公开(公告)号：US20150069213A1

公开(公告)日：2015-03-12

申请号：US14482575

申请日：2014-09-10

Applicant: Mossey Creek Solar, LLC

Inventor： John Carberry

IPC: H01L21/67 ,  H01L31/18

CPC classification number: H01L31/18 ,  B05D1/12 ,  B05D3/0281 ,  B05D5/12 ,  C30B29/06 ,  C30B29/34 ,  C30B33/02 ,  C30B35/002 ,  H01L21/67 ,  H01L21/67005 ,  H01L21/67098 ,  H01L21/67115 ,  H01L21/67121 ,  H01L21/673 ,  H01L31/1804 ,  H01L31/182 ,  H01L31/1824 ,  H01L31/20 ,  H01L31/202 ,  H01L31/208

Abstract: A tool useful in the manufacture of a semiconductor is disclosed. A mold is providing having an interior defining a planar capillary space. A coating substantially covers at least the planar capillary space of the graphite member. The coating is substantially non-reactive to silicon at temperatures greater than approximately 1420 degrees Centigrade.

Abstract translation: 公开了一种可用于制造半导体的工具。 提供具有限定平面毛细管空间的内部的模具。 涂层基本上覆盖至少石墨构件的平面毛细管空间。 涂层在大于约1420摄氏度的温度下基本上不与硅反应。

公开(公告)号：US20130125949A1

公开(公告)日：2013-05-23

申请号：US13683659

申请日：2012-11-21

Applicant: Mossey Creek Solar, LLC

Inventor： John Carberry

IPC: H01L35/32 ,  H01L35/14

CPC classification number: H01L35/32 ,  H01L35/14 ,  H01L35/22

Abstract: A thermoelectric semiconducting assembly. Two parallel plates, a first plate and a second plate, are spaced apart. A plurality of pellets are fitted into said first plate and into said second plate, each said pellet comprising a body, a first cap, and a second cap, said body including a silicon material, said first cap and said second cap including an electrically resistive ceramic material, each pellet in said second plate being connected to a pellet in said first plate. Each pellet includes a doped body, wherein half of said pellets are doped with a p-type dopant to form a p-type pellet and half of said pellets are doped with an n-type dopant to form an n-type pellet. Each plate includes p-type pellets and n-type pellets in an alternating pattern, and each p-type pellet in said first plate connects with an n-type pellet in said second plate, and wherein each n-type pellet in said first plate connects with a p-type pellet in said second plate.

Abstract translation: 热电半导体组件。 两个平行的板，第一板和第二板分开。 多个颗粒装配到所述第一板中并进入所述第二板，每个所述颗粒包括主体，第一盖和第二盖，所述主体包括硅材料，所述第一盖和所述第二盖包括电阻 陶瓷材料，所述第二板中的每个颗粒与所述第一板中的颗粒连接。 每个颗粒包括掺杂体，其中一半的所述颗粒掺杂有p型掺杂剂以形成p型颗粒，并且一半所述颗粒掺杂有n型掺杂剂以形成n型颗粒。 每个板包括交替图案的p型颗粒和n型颗粒，并且所述第一板中的每个p型颗粒与所述第二板中的n型颗粒连接，并且其中在所述第一板中的每个n型颗粒 与所述第二板中的p型颗粒连接。

公开(公告)号：US20140306368A1

公开(公告)日：2014-10-16

申请号：US14253514

申请日：2014-04-15

Applicant: Mossey Creek Solar, LLC

Inventor： John Carberry

IPC: H01L21/02

CPC classification number: B29C51/36 ,  C30B11/002 ,  C30B29/06 ,  C30B29/64 ,  H01L21/02035 ,  H01L31/1804 ,  Y02E10/547 ,  Y02P70/521

Abstract: A method of manufacturing a semiconductor includes providing a mold defining a planar capillary space; placing a measure of precursor in fluid communication with the capillary space; creating a vacuum around the mold and within the planar capillary space; melting the precursor; allowing the melted precursor to flow into the capillary space; and cooling the melted precursor within the mold such that the precursor forms a semiconductor, the operations of melting the precursor, allowing the precursor to flow into the capillary space, and cooling the melted precursor occurring in the vacuum.

Abstract translation: 制造半导体的方法包括提供限定平面毛细管空间的模具; 将前体的测量物质与毛细管空间流体连通; 在模具周围和平面毛细管空间内产生真空; 熔化前体; 使熔融的前体流入毛细管空间; 并且在模具内冷却熔融的前体，使得前体形成半导体，熔化前体，允许前体流入毛细管空间以及冷却在真空中发生的熔融前体的操作。

公开(公告)号：US20140305478A1

公开(公告)日：2014-10-16

申请号：US14253524

申请日：2014-04-15

Applicant: Mossey Creek Solar, LLC

Inventor： John Carberry

IPC: H01L35/34 ,  H01L35/22

CPC classification number: H01L35/22 ,  H01L35/34

Abstract: A thermoelectric material to exploit a unidirectional thermal gradient for the production of electrical power, comprising a body fabricated from milled silicon alloyed with a dopant and sintered at a temperature below the melting point of silicon.

Abstract translation: 一种利用用于生产电力的单向热梯度的热电材料，包括由与掺杂剂合金化的碾磨的硅制成的主体，并在低于硅的熔点的温度下烧结。

公开(公告)号：US20130310487A1

公开(公告)日：2013-11-21

申请号：US13667655

申请日：2012-11-02

Applicant: Mossey Creek Solar, LLC

Inventor： John Carberry ,  Andrew A. Wereszczak

IPC: C08K3/34

CPC classification number: C08K3/34 ,  C08K3/08 ,  C08K9/02 ,  C08K2003/023 ,  C08L63/00

Abstract: Thermally conductive, electrically insulating epoxy molding compounds that use milled silicon as a filler material, and methods and processes for making the same. Some example embodiments of the present invention comprise the use of a passivation agent, for example ethyl silicate, to deposit a thin layer of glass on the surfaces of the powders as the powders are milled, creating an attractive surface dielectric property on these surfaces.

Abstract translation: 使用研磨硅作为填充材料的导热，电绝缘环氧树脂模塑料及其制备方法和方法。 本发明的一些示例性实施方案包括使用钝化剂，例如硅酸乙酯，当粉末被研磨时，在粉末的表面上沉积薄的玻璃层，从而在这些表面上产生有吸引力的表面介电性质。