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公开(公告)号：US09892944B2
公开(公告)日：2018-02-13
申请号：US15190813
申请日：2016-06-23
发明人： Paul John Schuele , David Robert Heine , Mark Albert Crowder , Sean Mathew Garner , Changqing Zhan , Avinash Tukaram Shinde , Kenji Alexander Sasaki , Kurt Michael Ulmer
IPC分类号： H01L29/06 , H01L21/67 , H01L33/20 , H01L21/673
CPC分类号： H01L21/67121 , H01L21/67333 , H01L29/0657 , H01L33/20 , H01L2224/95085
摘要： Embodiments are related to systems and methods for fluidic assembly, and more particularly to systems and methods for assuring deposition of elements in relation to a substrate.
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公开(公告)号：US10032957B2
公开(公告)日：2018-07-24
申请号：US15682260
申请日：2017-08-21
发明人： Mark Albert Crowder , Paul J. Schuele , Changqing Zhan , Kenji Alexander Sasaki , Kurt Michael Ulmer
摘要： Embodiments are related to integrated circuit (IC) fabrication and, more particularly, to a fluidic assembly process for the placement of light emitting diodes on a direct-emission display substrate.
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公开(公告)号：US20170317242A1
公开(公告)日：2017-11-02
申请号：US15650192
申请日：2017-07-14
CPC分类号： H01L33/483 , H01L24/29 , H01L24/32 , H01L24/83 , H01L24/95 , H01L24/97 , H01L25/0753 , H01L25/50 , H01L33/20 , H01L33/62 , H01L2224/291 , H01L2224/32225 , H01L2224/83143 , H01L2224/83424 , H01L2224/83447 , H01L2224/83488 , H01L2224/83805 , H01L2224/83815 , H01L2224/95001 , H01L2224/95101 , H01L2224/95136 , H01L2224/95146 , H01L2224/97 , H01L2924/10155 , H01L2924/12041 , H01L2924/15153 , H01L2924/15155 , H01L2933/0033 , H01L2933/0066 , H01L2924/014 , H01L2924/00014 , H01L2924/0549 , H01L2924/0543 , H01L2924/01049 , H01L2924/0544 , H01L2924/0105 , H01L2224/83
摘要： Light emitting devices and methods for their manufacture are provided. According to one aspect, a light emitting device is provided that comprises a substrate having a recess, and an interlayer dielectric layer located on the substrate. The interlayer dielectric layer may have a first hole and a second hole, the first hole opening over the recess of the substrate. The light emitting device may further include first and second micro LEDs, the first micro LED having a thickness greater than the second micro LED. The first micro LED and the second micro LED may be placed in the first hole and the second hole, respectively.
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公开(公告)号：US09755110B1
公开(公告)日：2017-09-05
申请号：US15221571
申请日：2016-07-27
发明人： Mark Albert Crowder , Paul J. Schuele , Changqing Zhan , Kenji Alexander Sasaki , Kurt Michael Ulmer
CPC分类号： H01L33/24 , H01L27/156 , H01L33/62 , H01L2224/95 , H01L2933/0066
摘要： Embodiments are related to integrated circuit (IC) fabrication and, more particularly, to a fluidic assembly process for the placement of light emitting diodes on a direct-emission display substrate.
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公开(公告)号：US10347513B2
公开(公告)日：2019-07-09
申请号：US15859673
申请日：2018-01-01
发明人： Paul John Schuele , David Robert Heine , Mark Albert Crowder , Sean Mathew Garner , Changqing Zhan , Avinash Tukaram Shinde , Kenji Alexander Sasaki , Kurt Michael Ulmer
IPC分类号： H01L21/67 , H01L29/06 , H01L21/673 , H01L23/00 , H01L33/00 , H01L25/075
摘要： Embodiments are related to systems and methods for fluidic assembly, and more particularly to systems and methods for assuring deposition of elements in relation to a substrate.
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公开(公告)号：US10230020B2
公开(公告)日：2019-03-12
申请号：US15650192
申请日：2017-07-14
摘要： Light emitting devices and methods for their manufacture are provided. According to one aspect, a light emitting device is provided that comprises a substrate having a recess, and an interlayer dielectric layer located on the substrate. The interlayer dielectric layer may have a first hole and a second hole, the first hole opening over the recess of the substrate. The light emitting device may further include first and second micro LEDs, the first micro LED having a thickness greater than the second micro LED. The first micro LED and the second micro LED may be placed in the first hole and the second hole, respectively.
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公开(公告)号：US20180144957A1
公开(公告)日：2018-05-24
申请号：US15859673
申请日：2018-01-01
发明人： Paul John Schuele , David Robert Heine , Mark Albert Crowder , Sean Mathew Garner , Changqing Zhan , Avinash Tukaram Shinde , Kenji Alexander Sasaki , Kurt Michael Ulmer
IPC分类号： H01L21/67 , H01L33/20 , H01L29/06 , H01L21/673
CPC分类号： H01L21/67121 , H01L21/67333 , H01L24/95 , H01L25/0753 , H01L29/0657 , H01L33/0095 , H01L2224/95085
摘要： Embodiments are related to systems and methods for fluidic assembly, and more particularly to systems and methods for assuring deposition of elements in relation to a substrate.
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公开(公告)号：US20180033915A1
公开(公告)日：2018-02-01
申请号：US15682260
申请日：2017-08-21
发明人： Mark Albert Crowder , Paul J. Schuele , Changqing Zhan , Kenji Alexander Sasaki , Kurt Michael Ulmer
CPC分类号： H01L33/24 , H01L27/156 , H01L33/62 , H01L2224/95 , H01L2933/0066
摘要： Embodiments are related to integrated circuit (IC) fabrication and, more particularly, to a fluidic assembly process for the placement of light emitting diodes on a direct-emission display substrate.
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公开(公告)号：US09722145B2
公开(公告)日：2017-08-01
申请号：US14749569
申请日：2015-06-24
CPC分类号： H01L33/483 , H01L24/29 , H01L24/32 , H01L24/83 , H01L24/95 , H01L24/97 , H01L25/0753 , H01L25/50 , H01L33/20 , H01L33/62 , H01L2224/291 , H01L2224/32225 , H01L2224/83143 , H01L2224/83424 , H01L2224/83447 , H01L2224/83488 , H01L2224/83805 , H01L2224/83815 , H01L2224/95001 , H01L2224/95101 , H01L2224/95136 , H01L2224/95146 , H01L2224/97 , H01L2924/10155 , H01L2924/12041 , H01L2924/15153 , H01L2924/15155 , H01L2933/0033 , H01L2933/0066 , H01L2924/014 , H01L2924/00014 , H01L2924/0549 , H01L2924/0543 , H01L2924/01049 , H01L2924/0544 , H01L2924/0105 , H01L2224/83
摘要： Light emitting devices and methods for their manufacture are provided. According to one aspect, a light emitting device is provided that comprises a substrate having a recess, and an interlayer dielectric layer located on the substrate. The interlayer dielectric layer may have a first hole and a second hole, the first hole opening over the recess of the substrate. The light emitting device may further include first and second micro LEDs, the first micro LED having a thickness greater than the second micro LED. The first micro LED and the second micro LED may be placed in the first hole and the second hole, respectively.
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公开(公告)号：US20160380158A1
公开(公告)日：2016-12-29
申请号：US14749569
申请日：2015-06-24
CPC分类号： H01L33/483 , H01L24/29 , H01L24/32 , H01L24/83 , H01L24/95 , H01L24/97 , H01L25/0753 , H01L25/50 , H01L33/20 , H01L33/62 , H01L2224/291 , H01L2224/32225 , H01L2224/83143 , H01L2224/83424 , H01L2224/83447 , H01L2224/83488 , H01L2224/83805 , H01L2224/83815 , H01L2224/95001 , H01L2224/95101 , H01L2224/95136 , H01L2224/95146 , H01L2224/97 , H01L2924/10155 , H01L2924/12041 , H01L2924/15153 , H01L2924/15155 , H01L2933/0033 , H01L2933/0066 , H01L2924/014 , H01L2924/00014 , H01L2924/0549 , H01L2924/0543 , H01L2924/01049 , H01L2924/0544 , H01L2924/0105 , H01L2224/83
摘要： Light emitting devices and methods for their manufacture are provided. According to one aspect, a light emitting device is provided that comprises a substrate having a recess, and an interlayer dielectric layer located on the substrate. The interlayer dielectric layer may have a first hole and a second hole, the first hole opening over the recess of the substrate. The light emitting device may further include first and second micro LEDs, the first micro LED having a thickness greater than the second micro LED. The first micro LED and the second micro LED may be placed in the first hole and the second hole, respectively.
摘要翻译： 提供了用于其制造的发光器件和方法。 根据一个方面，提供一种发光器件，其包括具有凹陷的衬底和位于衬底上的层间电介质层。 层间绝缘层可以具有第一孔和第二孔，第一孔在衬底的凹部上方开口。 发光器件还可以包括第一和第二微型LED，第一微型LED的厚度大于第二微型LED。 第一微型LED和第二微型LED可以分别放置在第一孔和第二孔中。
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