发明申请
- 专利标题： METHOD AND APPARATUS FOR MANUFACTURING THREE-DIMENSIONAL INTEGRATED CIRCUIT
- 专利标题（中）： 制造三维集成电路的方法和装置
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申请号： US13258664申请日： 2010-03-10
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公开(公告)号： US20120021563A1公开(公告)日： 2012-01-26
- 发明人: Mitsumasa Koyanagi , Takafumi Fukushima , Masahiko Sugiyama
- 申请人： Mitsumasa Koyanagi , Takafumi Fukushima , Masahiko Sugiyama
- 申请人地址： JP Sendai-shi, Miyagi JP Tokyo
- 专利权人： TOHOKU UNIVERSITY,TOKYO ELECTRON LIMITED
- 当前专利权人： TOHOKU UNIVERSITY,TOKYO ELECTRON LIMITED
- 当前专利权人地址： JP Sendai-shi, Miyagi JP Tokyo
- 优先权： JP2009-070769 20090323
- 国际申请： PCT/JP2010/054031 WO 20100310
- 主分类号： H01L21/50
- IPC分类号： H01L21/50 ; B32B37/14 ; B32B38/00 ; B32B37/12
摘要：
There is provided a three-dimensional integrated circuit manufacturing method for temporarily attaching a chip to a transcription substrate, and securely detaching the chip from the transcription substrate when the chip is transferred to a supporting substrate. When a chip is temporarily attached to a transcription substrate, by evaporating a liquid existing between the chip and the transcription substrate, the solids of the chip and the transcription substrate can be attached to each other. Accordingly, the chip can be temporarily attached to the transcription substrate so as not to be deviated from its own position. Further, by setting adhesive strength between the chip and a supporting substrate to be higher than that between the chip and the transcription substrate, the chip can be securely detached from the transcription substrate when the chip is transferred from the transcription substrate to the supporting substrate.
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