公开(公告)号：US20130310487A1

公开(公告)日：2013-11-21

申请号：US13667655

申请日：2012-11-02

Applicant: Mossey Creek Solar, LLC

Inventor： John Carberry ,  Andrew A. Wereszczak

IPC: C08K3/34

CPC classification number: C08K3/34 ,  C08K3/08 ,  C08K9/02 ,  C08K2003/023 ,  C08L63/00

Abstract: Thermally conductive, electrically insulating epoxy molding compounds that use milled silicon as a filler material, and methods and processes for making the same. Some example embodiments of the present invention comprise the use of a passivation agent, for example ethyl silicate, to deposit a thin layer of glass on the surfaces of the powders as the powders are milled, creating an attractive surface dielectric property on these surfaces.

Abstract translation: 使用研磨硅作为填充材料的导热，电绝缘环氧树脂模塑料及其制备方法和方法。 本发明的一些示例性实施方案包括使用钝化剂，例如硅酸乙酯，当粉末被研磨时，在粉末的表面上沉积薄的玻璃层，从而在这些表面上产生有吸引力的表面介电性质。