公开(公告)号：US20180047701A1

公开(公告)日：2018-02-15

申请号：US15790749

申请日：2017-10-23

申请人： TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.

发明人： ALEXANDER KALNITSKY ,  YI-YANG LEI ,  HSI-CHING WANG ,  CHENG-YU KUO ,  TSUNG LUNG HUANG ,  CHING-HUA HSIEH ,  CHUNG-SHI LIU ,  CHEN-HUA YU ,  CHIN-YU KU ,  DE-DUI LIAO ,  KUO-CHIO LIU ,  KAI-DI WU ,  KUO-PIN CHANG ,  SHENG-PIN YANG ,  ISAAC HUANG

IPC分类号： H01L23/00 ,  H01L21/78

CPC分类号： H01L24/83 ,  H01L21/6835 ,  H01L21/78 ,  H01L24/03 ,  H01L24/73 ,  H01L24/92 ,  H01L24/94 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2224/03002 ,  H01L2224/0401 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/06181 ,  H01L2224/131 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/2919 ,  H01L2224/73204 ,  H01L2224/83201 ,  H01L2224/8385 ,  H01L2224/921 ,  H01L2224/94 ,  H01L2924/06 ,  H01L2924/07025 ,  H01L2224/03 ,  H01L2924/00014 ,  H01L2924/014

摘要： A method of manufacturing a semiconductor structure, including receiving a first substrate including a plurality of conductive bumps disposed over the first substrate; receiving a second substrate; disposing an adhesive over the first substrate; removing a portion of the adhesive to expose at least one of the plurality of conductive bumps; and bonding the first substrate with the second substrate.

公开(公告)号：US20120021563A1

公开(公告)日：2012-01-26

申请号：US13258664

申请日：2010-03-10

申请人： Mitsumasa Koyanagi ,  Takafumi Fukushima ,  Masahiko Sugiyama

发明人： Mitsumasa Koyanagi ,  Takafumi Fukushima ,  Masahiko Sugiyama

IPC分类号： H01L21/50 ,  B32B37/14 ,  B32B38/00 ,  B32B37/12

CPC分类号： H01L21/50 ,  H01L21/6835 ,  H01L21/76898 ,  H01L23/13 ,  H01L23/481 ,  H01L24/11 ,  H01L24/13 ,  H01L24/95 ,  H01L25/0657 ,  H01L25/18 ,  H01L25/50 ,  H01L29/0657 ,  H01L2221/68318 ,  H01L2221/6834 ,  H01L2221/68354 ,  H01L2221/68368 ,  H01L2224/0401 ,  H01L2224/05008 ,  H01L2224/05009 ,  H01L2224/06182 ,  H01L2224/13009 ,  H01L2224/13025 ,  H01L2224/13099 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13184 ,  H01L2224/1403 ,  H01L2224/14181 ,  H01L2224/81193 ,  H01L2224/81801 ,  H01L2224/83002 ,  H01L2224/83005 ,  H01L2224/83143 ,  H01L2224/83193 ,  H01L2224/83896 ,  H01L2224/921 ,  H01L2224/95001 ,  H01L2224/95146 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/0001 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/15788 ,  Y10T156/1798 ,  H01L2924/00014 ,  H01L2924/00

摘要： There is provided a three-dimensional integrated circuit manufacturing method for temporarily attaching a chip to a transcription substrate, and securely detaching the chip from the transcription substrate when the chip is transferred to a supporting substrate. When a chip is temporarily attached to a transcription substrate, by evaporating a liquid existing between the chip and the transcription substrate, the solids of the chip and the transcription substrate can be attached to each other. Accordingly, the chip can be temporarily attached to the transcription substrate so as not to be deviated from its own position. Further, by setting adhesive strength between the chip and a supporting substrate to be higher than that between the chip and the transcription substrate, the chip can be securely detached from the transcription substrate when the chip is transferred from the transcription substrate to the supporting substrate.

摘要翻译： 提供了一种用于将芯片临时附接到转录底物的三维集成电路制造方法，并且当芯片被转移到支撑衬底时，可靠地将芯片从转录衬底上分离。 当芯片临时连接到转录底物时，通过蒸发芯片和转录底物之间的液体，芯片和转录底物的固体可以彼此附着。 因此，芯片可以临时安装到转录基片上，以便不会偏离其本身的位置。 此外，通过将芯片和支撑基板之间的粘合强度设置为高于芯片和转录基板之间的粘合强度，当芯片从转录基板转移到支撑基板时，可以将芯片从转录基板上牢固地分离。

公开(公告)号：US20190115313A1

公开(公告)日：2019-04-18

申请号：US16229585

申请日：2018-12-21

申请人： TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.

发明人： ALEXANDER KALNITSKY ,  YI-YANG LEI ,  HSI-CHING WANG ,  CHENG-YU KUO ,  TSUNG LUNG HUANG ,  CHING-HUA HSIEH ,  CHUNG-SHI LIU ,  CHEN-HUA YU ,  CHIN-YU KU ,  DE-DUI LIAO ,  KUO-CHIO LIU ,  KAI-DI WU ,  KUO-PIN CHANG ,  SHENG-PIN YANG ,  ISAAC HUANG

IPC分类号： H01L23/00 ,  H01L21/78 ,  H01L21/683

CPC分类号： H01L24/83 ,  H01L21/6835 ,  H01L21/78 ,  H01L24/03 ,  H01L24/73 ,  H01L24/92 ,  H01L24/94 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2224/03002 ,  H01L2224/0401 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/06181 ,  H01L2224/131 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/2919 ,  H01L2224/73204 ,  H01L2224/83201 ,  H01L2224/8385 ,  H01L2224/921 ,  H01L2224/94 ,  H01L2924/06 ,  H01L2924/07025 ,  H01L2224/03 ,  H01L2924/00014 ,  H01L2924/014

摘要： A method of manufacturing a semiconductor structure includes receiving a first substrate including an IMD layer disposed over the first substrate and a plurality of conductive bumps disposed in the IMD layer; receiving a second substrate; disposing a patterned adhesive over the first substrate, wherein at least a portion of the IMD layer is exposed through the patterned adhesive; and bonding the first substrate with the second substrate, wherein a top surface of the at least portion of the IMD layer is exposed through the patterned adhesive after bonding the first substrate with the second substrate.

公开(公告)号：US20160365332A1

公开(公告)日：2016-12-15

申请号：US14738109

申请日：2015-06-12

申请人： TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.

发明人： ALEXANDER KALNITSKY ,  YI-YANG LEI ,  HSI-CHING WANG ,  CHENG-YU KUO ,  TSUNG LUNG HUANG ,  CHING-HUA HSIEH ,  CHUNG-SHI LIU ,  CHEN-HUA YU ,  CHIN-YU KU ,  DE-DUI LIAO ,  KUO-CHIO LIU ,  KAI-DI WU ,  KUO-PIN CHANG ,  SHENG-PIN YANG ,  ISAAC HUANG

IPC分类号： H01L23/00 ,  H01L21/78

CPC分类号： H01L24/83 ,  H01L21/6835 ,  H01L21/78 ,  H01L24/03 ,  H01L24/73 ,  H01L24/92 ,  H01L24/94 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2224/03002 ,  H01L2224/0401 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/06181 ,  H01L2224/131 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/2919 ,  H01L2224/73204 ,  H01L2224/83201 ,  H01L2224/8385 ,  H01L2224/921 ,  H01L2224/94 ,  H01L2924/06 ,  H01L2924/07025 ,  H01L2224/03 ,  H01L2924/00014 ,  H01L2924/014

摘要： A method of manufacturing a semiconductor structure, comprising: receiving a first substrate including a first surface, a second surface opposite to the first surface and a plurality of conductive bumps disposed over the first surface; receiving a second substrate; disposing an adhesive over the first substrate or the second substrate; heating the adhesive in a first ambiance; bonding the first substrate with the second substrate by applying a force of less than about 10,000N upon the first substrate or the second substrate and heating the adhesive in a second ambiance; and thinning down a thickness of the first substrate from the second surface.

摘要翻译： 一种制造半导体结构的方法，包括：接收包括第一表面，与第一表面相对的第二表面的第一基板和设置在第一表面上的多个导电凸块; 接收第二基板; 在所述第一基板或所述第二基板上设置粘合剂; 以第一种氛围加热粘合剂; 通过在第一基板或第二基板上施加小于约10,000N的力将第一基板与第二基板接合并以第二氛围加热粘合剂; 以及从所述第二表面减薄所述第一基板的厚度。

公开(公告)号：US09153460B2

公开(公告)日：2015-10-06

申请号：US14011218

申请日：2013-08-27

申请人： International Business Machines Corporation

发明人： Evan G. Colgan ,  Michael A. Gaynes ,  Jeffrey A. Zitz

IPC分类号： H01L23/00 ,  H01L21/50 ,  H01L23/433 ,  H01L23/31

CPC分类号： H01L21/50 ,  H01L23/3128 ,  H01L23/433 ,  H01L24/16 ,  H01L24/32 ,  H01L24/72 ,  H01L24/73 ,  H01L24/90 ,  H01L24/92 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73253 ,  H01L2224/81815 ,  H01L2224/83104 ,  H01L2224/83901 ,  H01L2224/921 ,  H01L2924/10253 ,  H01L2924/15787 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2224/83 ,  H01L2224/90 ,  H01L2924/014

摘要： An assembly process for a heatsink attachment module for a chip packaging apparatus is provided and includes attaching a semiconductor chip to a substrate to form a module subassembly, placing a load frame and shim in a fixture, dispensing adhesive to the load frame and loadably placing the module subassembly chip face down in the fixture.

摘要翻译： 提供了一种用于芯片封装设备的散热器连接模块的组装过程，包括将半导体芯片附接到基板以形成模块子组件，将负载框架和垫片放置在固定装置中，将粘合剂分配到负载框架并且可负载地将 模块组件芯片正面朝下。

公开(公告)号：US20120252166A1

公开(公告)日：2012-10-04

申请号：US13438482

申请日：2012-04-03

申请人： Tadashi KOYANAGI

发明人： Tadashi KOYANAGI

IPC分类号： H01L21/50

CPC分类号： H01L24/97 ,  H01L21/561 ,  H01L21/563 ,  H01L23/49816 ,  H01L24/75 ,  H01L24/92 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/13025 ,  H01L2224/14181 ,  H01L2224/16145 ,  H01L2224/16146 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73103 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/75251 ,  H01L2224/75252 ,  H01L2224/75305 ,  H01L2224/75744 ,  H01L2224/75745 ,  H01L2224/7598 ,  H01L2224/81193 ,  H01L2224/81203 ,  H01L2224/81903 ,  H01L2224/83191 ,  H01L2224/83203 ,  H01L2224/83862 ,  H01L2224/921 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06565 ,  H01L2225/06586 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/181 ,  H01L2224/81 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2924/00

摘要： A semiconductor device manufacturing method is provided. First and second semiconductor chips are prepared, including first and second electrodes on first and second surfaces respectively. The second semiconductor chip includes a third electrode on a third surface opposite to the second surface. The third electrode overlaps the second electrode. The second surface includes an electrode-free region that is free of any electrode. A sealing resin is applied on the first surface of the first semiconductor chip. A second surface of the first semiconductor chip is held by a bonding tool including a pressing surface and a supporting-portion projected from the pressing surface. The pressing surface is made into contact with the second electrode. The supporting-portion is arranged at a position facing the electrode-free region. The second semiconductor chip is stacked over the first semiconductor chip by the bonding tool to electrically connect the third electrode to the first electrode.

摘要翻译： 提供了一种半导体器件制造方法。 制备第一和第二半导体芯片，包括分别在第一和第二表面上的第一和第二电极。 第二半导体芯片包括与第二表面相对的第三表面上的第三电极。 第三电极与第二电极重叠。 第二表面包括没有任何电极的无电极区域。 在第一半导体芯片的第一表面上施加密封树脂。 第一半导体芯片的第二表面由包括按压表面和从按压表面突出的支撑部分的接合工具保持。 按压表面与第二电极接触。 支撑部配置在面向无电极区域的位置。 第二半导体芯片通过接合工具堆叠在第一半导体芯片上，以将第三电极电连接到第一电极。

公开(公告)号：US08703533B2

公开(公告)日：2014-04-22

申请号：US13339100

申请日：2011-12-28

申请人： Si Han Kim

发明人： Si Han Kim

IPC分类号： H01L21/50

CPC分类号： H01L23/49811 ,  H01L21/563 ,  H01L23/49866 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/11332 ,  H01L2224/13011 ,  H01L2224/13075 ,  H01L2224/13139 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/2919 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/81097 ,  H01L2224/81141 ,  H01L2224/81193 ,  H01L2224/8184 ,  H01L2224/83192 ,  H01L2224/921 ,  H01L2924/00013 ,  H01L2924/01029 ,  H01L2924/07802 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2924/00

摘要： A semiconductor package includes a substrate having a connection terminal with a groove on its surface. Nanopowder may be disposed on a bottom of the groove. A semiconductor chip may be flip-chip bonded to the substrate by the nanopowder. A filler member may be interposed between the substrate and the semiconductor chip.

摘要翻译： 半导体封装包括具有在其表面上具有沟槽的连接端子的衬底。 纳米粉末可以设置在凹槽的底部。 半导体芯片可以通过纳米粉末倒装芯片结合到衬底。 可以在衬底和半导体芯片之间插入填充构件。

公开(公告)号：US20130344660A1

公开(公告)日：2013-12-26

申请号：US14011218

申请日：2013-08-27

申请人： International Business Machines Corporation

发明人： Evan G. Colgan ,  Michael A. Gaynes ,  Jeffrey A. Zitz

IPC分类号： H01L21/50

CPC分类号： H01L21/50 ,  H01L23/3128 ,  H01L23/433 ,  H01L24/16 ,  H01L24/32 ,  H01L24/72 ,  H01L24/73 ,  H01L24/90 ,  H01L24/92 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73253 ,  H01L2224/81815 ,  H01L2224/83104 ,  H01L2224/83901 ,  H01L2224/921 ,  H01L2924/10253 ,  H01L2924/15787 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2224/83 ,  H01L2224/90 ,  H01L2924/014

摘要： An assembly process for a heatsink attachment module for a chip packaging apparatus is provided and includes attaching a semiconductor chip to a substrate to form a module subassembly, placing a load frame and shim in a fixture, dispensing adhesive to the load frame and loadably placing the module subassembly chip face down in the fixture.

摘要翻译： 提供了一种用于芯片封装设备的散热器连接模块的组装过程，包括将半导体芯片附接到基板以形成模块子组件，将负载框架和垫片放置在固定装置中，将粘合剂分配到负载框架并且可负载地将 模块组件芯片正面朝下。

公开(公告)号：US20130105994A1

公开(公告)日：2013-05-02

申请号：US13284522

申请日：2011-10-28

申请人： Evan G. Colgan ,  Michael A. Gaynes ,  Jeffrey A. Zitz

发明人： Evan G. Colgan ,  Michael A. Gaynes ,  Jeffrey A. Zitz

IPC分类号： H01L23/48 ,  H01L21/56

CPC分类号： H01L21/50 ,  H01L23/3128 ,  H01L23/433 ,  H01L24/16 ,  H01L24/32 ,  H01L24/72 ,  H01L24/73 ,  H01L24/90 ,  H01L24/92 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73253 ,  H01L2224/81815 ,  H01L2224/83104 ,  H01L2224/83901 ,  H01L2224/921 ,  H01L2924/10253 ,  H01L2924/15787 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2224/83 ,  H01L2224/90 ,  H01L2924/014

摘要： A chip packaging apparatus includes a substrate, a load frame attached to the substrate by an adhesive material, the load frame being formed to define an aperture and a semiconductor chip mounted on the substrate within the aperture. A thickness of the adhesive material between the load frame and the substrate is varied and adjusted such that a surface of the load frame opposite the substrate is disposed substantially in parallel to a surface of the chip opposite the substrate.

摘要翻译： 芯片封装设备包括基板，通过粘合剂材料附接到基板的负载框架，所述负载框架形成为限定孔和安装在孔内的基板上的半导体芯片。 负载框架和基板之间的粘合材料的厚度被改变和调节，使得与基板相对的负载框架的表面基本上平行于与基板相对的芯片的表面平行。

公开(公告)号：US20100159644A1

公开(公告)日：2010-06-24

申请号：US12642445

申请日：2009-12-18

申请人： Rajiv Carl Dunne ,  Marvin Wayne Cowens ,  Mario Antonio Bolanos

发明人： Rajiv Carl Dunne ,  Marvin Wayne Cowens ,  Mario Antonio Bolanos

IPC分类号： H01L21/78 ,  H01L21/60

CPC分类号： H01L24/29 ,  H01L21/563 ,  H01L23/295 ,  H01L24/11 ,  H01L24/13 ,  H01L24/27 ,  H01L24/32 ,  H01L24/73 ,  H01L24/91 ,  H01L24/94 ,  H01L2224/0554 ,  H01L2224/05548 ,  H01L2224/05573 ,  H01L2224/11318 ,  H01L2224/1132 ,  H01L2224/1148 ,  H01L2224/11515 ,  H01L2224/13099 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13116 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/1329 ,  H01L2224/13339 ,  H01L2224/13347 ,  H01L2224/27318 ,  H01L2224/2732 ,  H01L2224/274 ,  H01L2224/27416 ,  H01L2224/27436 ,  H01L2224/27438 ,  H01L2224/27515 ,  H01L2224/27602 ,  H01L2224/27618 ,  H01L2224/29011 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29387 ,  H01L2224/29388 ,  H01L2224/73104 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/81801 ,  H01L2224/8185 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83856 ,  H01L2224/921 ,  H01L2224/94 ,  H01L2224/95 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15787 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： Various exemplary embodiments provide materials and methods for flip-chip packaging technology. The disclosed flip-chip packaging technology can use a single B-stage wafer-applied photo-sensitive adhesive along with printed interconnects, which does not include conventional underfill materials and processes. In one embodiment, a photo-sensitive adhesive can be applied on a semiconductor die or a base substrate with conductive bumps printed in through-openings of the photo-sensitive adhesive. One or more semiconductor dies can be laterally packaged or vertically stacked on the base substrate using the printed conductive bumps as interconnects there-between.

摘要翻译： 各种示例性实施例提供了用于倒装芯片封装技术的材料和方法。 所公开的倒装芯片封装技术可以使用单个B阶晶片施加的光敏粘合剂以及不包括常规底层填充材料和工艺的印刷互连。 在一个实施例中，可以将光敏粘合剂施加在半导体管芯或基底衬底上，其中导电凸块印刷在光敏粘合剂的通孔中。 可以使用印刷的导电凸块作为其间的互连，将一个或多个半导体管芯横向封装或垂直堆叠在基底基板上。