ,  Charles P. Lusignan

IPC分类号： G01N33/00

CPC分类号： H01L24/95 ,  H01L24/86 ,  H01L25/50 ,  H01L2224/83192 ,  H01L2224/95085 ,  H01L2224/95136 ,  H01L2224/95144 ,  H01L2224/95145 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15155 ,  H01L2924/15165 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/3025 ,  Y10T436/25 ,  H01L2924/15153 ,  H01L2924/00

摘要： Methods and apparatuses are provided for assembling a structure on a support having a pattern of binding sites. In accordance with the method, a first fluid is provided on the surface of the support with the first fluid being of a type that that increases viscosity when cooled, the first fluid having first micro-components suspended therein each adapted to engage the binding sites. First fluid proximate to selected binding sites is cooled to increase the viscosity of the responsive fluid proximate to the selected binding sites so that the first micro-components suspended in the first fluid are inhibited from engaging the selected binding sites.

摘要翻译： 提供了用于将结构组装在具有结合位点图案的支撑体上的方法和装置。 根据该方法，在支撑体的表面上提供第一流体，其中第一流体是当冷却时增加粘度的类型，其中悬浮在其中的第一微量组分适于接合结合位点。 冷却接近所选结合位点的第一流体以增加接近所选结合位点的响应流体的粘度，使得悬浮在第一流体中的第一微量组分被阻止接合所选择的结合位点。

公开(公告)号：US07629026B2

公开(公告)日：2009-12-08

申请号：US10849327

申请日：2004-09-03

申请人： Ravi Sharma ,  Daniel D. Haas ,  Theodore K. Ricks

发明人： Ravi Sharma ,  Daniel D. Haas ,  Theodore K. Ricks

IPC分类号： B05D5/00

CPC分类号： H01L24/95 ,  H01L24/86 ,  H01L25/0655 ,  H01L25/0753 ,  H01L25/50 ,  H01L2224/7965 ,  H01L2224/95085 ,  H01L2224/95136 ,  H01L2224/95145 ,  H01L2224/95146 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/0101 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01021 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/01052 ,  H01L2924/01057 ,  H01L2924/0106 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15155 ,  H01L2924/15165 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/3025 ,  H01L2924/15153 ,  H01L2924/00

摘要： Methods and apparatuses are provided for assembling a structure on a support having a pattern of binding sites. In accordance with the method, a first fluid is provided on the surface of the support with the first fluid being of a type that that increases viscosity when heated, the first fluid having first micro-components suspended therein each adapted to engage the binding sites. The first fluid proximate to selected binding sites is heated to increase the viscosity of the responsive fluid proximate to the selected binding sites so that the first micro-components suspended in the first fluid are inhibited from engaging the selected binding sites.

摘要翻译： 提供了用于将结构组装在具有结合位点图案的支撑体上的方法和装置。 根据该方法，在支撑体的表面上提供第一流体，其中第一流体是加热时增加粘度的类型，其中悬浮于其中的第一微量组分适于接合结合位点的第一流体。 加热接近所选结合位点的第一种流体以增加接近所选结合位点的响应流体的粘度，使得悬浮在第一流体中的第一微量组分被阻止接合所选择的结合位点。

公开(公告)号：US07559486B2

公开(公告)日：2009-07-14

申请号：US11641455

申请日：2006-12-18

申请人： Jeffrey Jay Jacobsen

发明人： Jeffrey Jay Jacobsen

IPC分类号： E01B9/00 ,  H05K7/00

CPC分类号： H01L51/0097 ,  H01L24/95 ,  H01L27/3244 ,  H01L27/3255 ,  H01L51/56 ,  H01L2224/95085 ,  H01L2251/5338 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/12041 ,  H01L2924/12044 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15155 ,  H01L2924/15165 ,  H01L2924/19041 ,  Y02E10/549 ,  Y02P70/521 ,  Y10T29/49016 ,  Y10T29/4913 ,  H01L2924/15153 ,  H01L2924/00

摘要： Apparatuses and methods for forming wireless RF labels are claimed. In one embodiment, a flexible layer may be made to receive an array of integrated circuit chips The integrated circuit chips may be powered by a signal from a transmitter which beams the information to the wireless RF labels. The method includes coupling a plurality of integrated circuit chips to a flexible web material and advancing the flexible web material through a web processing apparatus. A metallization material is patterned on the flexible web material. The flexible web material can be coupled to a second web material.

摘要翻译： 要求保护用于形成无线RF标签的装置和方法。 在一个实施例中，柔性层可以被制成以接收集成电路芯片的阵列。集成电路芯片可以由来自发射器的信号供电，所述发射器将信息辐射到无线RF标签。 该方法包括将多个集成电路芯片耦合到柔性幅材材料并且通过幅材处理装置推进柔性幅材材料。 金属化材料在柔性网状材料上图案化。 柔性网状材料可以联接到第二网状材料。

公开(公告)号：US20070269914A1

公开(公告)日：2007-11-22

申请号：US11552955

申请日：2006-10-25

申请人： J. Andrew Yeh ,  Gary C-W Tsai ,  C. Max Hsieh ,  Weng Wen-Jey ,  Huang Yi-Ping ,  Kao Chi-Chun ,  Chou Ming-Hung

发明人： J. Andrew Yeh ,  Gary C-W Tsai ,  C. Max Hsieh ,  Weng Wen-Jey ,  Huang Yi-Ping ,  Kao Chi-Chun ,  Chou Ming-Hung

IPC分类号： H01L21/00 ,  H01L21/68

CPC分类号： H01L24/83 ,  H01L21/682 ,  H01L24/29 ,  H01L24/95 ,  H01L25/50 ,  H01L2224/83192 ,  H01L2224/83801 ,  H01L2224/95001 ,  H01L2224/95085 ,  H01L2224/95136 ,  H01L2224/95146 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01077 ,  H01L2924/014 ,  H01L2924/15155 ,  H01L2924/15165 ,  H01L2924/15153

摘要： An apparatus for aligning microelements on a substrate and a method for the same are provided. The steps of the method include providing a substrate, forming a protruding structure on the substrate, providing a microelement, forming a microdroplet on the protruding structure, and forcing the microelement to contact the microdroplet. The surface tension of the microdroplet is used to move the microdroplet to a surface of the protruding structure.

摘要翻译： 提供了一种用于对准衬底上的微量元素的设备及其方法。 该方法的步骤包括提供基材，在基材上形成突出结构，提供微量元素，在突出结构上形成微滴，迫使微量元件接触微滴。 微滴的表面张力用于将微滴移动到突出结构的表面。

公开(公告)号：US20070092654A1

公开(公告)日：2007-04-26

申请号：US11639858

申请日：2006-12-15

申请人： John Smith ,  Mark Hadley ,  Gordon Craig ,  Frank Lowe

发明人： John Smith ,  Mark Hadley ,  Gordon Craig ,  Frank Lowe

IPC分类号： B05D5/00 ,  B05D3/00 ,  B05D3/12 ,  B05D3/02 ,  B05D7/00

CPC分类号： H01L24/32 ,  B82Y30/00 ,  H01L21/31122 ,  H01L21/32136 ,  H01L21/84 ,  H01L24/24 ,  H01L24/82 ,  H01L24/95 ,  H01L24/97 ,  H01L25/0655 ,  H01L25/50 ,  H01L27/1214 ,  H01L28/55 ,  H01L2224/24225 ,  H01L2224/24227 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/95085 ,  H01L2224/95092 ,  H01L2224/95122 ,  H01L2224/95136 ,  H01L2224/95144 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01072 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/10158 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15155 ,  H01L2924/15157 ,  H01L2924/15165 ,  H01L2924/15788 ,  Y10S977/882 ,  Y10S977/883 ,  H01L2224/82 ,  H01L2924/00

摘要： Methods and apparatuses for assembling a structure onto a substrate. A method according to one aspect of the invention includes dispensing a slurry onto a substrate wherein the slurry includes a first plurality of elements, each of which is designed to mate with a receptor region on said substrate and each of which comprises a functional element, and wherein the slurry also includes a second plurality of elements which are not designed to mate with receptor regions on the substrate. Typically, these second plurality of elements help movement of the first plurality of elements. A method according to another aspect of the invention includes dispensing in a flow having a first direction a slurry onto a substrate, wherein the slurry includes a fluid and a plurality of elements, each of which is designed to mate with a receptor region on the substrate and each of which includes a functional element, and vibrating substrate in a second direction which is substantially perpendicular to the first direction. A method according to another aspect of the invention includes creating a slurry comprising of fluid and a plurality of elements, each of which is designed to mate with a receptor region on the substrate and each of which comprises a functional element, and projecting the slurry through a nozzle toward the substrate. In one particular implementation of this aspect, additional nozzles may be used to provide suction or additional fluid or additional slurry. A method according to another aspect of the invention includes dissolving a bonding agent into a solvent to create a fluid, dispensing a slurry onto a substrate, wherein the slurry includes the fluid and a plurality of elements each of which is designed to mate with a receptor region on the substrate and each of which comprises a functional element, and evaporating the solvent after each of the plurality of elements has mated with a corresponding receptor, wherein the bonding agent bonds each of the plurality of elements to the corresponding receptor region.

公开(公告)号：US07172910B2

公开(公告)日：2007-02-06

申请号：US11169534

申请日：2005-06-28

申请人： Mark A. Hadley ,  Ann Chiang ,  Gordon S. W. Craig ,  Jeffrey Jay Jacobsen ,  John Stephen Smith ,  Jay Tu ,  Roger Green Stewart

发明人： Mark A. Hadley ,  Ann Chiang ,  Gordon S. W. Craig ,  Jeffrey Jay Jacobsen ,  John Stephen Smith ,  Jay Tu ,  Roger Green Stewart

IPC分类号： H01L21/00

CPC分类号： H01L27/1214 ,  G02F1/133305 ,  G02F1/1362 ,  H01L24/24 ,  H01L24/82 ,  H01L24/95 ,  H01L24/97 ,  H01L25/0753 ,  H01L25/50 ,  H01L29/0657 ,  H01L2224/24101 ,  H01L2224/24137 ,  H01L2224/24227 ,  H01L2224/76155 ,  H01L2224/7665 ,  H01L2224/82102 ,  H01L2224/95085 ,  H01L2224/95145 ,  H01L2224/97 ,  H01L2251/5338 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/10158 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15155 ,  H01L2924/15165 ,  H01L2924/19041 ,  H01L2924/30105 ,  H01S5/0201 ,  H01L2224/82 ,  H01L2924/00

摘要： Apparatuses and methods for forming displays are claimed. One embodiment of the invention relates to forming an assembly using different sized blocks in either a flexible or rigid substrate.

摘要翻译： 要求保护用于形成显示器的装置和方法。 本发明的一个实施例涉及使用不同尺寸的块在柔性或刚性基底中形成组件。

公开(公告)号：US20060269689A1

公开(公告)日：2006-11-30

申请号：US11452444

申请日：2006-06-13

申请人： Gordon Craig ,  Ming Chan ,  Cornelius Sutu ,  Omar Alvarado ,  Hoang Pham ,  Mark Hadley

发明人： Gordon Craig ,  Ming Chan ,  Cornelius Sutu ,  Omar Alvarado ,  Hoang Pham ,  Mark Hadley

IPC分类号： B05D1/12 ,  B05D3/00

CPC分类号： H05K13/027 ,  H01L21/67144 ,  H01L24/95 ,  H01L25/50 ,  H01L2224/95085 ,  H01L2224/95092 ,  H01L2224/95122 ,  H01L2224/95136 ,  H01L2924/01005 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/14 ,  H01L2924/15155 ,  H01L2924/15165 ,  Y10S29/046 ,  Y10T29/49133 ,  Y10T29/53178 ,  Y10T29/53183 ,  Y10T29/53191 ,  Y10T29/53261 ,  H01L2924/15153

摘要： An apparatus for dispensing blocks in a fluid over a substrate. The apparatus includes a first tube having a first end and a second end. A compression device is coupled to the first tube. A second tube is connected to the first tube to deliver a slurry having blocks to the first tube. The compression device pulsates at least one block in the slurry which is flowing through a portion of the first tube.

摘要翻译： 一种用于在衬底上分配流体中的块的装置。 该装置包括具有第一端和第二端的第一管。 压缩装置连接到第一管。 第二管连接到第一管，以将具有块的浆料输送到第一管。 压缩装置使流过第一管的一部分的浆料中的至少一个块脉动。