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公开(公告)号：US06518677B1
公开(公告)日：2003-02-11
申请号：US09662641
申请日：2000-09-15
申请人： Miguel A. Capote , Zhiming Zhou , Xiaoqi Zhu , Ligui Zhou
发明人： Miguel A. Capote , Zhiming Zhou , Xiaoqi Zhu , Ligui Zhou
IPC分类号： H01L2348
CPC分类号： H01L24/81 , B23K35/025 , B23K35/3613 , B23K35/3618 , B32B7/12 , C09J4/00 , H01L21/563 , H01L23/293 , H01L23/4334 , H01L23/49827 , H01L23/49883 , H01L24/11 , H01L24/29 , H01L24/83 , H01L2224/0401 , H01L2224/06102 , H01L2224/1147 , H01L2224/1148 , H01L2224/1182 , H01L2224/13099 , H01L2224/13111 , H01L2224/1403 , H01L2224/16105 , H01L2224/16108 , H01L2224/16225 , H01L2224/274 , H01L2224/27436 , H01L2224/27602 , H01L2224/27614 , H01L2224/27618 , H01L2224/29 , H01L2224/29082 , H01L2224/29101 , H01L2224/29111 , H01L2224/2919 , H01L2224/2929 , H01L2224/29299 , H01L2224/29562 , H01L2224/2969 , H01L2224/32225 , H01L2224/73104 , H01L2224/73204 , H01L2224/81011 , H01L2224/81024 , H01L2224/8121 , H01L2224/81815 , H01L2224/83101 , H01L2224/83191 , H01L2224/83192 , H01L2224/83193 , H01L2224/83856 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01018 , H01L2924/0102 , H01L2924/01023 , H01L2924/01025 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01039 , H01L2924/01042 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/01327 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/10253 , H01L2924/12042 , H01L2924/14 , H01L2924/15311 , H01L2924/1579 , H01L2924/3511 , H05K1/095 , H05K3/321 , C08F222/1006 , C08F222/20 , H01L2924/00 , H01L2924/01028 , H01L2924/3512 , H01L2924/00014 , H01L2924/00012 , H01L2224/29099 , H01L2224/29199
摘要： A simplified process for flip-chip attachment of a chip to a substrate is provided by pre-coating the chip with an encapsulant underfill material having separate discrete solder columns therein to eliminate the conventional capillary flow underfill process. Such a structure permits incorporation of remeltable layers for rework, test, or repair. It also allows incorporation of electrical redistribution layers. In one aspect, the chip and pre-coated encapsulant are placed at an angle to the substrate and brought into contact with the pre-coated substrate, then the chip and pre-coated encapsulant are pivoted about the first point of contact, expelling any gas therebetween until the solder bumps on the chip are fully in contact with the substrate. There is also provided a flip-chip configuration having a complaint solder/flexible encapsulant understructure that deforms generally laterally with the substrate as the substrate undergoes expansion or contraction. With this configuration, the complaint solder/flexible encapsulant understructure absorbs the strain caused by the difference in the thermal coefficients of expansion between the chip and the substrate without bending the chip and substrate.
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公开(公告)号：US06297560B1
公开(公告)日：2001-10-02
申请号：US09137971
申请日：1998-08-21
申请人： Miguel A. Capote , Xiaoqi Zhu
发明人： Miguel A. Capote , Xiaoqi Zhu
IPC分类号： H01L2348
CPC分类号： H01L24/81 , B23K35/025 , B23K35/3613 , B23K35/3618 , B32B7/12 , C09J4/00 , H01L21/563 , H01L23/293 , H01L23/4334 , H01L23/49827 , H01L23/49883 , H01L24/11 , H01L24/29 , H01L24/83 , H01L2224/0401 , H01L2224/06102 , H01L2224/1147 , H01L2224/1148 , H01L2224/1182 , H01L2224/13099 , H01L2224/13111 , H01L2224/1403 , H01L2224/16105 , H01L2224/16108 , H01L2224/16225 , H01L2224/274 , H01L2224/27436 , H01L2224/27602 , H01L2224/27614 , H01L2224/27618 , H01L2224/29 , H01L2224/29082 , H01L2224/29101 , H01L2224/29111 , H01L2224/2919 , H01L2224/2929 , H01L2224/29299 , H01L2224/29562 , H01L2224/2969 , H01L2224/32225 , H01L2224/73104 , H01L2224/73204 , H01L2224/81011 , H01L2224/81024 , H01L2224/8121 , H01L2224/81815 , H01L2224/83101 , H01L2224/83191 , H01L2224/83192 , H01L2224/83193 , H01L2224/83856 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01018 , H01L2924/0102 , H01L2924/01023 , H01L2924/01025 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01039 , H01L2924/01042 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/01327 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/10253 , H01L2924/12042 , H01L2924/14 , H01L2924/15311 , H01L2924/1579 , H01L2924/3511 , H05K1/095 , H05K3/321 , C08F222/1006 , C08F222/20 , H01L2924/00 , H01L2924/01028 , H01L2924/3512 , H01L2924/00014 , H01L2924/00012 , H01L2224/29099 , H01L2224/29199
摘要： A simplified process for flip-chip attachment of a chip to a substrate is provided by pre-coating the chip with an encapsulant underfill material having separate discrete solder columns therein to eliminate the conventional capillary flow underfill process. There is also provided a flip-chip configuration having a flexible tape lamination for underfill encapsulation. With this configuration, the complaint solder/flexible encapsulant understructure absorbs the strain caused by the difference in the thermal coefficients of expansion between the chip and the substrate and provides enhanced ruggedness.
摘要翻译： 通过用在其中具有单独的离散焊料柱的密封剂底部填充材料预涂覆芯片来提供芯片与衬底的倒装芯片连接的简化过程，以消除常规毛细管流动底部填充过程。 还提供了一种倒装芯片配置，其具有用于底部填充封装的柔性带层压。 通过这种配置，投诉焊料/柔性密封剂底部结构吸收由芯片和基板之间的热膨胀系数的差异引起的应变，并提供增强的耐用性。
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公开(公告)号：US12040306B2
公开(公告)日：2024-07-16
申请号：US16988919
申请日：2020-08-10
发明人： Jason L. Strader , Michael S. Wladyka , Keith David Johnson , Jingting Yang , Kevin Joel Bohrer , Mark D. Kittel
IPC分类号： H01L21/67 , B32B37/00 , B32B38/00 , B32B38/06 , H01L21/48 , H01L23/00 , H01L23/367 , H01L23/373 , H01L23/552 , B23P15/20 , B23P15/26 , H01L21/683 , H01L31/0203
CPC分类号： H01L24/743 , B32B37/025 , B32B38/0004 , B32B38/06 , H01L21/4882 , H01L21/67132 , H01L23/3675 , H01L23/3737 , H01L23/552 , H01L24/27 , H01L24/97 , B23P15/20 , B23P15/26 , B32B2457/00 , H01L21/6835 , H01L24/73 , H01L31/0203 , H01L2224/27436 , H01L2224/27602 , H01L2224/32245 , H01L2224/83192 , Y10T29/53178 , Y10T29/53265
摘要： A system for applying materials to components generally includes a tool operable for transferring a portion of a material from a supply of the material to a component. The tool may include a resilient material configured for tamping the portion of the material onto the component and imprinting the portion of the material for release and transfer from the supply.
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4.发明申请公开(公告)号：US20020014703A1
公开(公告)日：2002-02-07
申请号：US09935432
申请日：2001-08-20
发明人： Miguel A. Capote , Xiaoqi Zhu
IPC分类号： H01L021/44 , H01L021/48 , H01L021/50 , H01L023/48
CPC分类号： H01L24/81 , B23K35/025 , B23K35/3613 , B23K35/3618 , B32B7/12 , C09J4/00 , H01L21/563 , H01L23/293 , H01L23/4334 , H01L23/49827 , H01L23/49883 , H01L24/11 , H01L24/29 , H01L24/83 , H01L2224/0401 , H01L2224/06102 , H01L2224/1147 , H01L2224/1148 , H01L2224/1182 , H01L2224/13099 , H01L2224/13111 , H01L2224/1403 , H01L2224/16105 , H01L2224/16108 , H01L2224/16225 , H01L2224/274 , H01L2224/27436 , H01L2224/27602 , H01L2224/27614 , H01L2224/27618 , H01L2224/29 , H01L2224/29082 , H01L2224/29101 , H01L2224/29111 , H01L2224/2919 , H01L2224/2929 , H01L2224/29299 , H01L2224/29562 , H01L2224/2969 , H01L2224/32225 , H01L2224/73104 , H01L2224/73204 , H01L2224/81011 , H01L2224/81024 , H01L2224/8121 , H01L2224/81815 , H01L2224/83101 , H01L2224/83191 , H01L2224/83192 , H01L2224/83193 , H01L2224/83856 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01018 , H01L2924/0102 , H01L2924/01023 , H01L2924/01025 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01039 , H01L2924/01042 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/01327 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/10253 , H01L2924/12042 , H01L2924/14 , H01L2924/15311 , H01L2924/1579 , H01L2924/3511 , H05K1/095 , H05K3/321 , C08F222/1006 , C08F222/20 , H01L2924/00 , H01L2924/01028 , H01L2924/3512 , H01L2924/00014 , H01L2924/00012 , H01L2224/29099 , H01L2224/29199
摘要： A simplified process for flip-chip attachment of a chip to a substrate is provided by pre-coating the chip with an encapsulant underfill material having separate discrete solder columns therein to eliminate the conventional capillary flow underfill process. There is also provided a flip-chip configuration having a flexible tape lamination for underfill encapsulation. With this configuration, the complaint solder/flexible encapsulant understructure absorbs the strain caused by the difference in the thermal coefficients of expansion between the chip and the substrate and provides enhanced ruggedness.
摘要翻译： 通过用在其中具有单独的离散焊料柱的密封剂底部填充材料预涂覆芯片来提供芯片与衬底的倒装芯片连接的简化过程，以消除常规毛细管流动底部填充过程。 还提供了一种倒装芯片配置，其具有用于底部填充封装的柔性带层压。 通过这种配置，投诉焊料/柔性密封剂底部结构吸收由芯片和基板之间的热膨胀系数的差异引起的应变，并提供增强的耐用性。
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公开(公告)号：US6121689A
公开(公告)日：2000-09-19
申请号：US120172
申请日：1998-07-21
申请人： Miguel A. Capote , Zhiming Zhou , Xiaoqi Zhu , Ligui Zhou
发明人： Miguel A. Capote , Zhiming Zhou , Xiaoqi Zhu , Ligui Zhou
IPC分类号： B23K35/02 , B23K35/36 , B32B7/12 , C09J4/00 , H01L21/48 , H01L21/56 , H01L21/60 , H01L23/29 , H01L23/433 , H01L23/48 , H01L23/498 , H05K1/09 , H05K3/32 , H01L23/52 , H01L29/40
CPC分类号： H01L24/81 , B23K35/025 , B23K35/3613 , B23K35/3618 , B32B7/12 , C09J4/00 , H01L21/563 , H01L23/293 , H01L23/4334 , H01L23/49827 , H01L23/49883 , H01L24/11 , H01L24/29 , H01L24/83 , H01L2224/0401 , H01L2224/06102 , H01L2224/1147 , H01L2224/1148 , H01L2224/1182 , H01L2224/13099 , H01L2224/13111 , H01L2224/1403 , H01L2224/16225 , H01L2224/274 , H01L2224/27436 , H01L2224/27602 , H01L2224/27614 , H01L2224/27618 , H01L2224/29 , H01L2224/29082 , H01L2224/29101 , H01L2224/29111 , H01L2224/2919 , H01L2224/2929 , H01L2224/29299 , H01L2224/32225 , H01L2224/73104 , H01L2224/73204 , H01L2224/81011 , H01L2224/81024 , H01L2224/8121 , H01L2224/81815 , H01L2224/83101 , H01L2224/83191 , H01L2224/83192 , H01L2224/83193 , H01L2224/83856 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01018 , H01L2924/0102 , H01L2924/01023 , H01L2924/01025 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01039 , H01L2924/01042 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/01327 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/10253 , H01L2924/12042 , H01L2924/14 , H01L2924/15311 , H01L2924/1579 , H01L2924/3511 , H05K1/095 , H05K3/321
摘要： A simplified process for flip-chip attachment of a chip to a substrate is provided by pre-coating the chip with an encapsulant underfill material having separate discrete solder columns therein to eliminate the conventional capillary flow underfill process. Such a structure permits incorporation of remeltable layers for rework, test, or repair. It also allows incorporation of electrical redistribution layers. In one aspect, the chip and pre-coated encapsulant are placed at an angle to the substrate and brought into contact with the pre-coated substrate, then the chip and pre-coated encapsulant are pivoted about the first point of contact, expelling any gas therebetween until the solder bumps on the chip are fully in contact with the substrate. There is also provided a flip-chip configuration having a complaint solder/flexible encapsulant understructure that deforms generally laterally with the substrate as the substrate undergoes expansion or contraction. With this configuration, the complaint solder/flexible encapsulant understructure absorbs the strain caused by the difference in the thermal coefficients of expansion between the chip and the substrate without bending the chip and substrate.
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公开(公告)号：US10020236B2
公开(公告)日：2018-07-10
申请号：US14212985
申请日：2014-03-14
发明人： Tsung-Ding Wang , An-Jhih Su , Chien Ling Hwang , Jung Wei Cheng , Hsin-Yu Pan , Chen-Hua Yu
IPC分类号： H01L23/34 , H01L23/04 , H01L23/42 , H01L23/367 , H01L23/10 , H01L21/56 , H01L23/00 , H01L23/498
CPC分类号： H01L23/04 , H01L21/563 , H01L23/10 , H01L23/3675 , H01L23/42 , H01L23/49816 , H01L24/02 , H01L24/05 , H01L24/11 , H01L24/14 , H01L24/16 , H01L24/17 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/81 , H01L24/83 , H01L2224/023 , H01L2224/04026 , H01L2224/11616 , H01L2224/14181 , H01L2224/16146 , H01L2224/16227 , H01L2224/17181 , H01L2224/26145 , H01L2224/2745 , H01L2224/27452 , H01L2224/27462 , H01L2224/27602 , H01L2224/27616 , H01L2224/27622 , H01L2224/29011 , H01L2224/29124 , H01L2224/29138 , H01L2224/29147 , H01L2224/29166 , H01L2224/29181 , H01L2224/29187 , H01L2224/29191 , H01L2224/2929 , H01L2224/29294 , H01L2224/29309 , H01L2224/29387 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/33181 , H01L2224/33505 , H01L2224/73204 , H01L2224/73253 , H01L2224/81191 , H01L2224/81815 , H01L2224/83007 , H01L2224/83104 , H01L2224/83191 , H01L2224/83192 , H01L2224/83193 , H01L2224/83203 , H01L2224/83815 , H01L2224/83855 , H01L2224/83862 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2225/06548 , H01L2225/06589 , H01L2924/1434 , H01L2924/15153 , H01L2924/15311 , H01L2924/16152 , H01L2924/163 , H01L2924/3511 , H01L2924/00014 , H01L2924/05032 , H01L2924/00012 , H01L2924/01014 , H01L2924/04941 , H01L2924/04953 , H01L2924/05042 , H01L2924/05442
摘要： An apparatus comprising a first substrate, a dam structure disposed on a first side of the first substrate, and an integrated circuit (IC) memory chip coupled to the first side of the first substrate by a plurality of first conductive members. A second substrate is coupled to a second side of the first substrate by a plurality of second conductive members. A lid coupled to the second substrate encloses the IC memory chip and the first substrate. A thermal interface material (TIM) is coupled between the lid and the dam structure.
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7.发明申请LOW-COST FLIP-CHIP INTERCONNECT WITH AN INTEGRATED WAFER-APPLIED PHOTO-SENSITIVE ADHESIVE AND METAL-LOADED EPOXY PASTE SYSTEM 审中-公开低成本的片芯互连与一体化的应用光敏粘合剂和金属负载的环氧树脂系统公开(公告)号：US20100159644A1
公开(公告)日：2010-06-24
申请号：US12642445
申请日：2009-12-18
CPC分类号： H01L24/29 , H01L21/563 , H01L23/295 , H01L24/11 , H01L24/13 , H01L24/27 , H01L24/32 , H01L24/73 , H01L24/91 , H01L24/94 , H01L2224/0554 , H01L2224/05548 , H01L2224/05573 , H01L2224/11318 , H01L2224/1132 , H01L2224/1148 , H01L2224/11515 , H01L2224/13099 , H01L2224/13109 , H01L2224/13111 , H01L2224/13116 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/1329 , H01L2224/13339 , H01L2224/13347 , H01L2224/27318 , H01L2224/2732 , H01L2224/274 , H01L2224/27416 , H01L2224/27436 , H01L2224/27438 , H01L2224/27515 , H01L2224/27602 , H01L2224/27618 , H01L2224/29011 , H01L2224/29101 , H01L2224/2919 , H01L2224/2929 , H01L2224/29387 , H01L2224/29388 , H01L2224/73104 , H01L2224/73203 , H01L2224/73204 , H01L2224/81191 , H01L2224/81192 , H01L2224/81801 , H01L2224/8185 , H01L2224/83191 , H01L2224/83192 , H01L2224/83856 , H01L2224/921 , H01L2224/94 , H01L2224/95 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/09701 , H01L2924/14 , H01L2924/1461 , H01L2924/15787 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： Various exemplary embodiments provide materials and methods for flip-chip packaging technology. The disclosed flip-chip packaging technology can use a single B-stage wafer-applied photo-sensitive adhesive along with printed interconnects, which does not include conventional underfill materials and processes. In one embodiment, a photo-sensitive adhesive can be applied on a semiconductor die or a base substrate with conductive bumps printed in through-openings of the photo-sensitive adhesive. One or more semiconductor dies can be laterally packaged or vertically stacked on the base substrate using the printed conductive bumps as interconnects there-between.
摘要翻译： 各种示例性实施例提供了用于倒装芯片封装技术的材料和方法。 所公开的倒装芯片封装技术可以使用单个B阶晶片施加的光敏粘合剂以及不包括常规底层填充材料和工艺的印刷互连。 在一个实施例中，可以将光敏粘合剂施加在半导体管芯或基底衬底上，其中导电凸块印刷在光敏粘合剂的通孔中。 可以使用印刷的导电凸块作为其间的互连，将一个或多个半导体管芯横向封装或垂直堆叠在基底基板上。
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公开(公告)号：US20030218261A1
公开(公告)日：2003-11-27
申请号：US10390603
申请日：2003-03-19
申请人： M. A. Capote
发明人： Miguel A. Capote , Zhiming Zhou , Xiaoqi Zhu , Ligui Zhou
IPC分类号： H01L023/28
CPC分类号： H01L24/81 , B23K35/025 , B23K35/3613 , B23K35/3618 , B32B7/12 , C09J4/00 , H01L21/563 , H01L23/293 , H01L23/4334 , H01L23/49827 , H01L23/49883 , H01L24/11 , H01L24/29 , H01L24/83 , H01L2224/0401 , H01L2224/06102 , H01L2224/1147 , H01L2224/1148 , H01L2224/1182 , H01L2224/13099 , H01L2224/13111 , H01L2224/1403 , H01L2224/16105 , H01L2224/16108 , H01L2224/16225 , H01L2224/274 , H01L2224/27436 , H01L2224/27602 , H01L2224/27614 , H01L2224/27618 , H01L2224/29 , H01L2224/29082 , H01L2224/29101 , H01L2224/29111 , H01L2224/2919 , H01L2224/2929 , H01L2224/29299 , H01L2224/29562 , H01L2224/2969 , H01L2224/32225 , H01L2224/73104 , H01L2224/73204 , H01L2224/81011 , H01L2224/81024 , H01L2224/8121 , H01L2224/81815 , H01L2224/83101 , H01L2224/83191 , H01L2224/83192 , H01L2224/83193 , H01L2224/83856 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01018 , H01L2924/0102 , H01L2924/01023 , H01L2924/01025 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01039 , H01L2924/01042 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/01327 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/10253 , H01L2924/12042 , H01L2924/14 , H01L2924/15311 , H01L2924/1579 , H01L2924/3511 , H05K1/095 , H05K3/321 , C08F222/1006 , C08F222/20 , H01L2924/00 , H01L2924/01028 , H01L2924/3512 , H01L2924/00014 , H01L2924/00012 , H01L2224/29099 , H01L2224/29199
摘要： A simplified process for flip-chip attachment of a chip to a substrate is provided by precoating the chip with an encapsulant underfill material having separate discrete solder columns therein to eliminate the conventional capillary flow underfill process. Such a structure permits incorporation of remeltable layers for rework, test, or repair. It also allows incorporation of electrical redistribution layers. In one aspect, the chip and pre-coated encapsulant are placed at an angle to the substrate and brought into contact with the pre-coated substrate, then the chip and pre-coated encapsulant are pivoted about the first point of contact, expelling any gas therebetween until the solder bumps on the chip are fully in contact with the substrate. There is also provided a flip-chip configuration having a complaint solder/flexible encapsulant understructure that deforms generally laterally with the substrate as the substrate undergoes expansion or contraction. With this configuration, the complaint solder/flexible encapsulant understructure absorbs the strain caused by the difference in the thermal coefficients of expansion between the chip and the substrate without bending the chip and substrate.
摘要翻译： 通过使用具有分离的分离焊料柱的密封剂底部填充材料预涂芯片来提供芯片与衬底的倒装芯片连接的简化过程，以消除常规毛细管流动底部填充过程。 这种结构允许结合用于返工，测试或修理的可重熔层。 它还允许并入电再分布层。 在一个方面，将芯片和预包封的密封剂与衬底成角度地放置并与预涂覆的衬底接触，然后将芯片和预包封的密封剂围绕第一接触点枢转，排出任何气体 直到芯片上的焊料凸块与基板完全接触。 还提供了倒装芯片配置，其具有投诉焊料/柔性密封剂底部结构，当衬底经历膨胀或收缩时，其基本上横向变形。 通过这种配置，投诉焊料/柔性密封剂底部结构吸收由芯片和基板之间的热膨胀系数的差异引起的应变，而不会使芯片和基板弯曲。
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公开(公告)号：US09653623B2
公开(公告)日：2017-05-16
申请号：US14956382
申请日：2015-12-01
发明人： Yi-Koan Hong , Yeun-Sang Park , Byung-Lyul Park , Joo-Hee Jang
IPC分类号： H01L31/02 , H01L31/0232 , H01L23/00
CPC分类号： H01L31/02005 , H01L24/05 , H01L24/06 , H01L24/29 , H01L24/30 , H01L24/32 , H01L24/80 , H01L24/83 , H01L24/91 , H01L31/02327 , H01L2224/04026 , H01L2224/05547 , H01L2224/05557 , H01L2224/05647 , H01L2224/0603 , H01L2224/06051 , H01L2224/06505 , H01L2224/06517 , H01L2224/08121 , H01L2224/08147 , H01L2224/27416 , H01L2224/27602 , H01L2224/29011 , H01L2224/29013 , H01L2224/29014 , H01L2224/29022 , H01L2224/2929 , H01L2224/30051 , H01L2224/3013 , H01L2224/3014 , H01L2224/3015 , H01L2224/3016 , H01L2224/32147 , H01L2224/80895 , H01L2224/80896 , H01L2224/80903 , H01L2224/83193 , H01L2224/8388 , H01L2924/00014
摘要： In a method for fabricating a semiconductor, a first conductive pattern structure partially protruding upwardly from first insulating interlayer is formed in first insulating interlayer. A first bonding insulation layer pattern covering the protruding portion of first conductive pattern structure is formed on first insulating interlayer. A first adhesive pattern containing a polymer is formed on first bonding insulation layer pattern to fill a first recess formed on first bonding insulation layer pattern. A second bonding insulation layer pattern covering the protruding portion of second conductive pattern structure is formed on second insulating interlayer. A second adhesive pattern containing a polymer is formed on second bonding insulation layer pattern to fill a second recess formed on second bonding insulation layer pattern. The first and second adhesive patterns are melted. The first and second substrates are bonded with each other so that the conductive pattern structures contact each other.
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公开(公告)号：US20150262900A1
公开(公告)日：2015-09-17
申请号：US14212985
申请日：2014-03-14
发明人： Tsung-Ding Wang , An-Jhih Su , Chien Ling Hwang , Jung Wei Cheng , Hsin-Yu Pan , Chen-Hua Yu
CPC分类号： H01L23/04 , H01L21/563 , H01L23/10 , H01L23/3675 , H01L23/42 , H01L23/49816 , H01L24/02 , H01L24/05 , H01L24/11 , H01L24/14 , H01L24/16 , H01L24/17 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/81 , H01L24/83 , H01L2224/023 , H01L2224/04026 , H01L2224/11616 , H01L2224/14181 , H01L2224/16146 , H01L2224/16227 , H01L2224/17181 , H01L2224/26145 , H01L2224/2745 , H01L2224/27452 , H01L2224/27462 , H01L2224/27602 , H01L2224/27616 , H01L2224/27622 , H01L2224/29011 , H01L2224/29124 , H01L2224/29138 , H01L2224/29147 , H01L2224/29166 , H01L2224/29181 , H01L2224/29187 , H01L2224/29191 , H01L2224/2929 , H01L2224/29294 , H01L2224/29309 , H01L2224/29387 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/33181 , H01L2224/33505 , H01L2224/73204 , H01L2224/73253 , H01L2224/81191 , H01L2224/81815 , H01L2224/83007 , H01L2224/83104 , H01L2224/83191 , H01L2224/83192 , H01L2224/83193 , H01L2224/83203 , H01L2224/83815 , H01L2224/83855 , H01L2224/83862 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2225/06548 , H01L2225/06589 , H01L2924/1434 , H01L2924/15153 , H01L2924/15311 , H01L2924/16152 , H01L2924/163 , H01L2924/3511 , H01L2924/00014 , H01L2924/05032 , H01L2924/00012 , H01L2924/01014 , H01L2924/04941 , H01L2924/04953 , H01L2924/05042 , H01L2924/05442
摘要： An apparatus comprising a first substrate, a dam structure disposed on a first side of the first substrate, and an integrated circuit (IC) memory chip coupled to the first side of the first substrate by a plurality of first conductive members. A second substrate is coupled to a second side of the first substrate by a plurality of second conductive members. A lid coupled to the second substrate encloses the IC memory chip and the first substrate. A thermal interface material (TIM) is coupled between the lid and the dam structure.
摘要翻译： 一种装置，包括第一基板，设置在第一基板的第一侧上的坝结构以及通过多个第一导电构件耦合到第一基板的第一侧的集成电路（IC）存储芯片。 第二衬底通过多个第二导电构件耦合到第一衬底的第二侧。 耦合到第二基板的盖子封装IC存储器芯片和第一基板。 热界面材料（TIM）连接在盖和坝结构之间。
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