公开(公告)号：US08015704B2

公开(公告)日：2011-09-13

申请号：US11667066

申请日：2005-11-25

申请人： Masaki Kawamura ,  Hideki Okumura

发明人： Masaki Kawamura ,  Hideki Okumura

IPC分类号： B21D53/84

CPC分类号： F16C7/023 ,  B23D31/003 ,  B23Q11/0046 ,  F16C9/045 ,  F16C2322/39 ,  Y10S29/046 ,  Y10T29/49288 ,  Y10T29/49796 ,  Y10T29/49822 ,  Y10T29/53535

摘要： A method and a device for removing the chips of a connecting rod. The large end part of the connecting rod is placed on the step part of a pedestal, and the small end part thereof is placed on a pedestal formed of a vibration damping material. An air vibrator is energized to continuously supply compressed air to vibrate the large end part together with the pedestal until the vibrated large end part is brought into contact with a contact plate member. When chips fall from the rod body and the cap part of the connecting rod, the chips are collected to a transparent collection bag through a suction hose by a dust collector. The operations above are performed in a sound isolation box closed by a cover member. Then, the chips are separated from the broken-out sections of the rod body and the cap part by using, for example, a brush.

摘要翻译： 一种用于去除连杆的芯片的方法和装置。 连杆的大端部被放置在基座的台阶上，其小端部被放置在由减振材料形成的基座上。 空气振动器被通电以连续地供应压缩空气，以使大端部与基座一起振动，直到振动的大端部与接触板构件接触。 当碎片从杆体和连杆的盖部分落下时，碎屑通过抽吸软管被集尘器收集到透明收集袋中。 上述操作在由盖构件封闭的隔音箱中进行。 然后，通过使用例如电刷将芯片与棒体和帽部的断开部分分离。

公开(公告)号：US20080209708A1

公开(公告)日：2008-09-04

申请号：US11667066

申请日：2005-11-25

申请人： Masaki Kawamura ,  Hideki Okumura

发明人： Masaki Kawamura ,  Hideki Okumura

IPC分类号： B23P19/00

CPC分类号： F16C7/023 ,  B23D31/003 ,  B23Q11/0046 ,  F16C9/045 ,  F16C2322/39 ,  Y10S29/046 ,  Y10T29/49288 ,  Y10T29/49796 ,  Y10T29/49822 ,  Y10T29/53535

摘要： A method and a device for removing the chips of a connecting rod. The large end part of the connecting rod is placed on the step part of a pedestal, and the small end part thereof is placed on a pedestal formed of a vibration damping material. An air vibrator is energized to continuously supply compressed air to vibrate the large end part together with the pedestal until the vibrated large end part is brought into contact with a contact plate member. When chips fall from the rod body and the cap part of the connecting rod, the chips are collected to a transparent collection bag through a suction hose by a dust collector. The operations above are performed in a sound isolation box closed by a cover member. Then, the chips are separated from the broken-out sections of the rod body and the cap part by using, for example, a brush.

摘要翻译： 一种用于去除连杆的芯片的方法和装置。 连杆的大端部被放置在基座的台阶上，其小端部被放置在由减振材料形成的基座上。 空气振动器被通电以连续地供应压缩空气，以使大端部与基座一起振动，直到振动的大端部与接触板构件接触。 当碎片从杆体和连杆的盖部分落下时，碎屑通过抽吸软管被集尘器收集到透明收集袋中。 上述操作在由盖构件封闭的隔音箱中进行。 然后，通过使用例如电刷将芯片与棒体和帽部的断开部分分离。

公开(公告)号：US20080209705A1

公开(公告)日：2008-09-04

申请号：US12071473

申请日：2008-02-21

申请人： Hiroichi Hase

发明人： Hiroichi Hase

IPC分类号： B23P6/04 ,  B21D53/84

CPC分类号： F16C9/045 ,  B23D31/003 ,  B23P15/00 ,  B23P2700/04 ,  Y10S29/046 ,  Y10T29/49288 ,  Y10T29/4929 ,  Y10T29/49718 ,  Y10T29/49796 ,  Y10T29/53535

摘要： A fracture surface treatment method of a fractured ductile metal part for treating fracture surfaces 51a and 52a of the ductile metal part 50, said fracture surfaces 51a and 52a being fracture surfaces obtained by a fracturing operation of fitting halved mandrel portions into a penetrative bore of the ductile metal part having the penetrative bore and driving a wedge in between the halved mandrel portions, said fracture surface treatment method holding said fractured ductile metal part 50 in a state where said fracture surfaces 51a and 52a are separated from each other so as to keep a certain space between them, applying a specified vibration to at least one of said fractured ductile metal part portions in a direction intersecting the direction of fracture and removing fracture powder 59 stuck on said fracture surfaces 51a and 52a, and thereby enabling the optimum face fitting operation in case of fitting again the fracture surfaces of the fractured ductile metal part to each other.

摘要翻译： 用于处理延性金属部分50的断裂面51a和52a的断裂韧性金属部件的断裂表面处理方法，所述断裂面51a和52a是通过将半个心轴部分嵌入到 具有穿透孔的延性金属部分的穿透孔并且在半心轴部分之间驱动楔形物，所述断裂表面处理方法将所述断裂韧性金属部分50保持在所述断裂面51a和52a分开的状态 另一方面在它们之间保持一定的间隔，在与断裂方向相交的方向上对所述断裂的延性金属部分中的至少一个施加指定的振动，并且去除粘附在所述断裂面51a和52a上的断裂粉末59， 从而能够在将断裂的延性金属部件的断裂面再次配合到每个面的情况下进行最佳的面部装配操作 其他。

公开(公告)号：US06543136B1

公开(公告)日：2003-04-08

申请号：US09606409

申请日：2000-06-29

申请人： James Robert Parish

发明人： James Robert Parish

IPC分类号： B21K124

CPC分类号： F02M61/168 ,  B21K1/24 ,  Y10S29/046 ,  Y10S72/71 ,  Y10T29/47 ,  Y10T29/49306 ,  Y10T29/49409 ,  Y10T29/49412 ,  Y10T29/49426 ,  Y10T29/5116 ,  Y10T29/53535

摘要： A method for making a valve assembly is disclosed. The method includes providing a first work piece having a longitudinal axis and a first end and providing a second work piece having a surface. The method also includes disposing the first work piece and the second work piece axially between a pair of aligned elements that are relatively movable toward and away from each other along the longitudinal axis of the first work piece. Additionally, the method includes relatively moving the pair of aligned elements toward each other to axially clamp the first work piece and the second work piece and actuating the pair of aligned elements and delivering to the first work piece and the second work piece a controlled clamping force that acts to coin a zone of surface contact between the first end and the surface. Further, the method includes repeating the actuating of the pair of elements a plurality of times. An apparatus used to perform the method is also disclosed.

摘要翻译： 公开了一种制造阀组件的方法。 该方法包括提供具有纵向轴线和第一端部并且提供具有表面的第二工件的第一工件。 该方法还包括将第一工件和第二工件轴向地布置在沿着第一工件的纵向轴线相对移动并相互移动的一对对准元件之间。 另外，该方法包括使一对对齐的元件朝向彼此相对移动以轴向夹紧第一工件和第二工件并且致动该对对准的元件并且将第一工件和第二工件传递到受控的夹紧力 其作用是使第一端和表面之间的表面接触区域硬化。 此外，该方法包括重复该对元件的致动多次。 还公开了用于执行该方法的装置。

公开(公告)号：US5355577A

公开(公告)日：1994-10-18

申请号：US902986

申请日：1992-06-23

申请人： Michael B. Cohn

发明人： Michael B. Cohn

IPC分类号： H01S5/022 ,  H05K13/02 ,  H05K13/04 ,  H01S4/00 ,  B23P19/00

CPC分类号： B82Y30/00 ,  B81C3/005 ,  H01L24/24 ,  H01L24/82 ,  H01L24/95 ,  H02K99/00 ,  H05K13/028 ,  H05K13/0482 ,  B81C2203/054 ,  B81C2203/058 ,  H01L2224/24051 ,  H01L2224/24226 ,  H01L2224/95085 ,  H01L2224/95122 ,  H01L2224/95136 ,  H01L2224/95144 ,  H01L2224/95145 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/1306 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30105 ,  Y10S29/046 ,  Y10T29/49002 ,  Y10T29/4913 ,  Y10T29/5313 ,  Y10T29/53196

摘要： Abstract: A method of rapidly assembling many discrete microelectronic or micro-mechanical devices 56 (FIG. 2 ) in a precise configuration (FIG. 8f). The devices are placed randomly on a template (FIG. 3 ) consisting of a pair of oppositely charged planar electrodes. The upper electrode contains a multiplicity of apertures. The template is vibrated and the devices are attracted to the apertures and trapped thereat. The shape of a given aperture determines the number, orientation, and type of device that it traps. The process is completed by mechanically and electrically connecting the devices. The present method for serf-assembly allows many sub-millimeter sized electronic components or other particles to be rapidly assembled into a predetermined configuration. The method relies on vibration and weak electrical or magnetic forces.

摘要翻译： 摘要：一种以精确配置（图8f）快速组装许多分立微电子或微机械装置56（图2）的方法。 将器件随机放置在由一对相对带电的平面电极组成的模板（图3）上。 上电极包含多个孔。 模板被振动，并且装置被吸引到孔并被捕获在其上。 给定孔径的形状决定了其捕获的设备的数量，方向和类型。 该过程通过机械和电气连接装置完成。 本发明的伺服组装方法允许许多亚毫米尺寸的电子部件或其它颗粒快速组装成预定的构型。 该方法依赖于振动和弱电或磁力。

公开(公告)号：US4993098A

公开(公告)日：1991-02-19

申请号：US427112

申请日：1989-10-18

申请人： Vladimir D. Kharitonov ,  Vadim Y. Granovsky ,  Pavel V. Kuznetsov ,  Alexandr P. Odnoral ,  Anatoly V. Voronov

发明人： Vladimir D. Kharitonov ,  Vadim Y. Granovsky ,  Pavel V. Kuznetsov ,  Alexandr P. Odnoral ,  Anatoly V. Voronov

IPC分类号： B06B1/04 ,  B08B7/02 ,  B08B9/02 ,  B65D88/66 ,  F28G7/00

CPC分类号： B08B9/027 ,  B06B1/04 ,  B08B7/02 ,  B65D88/66 ,  F28G7/00 ,  B08B2209/005 ,  Y10S29/046

摘要： The apparatus for vibratory cleaning the surface of an article from foreign matter, comprising at least one exciter (1) of mechanical pulses, including an electromagnetic inductor (2) with a plate (3), a frame (7) and at least one striking surface to be cleaned in an area or areas of the most probable location of the foreign matter, fixedly mounted on the frame (7). Each electromagnetic inductor (2) with the plate (3) closely adjoining this inductor (2) is fixedly mounted on the frame (7).

摘要翻译： PCT No.PCT / SU88 / 00041 Sec。 371日期：1989年10月18日 102（e）日期1989年10月18日PCT提交1988年2月19日PCT公布。 出版物WO89 / 07492 日本1989年8月24日。用于从异物振动清洁制品表面的装置，包括至少一个机械脉冲激励器（1），包括具有板（3）的电磁感应器（2），框架 7）和至少一个待清洁的打击表面，固定地安装在框架（7）上的异物的最可能位置的一个或多个区域中。 具有与该电感器（2）紧密邻接的板（3）的每个电磁感应器（2）固定地安装在框架（7）上。

公开(公告)号：US3859876A

公开(公告)日：1975-01-14

申请号：US37185573

申请日：1973-06-20

申请人： CITIZEN WATCH CO LTD

发明人： SHIMIZU MASAMI ,  JINDAI AKIO

IPC分类号： B23B1/00 ,  B23B29/12 ,  B23B29/04

CPC分类号： B23B29/125 ,  Y10S29/046 ,  Y10S82/904 ,  Y10T82/2585

摘要： A cutting device for an ultrasonic vibration system comprises an elongated tool having a cutting edge formed on the front end thereof, and a torsional transducer attached to the tool body at a nodal point of vibration thereof, as well as, if necessary, an amplifier horn is positioned between the tool body and transducer, so that the torsional transducer serves to apply an elastic vibration to the tool body.

摘要翻译： 一种用于超声波振动系统的切割装置包括：细长工具，其具有形成在其前端上的切割刃，以及扭转传感器，其在其振动节点处附接到工具主体，以及如果需要的话，放大器喇叭 位于工具主体和换能器之间，使得扭转传感器用于向工具主体施加弹性振动。

公开(公告)号：US3838490A

公开(公告)日：1974-10-01

申请号：US32794873

申请日：1973-01-30

申请人： CO GENERAL D ELECTRO CERAMIQUE

发明人： WILLEM M

IPC分类号： B01F11/00 ,  B28B17/02 ,  H01B19/00 ,  H05K13/00

CPC分类号： H01B19/00 ,  B01F11/0068 ,  B28B17/02 ,  Y10S29/046 ,  Y10T29/53265

摘要： Apparatus for the assembly of insulators including a dielectric body and a cap fitting over a crown protruding from the body, the apparatus comprising a frame, first support means fixed with the frame to support the dielectric body, means to releasably hold the dielectric body to the first support, a second support for support of the cap, means mounting the second support for translation from a lowered position to an elevated position in which the cap is emplaced over and about the crown of the body, power operated means for moving the second support from its lowered to its upper position, and vibrator means coupled to the frame to impart vibrations thereto.

摘要翻译： 用于组装绝缘体的装置，包括绝缘体和帽，配合在从主体突出的冠部上，该装置包括框架，固定在框架上以支撑电介质体的第一支撑装置，用于可释放地将电介质体保持在 第一支撑件，用于支撑盖子的第二支撑件意味着将第二支撑件从降低的位置安装到升高位置，其中盖子放置在身体的顶部上并围绕身体的冠部，用于移动第二支撑件的动力操作装置 从其下降到其上部位置，以及耦合到框架以向其施加振动的振动器装置。

公开(公告)号：US3812569A

公开(公告)日：1974-05-28

申请号：US33336073

申请日：1973-02-16

申请人： MOLEX INC

发明人： KUFNER K ,  PELLEGRINO T ,  CHMELA F

IPC分类号： H01R43/20 ,  H05K13/04

CPC分类号： H01R43/205 ,  H05K13/0478 ,  Y10S29/046 ,  Y10T29/49147 ,  Y10T29/49895 ,  Y10T29/53174 ,  Y10T29/53435 ,  Y10T29/53535

摘要： Terminal pins are mounted with a force fit into holes in a circuit board. The circuit board is placed over a backing plate having holes aligned with the circuit board holes and of large enough cross section freely to receive a terminal pin. A loading plate is placed over the circuit board and has holes each sized slidingly to receive a single terminal pin. A feeding plate having a thickness at least approximately equal to the terminal pin length is placed over the loading plate, and the feeding plate has holes of a diameter larger than about one-third of the terminal pin length. A number of terminal pins are placed on the upper surface of the feeding plate, and the feeding plate, loading plate, circuit board and backing plate are all vibrated. During the vibration a group of terminal pins are loaded into each feeding plate hole, and a single terminal pin is loaded into each loading plate hole. The feeding plate is removed from the loading plate and the excess pins are removed leaving a single terminal pin in each loading plate hole. The terminal pins are then pressed through the loading plate into the circuit board.

摘要翻译： 端子插脚以电压安装在电路板上的孔中。 电路板放置在具有与电路板孔对准的孔的背板上，并且具有足够大的横截面以自由地接收端子销。 装载板放置在电路板上，并且具有各自的尺寸滑动地容纳单个端子销的孔。 具有至少近似等于端子销长度的厚度的馈电板放置在装载板上方，并且馈电板具有直径大于端子引脚长度的大约三分之一的孔。 馈电板的上表面放置有多个端子销，馈电板，装载板，电路板和背板均振动。 在振动期间，一组端子针被装载到每个馈送板孔中，并且单个端子销装载到每个装载板孔中。 进料板从装载板上取出，多余的销被移除，留下每个装载板孔中的一个端子销。 然后将端子销通过装载板压入电路板。

公开(公告)号：US3729796A

公开(公告)日：1973-05-01

申请号：US3729796D

申请日：1971-07-26

申请人： AMPEX

发明人： SELL V ,  ALVI S

IPC分类号： G11C5/04 ,  H05K13/04 ,  H01R43/00

CPC分类号： G11C5/04 ,  Y10S29/046 ,  Y10T29/53165 ,  Y10T29/53191 ,  Y10T29/53265

摘要： A core assembly fixture for small toroidal magnetic memory cores includes a cavity plate, a partial vacuum generator connected to maintain a partial vacuum on a bottom side of the cavity plate and a vibrator connected to vibrate the cavity plate. A plurality of contoured core receiving cavities are located on the top side of the cavity with a proper orientation for holding magnetic cores in a desired matrix pattern prior to transfer to a substrate for subsequent wiring. The contoured cavities generally conform to the shape of a core, thereby increasing the amount of material in the cavity plate and permitting very thin separator walls between cavities without damage from vibration. The cavity plate construction is laminated in a fashion enabling manufacture with conventional etching techniques.

摘要翻译： 用于小环形磁存储器芯的芯组件夹具包括腔板，部分真空发生器，其连接以在腔板的底侧上保持部分真空，以及振动器，其连接以振动腔板。 多个成形的芯部容纳腔位于空腔的顶侧，具有适当的取向，用于在转移到衬底之前将磁芯保持在期望的矩阵图案以用于随后的布线。 轮廓空腔通常符合芯的形状，从而增加空腔板中的材料的数量，并允许空腔之间非常薄的隔板壁，而不会受到振动的损害。 空腔板结构以能够利用常规蚀刻技术制造的方式层压。