发明申请
- 专利标题： HEATSINK ATTACHMENT MODULE
- 专利标题（中）： HEATSINK附件模块
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申请号： US13284522申请日： 2011-10-28
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公开(公告)号： US20130105994A1公开(公告)日： 2013-05-02
- 发明人: Evan G. Colgan , Michael A. Gaynes , Jeffrey A. Zitz
- 申请人： Evan G. Colgan , Michael A. Gaynes , Jeffrey A. Zitz
- 申请人地址： US NY Armonk
- 专利权人： INTERNATIONAL BUSINESS MACHINES CORPORATION
- 当前专利权人： INTERNATIONAL BUSINESS MACHINES CORPORATION
- 当前专利权人地址： US NY Armonk
- 主分类号： H01L23/48
- IPC分类号： H01L23/48 ; H01L21/56
摘要：
A chip packaging apparatus includes a substrate, a load frame attached to the substrate by an adhesive material, the load frame being formed to define an aperture and a semiconductor chip mounted on the substrate within the aperture. A thickness of the adhesive material between the load frame and the substrate is varied and adjusted such that a surface of the load frame opposite the substrate is disposed substantially in parallel to a surface of the chip opposite the substrate.
公开/授权文献
- US08823164B2 Heatsink attachment module 公开/授权日：2014-09-02
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