公开(公告)号：US20230369066A1

公开(公告)日：2023-11-16

申请号：US18358038

申请日：2023-07-25

Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor： Jiun-Yi Wu ,  Chen-Hua Yu

IPC: H01L21/48 ,  H01L21/67 ,  H01L23/00

CPC classification number: H01L21/4853 ,  H01L21/67121 ,  H01L21/4857 ,  H01L24/97

Abstract: A method of fabrication a package and a stencil structure are provided. The stencil structure includes a first carrier having a groove and stencil units placed in the groove of the first carrier. At least one of the stencil units is slidably disposed along sidewalls of another stencil unit. Each of the stencil units has openings.

公开(公告)号：US20230307281A1

公开(公告)日：2023-09-28

申请号：US17700497

申请日：2022-03-22

Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor： Jen-Yuan Chang

IPC: H01L21/68 ,  H01L21/683 ,  H01L21/67 ,  B65G47/91 ,  B65G47/90

CPC classification number: H01L21/681 ,  H01L21/6838 ,  H01L21/67121 ,  B65G47/91 ,  B65G47/905

Abstract: A pick-and-place system is provided. The pick-and-place system includes: a wafer holder configured to hold a bottom die; a gantry having a stabilizer extending downwardly; a primary drive mechanism connected to the gantry and configured to drive the gantry horizontally and vertically; a suction head configured to hold a top die; and a secondary drive mechanism located at the gantry and connected to the suction head and configured to drive the suction head horizontally and vertically to place the top die on the bottom die at a target position. The primary drive mechanism drives the gantry vertically until the stabilizer is in contact with the bottom die before the secondary drive mechanism drives the suction head.

公开(公告)号：US20230288916A1

公开(公告)日：2023-09-14

申请号：US17692671

申请日：2022-03-11

Applicant: Applied Materials, Inc.

Inventor： Ying WANG ,  Xundong DAI ,  Guan Huei SEE ,  Ruiping WANG ,  Michael R. RICE ,  Hari Kishen PONNEKANTI ,  Nirmalya MAITY

IPC: G05B19/418 ,  H01L21/687 ,  H01L21/67

CPC classification number: G05B19/418 ,  H01L21/67121 ,  H01L21/68771 ,  H01L21/68778 ,  G05B2219/45031

Abstract: Apparatus for extending substrate queue time for hybrid bonding by preserving plasma activation. In some embodiments, the apparatus may include an environmentally controllable space with a support for holding a die or a substrate, a gas velocity accelerator that recirculates one or more gases laterally across the support, a filter, a humidifier apparatus that is fluidly connected to the environmentally controllable space, wherein the humidifier apparatus enables controllable humidity levels within the environmentally controllable space, a pressurizing apparatus fluidly connected to the humidifier apparatus on an output and fluidly connected to at least one gas supply on an input, a relative humidity (RH) sensor positioned within the environmentally controllable space, and an environment controller in communication with at least the humidifier apparatus and the RH sensor, wherein the environment controller is configured to maintain an RH level of approximately 80% to approximately 95%.

公开(公告)号：US20230274987A1

公开(公告)日：2023-08-31

申请号：US17680554

申请日：2022-02-25

Applicant: Applied Materials, Inc.

Inventor： Ruiping WANG ,  Shijing WANG ,  Selim NAHAS ,  Ying WANG ,  Guan Huei SEE

IPC: H01L21/66 ,  H01L21/67 ,  H01L21/687 ,  G05B19/4155

CPC classification number: H01L22/22 ,  G05B19/4155 ,  H01L21/67121 ,  H01L21/67259 ,  H01L21/68707 ,  G05B2219/43149 ,  G05B2219/50391

Abstract: Methods, apparatuses and systems in an integrated bonding system for optimizing bonding alignment between dies and a substrates include bonding, using a bonder of the integrated bonding system, a first die to a first substrate using preset alignment settings, transferring, using a transfer arm/robot of the integrated bonding system, the bonded die-substrate combination to an on-board inspection tool of the integrated bonding system, inspecting, at the on-board inspection tool, an alignment of the bond between the die and the substrate of the bonded die-substrate combination to determine a misalignment measure representing a misalignment of the bond between the die and the substrate of the bonded die-substrate combination, determining from the misalignment measurement, using a machine learning process, a correction measurement to be communicated to the bonder, and bonding, in the bonder, a different die to a different substrate using the determined machine-learning based correction measurement.

公开(公告)号：US20180166497A1

公开(公告)日：2018-06-14

申请号：US15835359

申请日：2017-12-07

Applicant: ams AG

Inventor： Alexandre De Kerckhove

IPC: H01L27/146 ,  H01L21/56 ,  H01L27/32 ,  H01L21/67

CPC classification number: H01L27/14687 ,  H01L21/565 ,  H01L21/67121 ,  H01L27/14618 ,  H01L27/14683 ,  H01L27/3255

Abstract: A method to produce a ruggedized package (1) of an image sensor comprises a step of producing a plurality of image sensors (100a, . . . , 100n), a step (S3, S4) of providing a supporting substrate (10) and placing the plurality of the image sensors (100a, . . . , 100n) on the supporting substrate (10) such that the image sensors (100a, . . . , 100n) are located spaced apart from each other on the supporting substrate (10), a step (S5) of filling a spacing (20) between the image sensors (100a, . . . , 100n) on the supporting substrate (10) with a molding material (200), a step (S6) of delaminating the arrangement of the plurality of the image sensors (100a, . . . , 100n) from the supporting substrate (10), and a step (S7) of singularizing the arrangement of the plurality of the image sensors (100a, . . . , 100n) such that each image sensor (100a, . . . , 100n) is surrounded by the molding material (200).

公开(公告)号：US20170229330A1

公开(公告)日：2017-08-10

申请号：US15519190

申请日：2015-10-16

Applicant: Rensselaer Polytechnic Institute

Inventor： Anton Tkachenko ,  James Jian-qiang Lu

IPC: H01L21/67 ,  H02K1/27 ,  H02N15/00 ,  H01L21/68 ,  H01L21/82 ,  B23P19/033 ,  B23P19/04 ,  B23P19/10 ,  H01F1/057 ,  H01F1/055 ,  H01F7/02 ,  H01F7/127 ,  H01L21/02 ,  H02N15/04 ,  H01F1/12 ,  H02K1/06

CPC classification number: H01L21/67121 ,  B23P19/033 ,  B23P19/04 ,  B23P19/107 ,  B81C3/005 ,  B81C2203/057 ,  H01F1/0018 ,  H01F1/055 ,  H01F1/057 ,  H01F1/12 ,  H01F7/0236 ,  H01F7/0247 ,  H01F7/127 ,  H01L21/02104 ,  H01L21/68 ,  H01L21/82 ,  H02K1/06 ,  H02K1/2753 ,  H02N15/00 ,  H02N15/04

Abstract: Embodiments of the invention relate generally to directed self-assembly (DSA) and, more particularly, to the DSA of electronic components using diamagnetic levitation.

公开(公告)号：US20150069213A1

公开(公告)日：2015-03-12

申请号：US14482575

申请日：2014-09-10

Applicant: Mossey Creek Solar, LLC

Inventor： John Carberry

IPC: H01L21/67 ,  H01L31/18

CPC classification number: H01L31/18 ,  B05D1/12 ,  B05D3/0281 ,  B05D5/12 ,  C30B29/06 ,  C30B29/34 ,  C30B33/02 ,  C30B35/002 ,  H01L21/67 ,  H01L21/67005 ,  H01L21/67098 ,  H01L21/67115 ,  H01L21/67121 ,  H01L21/673 ,  H01L31/1804 ,  H01L31/182 ,  H01L31/1824 ,  H01L31/20 ,  H01L31/202 ,  H01L31/208

Abstract: A tool useful in the manufacture of a semiconductor is disclosed. A mold is providing having an interior defining a planar capillary space. A coating substantially covers at least the planar capillary space of the graphite member. The coating is substantially non-reactive to silicon at temperatures greater than approximately 1420 degrees Centigrade.

Abstract translation: 公开了一种可用于制造半导体的工具。 提供具有限定平面毛细管空间的内部的模具。 涂层基本上覆盖至少石墨构件的平面毛细管空间。 涂层在大于约1420摄氏度的温度下基本上不与硅反应。

公开(公告)号：US20140206122A1

公开(公告)日：2014-07-24

申请号：US14157382

申请日：2014-01-16

Applicant: Microchip Technology Incorporated

Inventor： Joseph D. Fernandez ,  Sombat Kittiphinijnanta ,  Nutthiwut Yamputchong ,  Surachai Lertruttanaprecha ,  Viwat Maikuthavorn

IPC: H01L21/56 ,  H01L21/67 ,  H01L23/00

CPC classification number: B29C45/2628 ,  B29L2031/3481 ,  B81B7/0058 ,  H01L21/565 ,  H01L21/67121 ,  H01L23/564 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/1815 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A method for manufacturing open cavity integrated circuit packages, the method comprising: placing a wire-bound integrated circuit in a mold; forcing a pin to contact a die of the wire-bound integrated circuit by applying a force between the pin and the mold; injecting plastic into the mold; allowing the plastic to set around the integrated circuit to form a package having an open cavity defined by the pin; and removing the open cavity integrated circuit package from the mold. A mold for forming a package for an integrated circuit sensor device, comprising: a bottom part for supporting an integrated circuit die; a top part that is operable to be placed on top of said bottom part to form a cavity into which a plastic material can be injected to form the package, wherein the top part of the mold comprises a spring-loaded pin arrangement comprising a cover that covers a sensor area on the integrated circuit die and provides for an opening when the plastic material is injected.

Abstract translation: 一种制造开放式集成电路封装的方法，所述方法包括：将有线集成电路放置在模具中; 通过在销和模具之间施加力来迫使销与有线集成电路的管芯接触; 将塑料注入模具; 允许塑料围绕集成电路设置以形成具有由销限定的开放空腔的封装; 并从模具中移除开放式集成电路封装。 一种用于形成用于集成电路传感器装置的封装的模具，包括：用于支撑集成电路管芯的底部; 顶部，其可操作地放置在所述底部的顶部上以形成空腔，塑料材料可以注入其中以形成所述包装，所述模具的顶部包括弹簧加载销装置，所述弹簧加载销装置包括盖， 覆盖集成电路芯片上的传感器区域，并在塑料材料注入时提供开口。

公开(公告)号：US20120294967A1

公开(公告)日：2012-11-22

申请号：US13437938

申请日：2012-04-03

Applicant: Ching-Huang Lin ,  Rong-Chang Liang ,  Pei-Chang Tsai

Inventor： Ching-Huang Lin ,  Rong-Chang Liang ,  Pei-Chang Tsai

IPC: B29C39/00 ,  B05C9/12 ,  B29C45/72 ,  B29C35/08 ,  B29C45/03

CPC classification number: H01L21/67138 ,  B29C39/18 ,  H01L21/67121 ,  H01L31/0504 ,  H01L31/0512 ,  Y02E10/50

Abstract: A machine for manufacturing an electrode tape is disclosed. The machine includes a conveyor, a conductive structure coil, an adhesive material supply unit and a curing unit. The conveyor includes a molding belt with at least one groove and a roller used to drive the molding belt. The conductive structure coil is adapted to provide a conductive structure to the at least one groove of the molding belt. The adhesive material supply unit is adapted to provide an adhesive material to a surface of the molding belt. The curing unit is adapted to cure the adhesive material provided on the surface of the molding belt into a film.

Abstract translation: 公开了一种用于制造电极带的机器。 该机器包括输送机，导电结构线圈，粘合材料供应单元和固化单元。 输送机包括具有至少一个凹槽和用于驱动模制带的滚筒的模制带。 导电结构线圈适于向模制带的至少一个凹槽提供导电结构。 粘合材料供应单元适于向模制带的表面提供粘合剂材料。 固化单元适于将设置在成型带表面上的粘合剂材料固化成膜。

公开(公告)号：US20090300903A1

公开(公告)日：2009-12-10

申请号：US12406044

申请日：2009-03-17

Applicant: GUANG YANG

Inventor： GUANG YANG

IPC: B23P15/26

CPC classification number: H01L21/50 ,  H01L21/67121 ,  Y10T29/53113

Abstract: A mounting apparatus is used for mounting a heat sink on a main board. The mounting apparatus includes a base, a load-supporting unit mounted on the base, a rack mounted on the base, and a pressing means movably mounted on the rack. The load-supporting unit includes a supporting means for supporting the main board, a first positioning means for positioning the main board, and a second positioning means for positioning the heat sink. The pressing means is used for pressing the heat sink.

Abstract translation: 安装装置用于将散热器安装在主板上。 安装装置包括基座，安装在基座上的负载支撑单元，安装在基座上的机架以及可移动地安装在机架上的按压装置。 负载支撑单元包括用于支撑主板的支撑装置，用于定位主板的第一定位装置和用于定位散热器的第二定位装置。 按压装置用于按压散热器。